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南亚PN&HF材料介绍20110108_图文

Nan Ya CCL

Nan Ya Multilayer PCB Laminates

CCL Technical Dept., Electronic Materials Div. Nan Ya Plastics Corporation TAIWAN

Nan Ya CCL

產品開發與應用
Signal Speed&Integrity
?NPLDII & Low Dk glass ?Embedded Capacitance Impedance Control ?Ultra thin glass yarn Embedded Passives 1037 ?2 mil & 3 mil Cores High Layer Count

?NP-200 (BT Grade) ? NP-180F (Hi Tg & Low Dk/Low Loss
Low CTE)

Hi Tg Lead Free Compatible

Insulation

? NP-175(F) ? NP-155(F) ? NP-170
Reliability

Smaller Form Factor
Narrower Line Spacing

PCB Tech Trends
CAF-Resistant Low CTE Flexible Low Water Absorption Halogen Free

? NP-140M ? Anti-CAF
Materials ? High CTI FR4

? NP-150

? Laser Prepreg ? RCC

Build up/HDI

(Low Tg/Hi Td)

Phosphorous Free ? Bendable CCL ? NPX-200 (For Substrates)

? NPG
NPGN-150 NPG-170 NPGN-170

Environmental Protection

Nan Ya CCL

南亞產品列表
TG ? NP-200 BT Laminate IC Substrates 200 ℃ BT Laminate (H.F) IC Substrate High Tg(H.F) high layer count MLB IC Substrate NPG-200 ◎ FR-5 Grade ? NP-180/F high layer count MLB IC Substrate ? NP-175/F FR-4 Grade O NP-170 high layer Count MLB ? NP-155/F High performance FR-4 O NP-150 Special application

180

NPG-180 ◎

175

High Tg (H.F) high layer count MLB

NPG-170 ◎ NPG ◎ NPGN-150

150
140

Halogen Free FR-4
Laser drillable prepreg for HDI Resin coated copper for HDI Low Dk/Df High frequency/low loss

? NP-140M FR-4 Tetra-functional O NP-140 for MLB
O FR-4 D/S FR-4-86 UV FR-4-98 CTI 600 O O

Laser PP

135

180

RCC

CEM-3 CEM-1
?Tg by DSC

CEM-3-86/ CEM-3-01 Halogen free CEM-1-87/ CEM-1-97 CTI600

130

180

NP-LDII

?Suitable for Lead Free

Optional for Lead Free

◎NPG(Halogen Free)

Nan Ya CCL

印刷電路板(PCB) 應用
NP-200

BGA, CSP BGA, CSP, 汽車網絡服務器

NPG-200

BGA, CSP BGA, CSP, 網絡服務器 個人電腦& 筆記本 電腦磁盤驅動器 基站

NP-180

NPG-180

NP-175(F) NP-170

通信服務器

NPGN NPG

NP-155(F) NP-150

個人電腦,笔记本 电脑 PCMCIA卡 個人電腦, 筆記本 電腦,個人電腦外 設 個人電腦, 筆記本 電腦 ,個人電腦外 設

NP-LD

NP-140M NP-140

RCC Laser P.P

移动电话 HDI产品
电源供应器,监视 器,电视游戏

FR-4

CEM-1 CEM-3

Nan Ya CCL

? “無鉛”對元件組裝影響
●無鉛組裝之焊錫材料熔點更高 ●回流焊過程有更高的溫度曲線
焊錫類型 高溫. 較高溫度. Sn-Ag-Cu (96.5 3 0.3) Sn-Ag-CuBi(in) Pb-Sn (33 67) 熔點(℃) 217~220 210~220 I.R 最高溫度 (℃) 245~260 235~245

一般

183

225~230

Nan Ya CCL

迴流焊溫度曲線比較
Lead free reflow (SnAgCu)

