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MEMS @ MIT Overview_图文


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MEMS @ MIT Overview
Prof. Martin A. Schmidt Fall 2007 www.mtl.mit.edu/mems
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MEMS @ MIT ‘At a Glance’
? Community
– ~30 Faculty – ~135 Students and staff – ~$15M $15M Annual Sponsorship (Federal and Industrial)

? Major Thrusts
– – – – Materials, Processes, and Devices for MEMS Biological and Chemical MEMS Actuators and Power MEMS Sensors, , Systems, y , and Modeling g

? Established as an ‘internal’ community in 2000 ? Launched industrial membership in 2006
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MEMS @ MIT Faculty
? ? ? ? ? ? ? ? ? ? ? ? ? ? ? A.I. Akinwande (EECS) G Barbastathis (MechE) G. M. Bazant (Math) S. Bhatia (HST/EECS) D Boning (EECS) D. A. Chandrakasan (EECS) G. Chen (MechE) M. Culpepper p pp (MechE) ( ) P. Doyle (ChemE) A. Epstein (Aero/Astro) D. Freeman (EECS) M. Gray (HST/EECS) J. Han (BioEng/EECS) K. Jensen (ChemE/MatSci) R Kamm (MechE) R. ? ? ? ? ? ? ? ? ? ? ? ? ? ? ? R. Karnik (MechE) S G Kim (MechE) S.G. J.H. Lang (EECS) C. Livermore (MechE) S Manalis (BioEng/MechE) S. D.J. Perreault (EECS) M.A. Schmidt (EECS) A. Slocum ( (MechE) ) C.V. Thompson (MatSci) T. Thorsen (MechE) J. Voldman (EECS) E. Wang (MechE) B. Wardle (Aero/Astro) J. White (EESC) F Yanik (EECS) F.

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MEMS@MIT Industrial Consortium

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MEMS @ MIT Industrial ‘Value Proposition’ P iti ’
? ? ? ? ? Provide early insight to research activities and results Provide preferred access to MIT personnel engaged in MEMS research Create a gateway to collaborative research partnerships
– Funded by y industry, y g government, or foundations – Providing specific IP benefits

Establish a forum for exchange of ideas on new areas and technology/industry trends Facilitate technology transfer
– Visits – IP Briefings – Reports, Theses

?

Provide an exclusive portal for MEMS information
– Streaming seminars – Publications

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Research Overview

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Major Research Themes
? Materials, Processes, and Devices for MEMS
– Piezoelectrics, Magnetics, Materials/Package Reliability, DRIE, Wafer Bonding, Plastic Fab, Printed MEMS

? Biological and Chemical MEMS
– Cell Manipulation, DNA and Protein Processing, Biomolecule Detection, Medical Sensors, Microreactors, Micro Gas Analyzers, Analyzers Microfluidics

? Actuators and Power MEMS
– Switches, Mirrors, Pumps, Turbines, Fuel Cells, Th Thermophotovoltaics, h t lt i Ch i l L Chemical Lasers, E Energy H Harvesting ti

? Sensors, Systems, and Modeling
– Wireless Sensors, Pressure Sensing Systems, MEMCAD
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Biology
? ? ? ? ? Tissue Engineering Fermentation Cell Manipulation DNA Sorting Protein Detection
Manalis

Han

Voldman

Bhatia

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Chemical/Microfluidics
? Synthesis
– Microreactors for Quantum Dots

? Screening S i
– Catalysts – Pharma

? Lab-on-a-Chip
– Detection

? Large L A Array P Processors

Jensen

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Power MEMS
? Energy Scavenging
– Vibration – Heel-Strike

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Fuel Processing
– – – – ThermoPhotoVoltaic ThermoElectric MicroFuel Cells MicroTurbines
Epstein

Jensen

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Rockets

Spearing/Schmidt

Epstein

Kim/Wardle
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Optical
? ? ? Tunable Filt /G ti Filters/Gratings/Resonators /R t Mirrors Optical Sensors
tunable diffraction pattern

flexures comb drive grating beams
white light

grating

actuation (electro-static or piezo-electric) Kim/Barbastathis

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CAD/Modeling
? MEMCAD
– Computationally-Efficient Algorithms – Coupled Simulations
? Electro-Fluid-Mechanical ? Magnetic M ti White/Daniel

– Macromodels

?

ElectroHydrodynamics

White/Daniel

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Bazant

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Devices
? ? ? ? ? Sensors Actuators
– Switches
Slocum

Valves Power Components RF MEMS
– Tunable Capacitors

Akinwande

Slocum Perreault
500m μ

Kim

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Chipset for Wireless Sensor Networks (Chandrakasan)
ADC DSP RF

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SAR ADC ? Scalable rate (0-100KS/s) ( ) and precision (12b & 8b) ? 25μW at 100kS/s

Sensor DSP ?16-bit programmable DSP with FFT (128 (128-1024 1024 points) ?100μW at 0.5V

Low-Rate RF ?On-Off Keying using a rectification based receiver ?Rx Energy: 1-3 nJ/bit
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N. Verma (ADC), D. Finchelstein and N. Ickes (DSP), D. Daly (RF)

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Integrated Node (Chandrakasan)

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Technology
? ? ? ? ? ? ? ? DRIE
– Thru-wafer Interconnect

Wafer W f Bonding B di Plastic Fab Piezoelectrics High T Materials
– SiC

Thin Film Stress MEMCAD Packaging

Boning

Livermore
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New Initiatives
? Center on Non-lithographic Fabrication of MEMS/NEMS
– $1 $1.75M/year 75M/ effort ff t i involving l i MIT MIT, O Oregon St State, t and d HP – Leverage HP printing technology into large area, low cost, rapid MEMS farbication

?

Hybrid Insect MEMS (HIMS)
– Collaboration of MIT, University of Arizona, and University of Washington – Hybrid integration of MEMS with insects for autonomous flight
? Drives research in energy harvesting, low power devices (circuits,MEMS)

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Industrial Membership

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