Tin/Lead(63/37) reflow

?T:20-30℃ Peak Temp

250
LF Melting point

200

Melting point
?T:30-44℃



150
100 50

Soak time
Ramp up rate

0

Time above liquidus (TAL)

Nan Ya CCL

高耐熱性(Br-樹脂)覆銅板產品系列
TG(℃)
NP-200

BT Laminate

200

High Thermal Stability Material

NP-180

FR-5 Grade

180

NP-180(F)

NP-170

High Tg FR-4

175

NP-175 NP-175F NP-155 NP-155F NP-140 Modify(New)

NP-150

Medium Tg FR-4

150

NP-140

FR-4

140

Nan Ya CCL

FR-4, NP-155F,NP-175F 特性比對
NP-140 Thickness (mm) DSC Tg 1.6 135℃ NP170 1.6 171 ℃ NP140M 1,6 135 ℃ NP-155F 1.6 155℃ NP-175F 1.6 170℃

Peel Strength (1oz)
1/2hr PCT moisture 1/2hr PCT+288℃ solder dipping Z-axis α1/ ppm/℃ Z-axis α2/ ppm/℃ CTE 50-260℃ % T-288 delamination T-260 delamination TGA Td (on set) TGA 5% Wt Loss

12.5
0.226% 3’30” 67.1 288.0 4.3 2.07 min 25.03 min 309.2℃ 311.3℃

10.5
0.19 4’30” 60 285 3.7 2~5 25~30 311 ℃ 312.2 ℃

11.5
0.210 10” 65 289 4.3 >5min >30min 323.5 ℃ 325.9 ℃

9.5
0.15% 10’ 48.3 256.5 3.3 > 30 min >60 min 357℃ 360℃

9.5
0.147% 10’ 49.5 259.7 3.1 > 30 min >60 min 359℃ 361℃

Nan Ya CCL

IPC 規范 vs Nan Ya 材料
Spec Sheet # Tg min(℃) Td min(℃) Fillers Flame retardant Curing Agent Flammability Z-Axis alpha 1 max Z-Axis alpha 2 max % max(50-260℃) T-260(min) T-288(min) T-300(min) 99 150 325 yes RoHS BR N/A V-0 60 300 3.5 30 5 AABUS 101 110 310 yes RoHS BR N/A V-0 60 300 4.0 30 5 AABUS 121 110 310 no RoHS BR N/A V-0 60 300 4.0 30 5 AABUS 124 150 325 no RoHS BR N/A V-0 60 300 3.5 30 5 AABUS 126 170 340 yes RoHS BR N/A V-0 60 300 3.0 30 15 2 129 170 340 no RoHS BR N/A V-0 60 300 3.0 30 15 2

Nan Ya Material

NP155F

NP155F

NP140 (Modify)

NP155

NP175F NP180F

NP175 NP180

Nan Ya CCL

南亚各系列无卤材料特性比較
Item Resin system Curing agent Tg (℃,DSC) CTE (%, 50~250℃) T-260 (min) FR4 Br. Epoxy Dicy 140 4.1 25 NPG Halogen Free Dicy 150 2.4 >60 NPGN-150 Halogen Free Non Dicy 145(TMA) 2.4 >60 NPG-170 Halogen Free Dicy 170 2.3 >60 NPGN-170 Halogen Free Non Dicy 170 2.4 >60 NPG-180 Halogen Free Non Dicy 190(DMA) 2.2 >60 NPG-200 Halogen Free Non Dicy 205(DMA) 2.0 >60

T-288 (min)
Td (℃,TGA) Dk (@1GHz) Df (@1GHz)

2
310 4.50 0.016

>5
350 4.60 0.012

>20
360 4.50 0.013

>5
359 4.60 0.012

>20
360 4.53 0.013

>40
367 4.82 0.015

>40
370 4.40 0.013

Rigid construction: 4 ply 7628 NPG: “G” for Green (HF) Materials

Nan Ya CCL

HATS冷热冲击测试结果
Test Condition:-40-145 ℃/1000 cycles Sample:12-layer test vehicle Material A condition Pre-condition Pre-condition 260℃ reflowx6 142-227

245℃ reflowx6
一般材料
Mid-Tg PN +填充材 Hi-Tg PN +填充材

162-247

150-266

>1000 >1000 >1000

>1000 >1000 >1000

800-900 >1000 >1000

无卤材料

Nan Ya CCL

热膨胀特性

Expansion, PPM/℃

一般材料
15~18
15~18 58

PN FR4+填充材

Hi Tg无卤材料

X-CTE
Y-CTE Z-CTE, Before Tg

13~15
13~15 45

11~13
11~13 35.3

Z-CTE, After Tg

287

260

210

Nan Ya CCL

印刷线路板加工条件之建议
线路板加工之影响
一般材料
钻孔 2,000钻

无卤材料
1,500钻

除渣 黑棕化药水
压合

OK OK
操作空间較广

需调整制程条件 接着力较低
需调整制程条件

Nan Ya CCL

NPG&NPGN-150鑽孔比對測試
钻孔条件
Machine Schmoll LZ Hole siz 0.30mm Speed 160 Kr/min Infeed 134 IPM RTR 437 IPM Thk 1.6 PNL/Stsck 2 ply

钻头磨损比较
1000 hit
NPG NPGN-150

2000 hit 30.72% 27.32%

3000 hit 36.52% 32.93%

Total (48000 hit) 30.56% 28.51%

24.46% 25.28%

Nan Ya CCL

钻孔精度比較
NPG Cp/Cpk Target ( > 2.0 mil ) 2.75% 1.37% 1.334/0.785 NPGN-150 1.859/1.204

1325/48098

660/48104

Nan Ya CCL

钻头磨耗比较

新钻头

FR4

PN+填充材

无卤材料

条件
Rpm:200K IPM:114.2

Hits:3500
Hole size:10 mil

Nan Ya CCL

无卤材料内层黑棕化接着强度比较
Unit: lb/in
Black Oxide Chemical A Material types Standard FR4 4.93 3.85 4.56 3.57 B Brown Oxide C D

NPG

3.23

3.12

3.01

2.74

NPGN-150

3.69

3.46

3.59

3.12

Nan Ya CCL

無鹵材性能比較表-CCL

Nan Ya CCL

無鹵材性能比較表-PCB
NPG(Dicy)
PCB Thickness DSC-Tg 288 ℃ Solder floating 10” 260 ℃ IR Reflow cycles Layer mm ℃ 10L 1.8-2.0 155 >6 cycles 6-7 cycles

NPGN-150(PN)
14L 2.4-2.5 150.6 >10 cycles >10 cycles

T-260
T-288 PCB Thickness DSC-Tg 260 ℃ IR reflow cycles

min
min Layer mm ℃ -

8.58
2.25 2+4+2 1.0 156.8 10-12

24.06
8.68 3+2+3 0.8 150.5 >15

T-260
T-288

min
min

25.42‘
2-5‘

>30‘

Nan Ya CCL

南亞無鹵材市場應用狀況
PRODUCTS APPLICATIONS
PC-Desktop (4-layer motherboard) Mobile PC-Notebook (8~10-layer)

NPG, NPGN-150 Series (Middle Tg 150℃)

Mobile Phone (4~8-layer) LCD TV (4-layer motherboard) Hard Disk-HDD (4-layer motherboard) Basestation (12-layer;Nordic brandname)

NPG-170, NPGN-170 Series (High Tg 170℃ )

Network basestation (14-layer;Nordic brandname) Server (12~20-layer) Backplanes (12~26-layer) IC Substrate CPU - Flip Chip Graphic - Flip Chip DDR II Chip Set

NPG-180 & NPG-200 Series (High Tg 180℃ & 200℃ )

Nan Ya CCL

謝謝指教
http://www.npc.com.tw


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