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INTEGRATED CIRCUITS

DATA SHEET

TDA7040T Low voltage PLL stereo decoder
Product specication File under Integrated Circuits, IC01 September 1986

Philips S

emiconductors

Product specication

Low voltage PLL stereo decoder
GENERAL DESCRIPTION

TDA7040T

The TDA7040T is a monolithic integrated circuit for low cost FM stereo radios with an absolute minimum of peripheral components and a simple lay-out. Features Built-in four pole low pass filter with a 70 kHz corner frequency suppressing unwanted out-of-band input signals Fully integrated 228 kHz oscillator Pilot presence detector and soft mono/stereo blend Built-in interference suppression External stereo lamp driver applicable Adjustable gain. QUICK REFERENCE DATA PARAMETER Supply voltage (pin 4) Supply current VP = 3 V Total harmonic distortion Signal to noise ratio Channel separation PACKAGE OUTLINE 8-lead mini-pack; plastic (S08; SOT96A); SOT96-1; 1996 July 24. IP THD S/(S + N) α SYMBOL VP MIN. 1,8 3 0,3 70 40 TYP. 6 MAX. V mA % dB dB UNIT

September 1986

2

Philips Semiconductors

Product specication

Low voltage PLL stereo decoder

TDA7040T

Fig.1 Block diagram.

RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) PARAMETER Supply voltage range Operating ambient temperature Storage temperature range SYMBOL VP Tamb Tstg 10 55 MIN. TYP. 7 + 70 + 150 MAX. V °C °C UNIT

September 1986

3

Philips Semiconductors

Product specication

Low voltage PLL stereo decoder
CHARACTERISTICS VP = 3 V; Tamb = 25 °C; test circuit Fig.2; unless otherwise specied PARAMETER Supply voltage (pin 4) Supply current Output voltage (r.m.s. value) Vi(rms) L and R 120 mV; f = 1 kHz Channel balance Vi(rms) L and R 40mV; f = 1 kHz Output resistance Total harmonic distortion Vi(rms) L and R 40 mV; f = 1 kHz Total harmonic distortion Vi(rms) L and R 40 mV; f = 1 kHz; Vp(rms) = 12 mV Signal-to-noise ratio Vi(rms) = 120 mV; f = 1 kHz Signal-to-noise ratio Vi(rms) = 120 mV; f = 1 kHz Vp(rms) = 12 mV Channel separation Vi(rms) L and R 40 mV; f = 1 kHz; Vp(rms) = 12 mV Capture range Vp(rms) = 12 mV; deviation from centre frequency Carrier leak Vi(rms) L and R 120 mV; Vp(rms) = 12 mV; f = 1 kHz; f = 19 kHz f = 38 kHz SCA (Subsidiary Communications Authorization) rejection Vi(rms) L and R 120 mV; Vp(rms) = 12 mV; f = 1 kHz; VSCA(RMS) = 12 mV; f = 67 kHz α67 70 30 50 f ±3 α 40 S/(S + N) 70 S/(S + N) 70 THD 0,3 THD 0,1 Gv RO 0 5 1 V5, 6-1 240 IP SYMBOL VP MIN. 1,8 3 TYP. 3,0 4

TDA7040T

MAX. 6,0 V

UNIT mA

mV

dB k

%

% dB

dB

dB

%

dB dB

dB

September 1986

4

Philips Semiconductors

Product specication

Low voltage PLL stereo decoder

TDA7040T

PARAMETER ACI (Adjacent channel interference) Vi(rms) L and R 120 mV; Vp(rms) = 12 mV; f = 1 kHz; VACI(RMS) = 1,3 mV; f = 114 kHz VACI(RMS) = 1,3 mV; f = 190 kHz Trafc radio (V.W.F.) suppression V o ( signal ) ( at 1 kHz ) α 57 ( VWF ) = ------------------------------------------------------------------------------------V o ( spurious ) ( at 1 kHz ± 23 Hz ) measured with: 91% stereo signal; fm = 1 kHz; 9% pilot signal; 5% trafc subcarrier (f = 57 kHz, fm = 23 Hz AM, m = 60%)

SYMBOL

MIN.

TYP.

MAX.

UNIT

α114 α119 α57(VWF)



90 85 75



dB dB dB

Fig.2 Test circuit.

September 1986

5

Philips Semiconductors

Product specication

Low voltage PLL stereo decoder

TDA7040T

Fig.3 Application diagram in combination with TDA7021T and TDA7050T.

September 1986

6

Philips Semiconductors

Product specication

Low voltage PLL stereo decoder
CHARACTERISTICS

TDA7040T

Of the combination TDA7021T, TDA7040T and TDA7050T (Fig.3). Conditions unless otherwise specied: Vvhf(rms) = 1 mV; fhf = 97 MHz; fdev = 22,5 kHz; fdev pilot = 6,75 kHz; noise measured unweighted in a range from 400 Hz to 15 kHz. PARAMETER Total harmonic distortion (pilot on) Vi = (L + R) signal; fmod = 1 kHz Vi = L signal; fmod = 1 kHz Signal to noise ratio Vi = (L + R) signal; fmod = 1 kHz pilot off pilot on Channel separation Vi = L-signal, fmod = 1 kHz; pilot on; fRF = 97 MHz Vi = L-signal, fmod = 1 kHz; pilot on; fRF = 87,5 MHz and 108 MHz Output voltage (pilot off) Vi = (L + R) signal, fmod = 1 kHz Vo(rms) 80 mV α 14 dB α 26 dB S/(S + N) S/(S + N) 56 50 dB dB THD THD 0,5 1,0 % % SYMBOL MIN. TYP. MAX. UNIT

a = measured in test circuit (Fig.2) b = measured in application diagram (Fig.3)

Fig.4 Channel separation as a function of audio frequency.

September 1986

7

Philips Semiconductors

Product specication

Low voltage PLL stereo decoder

TDA7040T

Fig.5

Signal/noise and channel separation behaviour in Fig.3. at R1 = 270 k and R2 = 13 k; without diode BAW62.

Fig.6

Signal/noise and channel separation behaviour in Fig.3. at R1 = 200 k, R2 = 30 k; with diode BAW62.

September 1986

8

Philips Semiconductors

Product specication

Low voltage PLL stereo decoder
PACKAGE OUTLINE SO8: plastic small outline package; 8 leads; body width 3.9 mm

TDA7040T

SOT96-1

D

E

A X

c y HE v M A

Z 8 5

Q A2 A1 pin 1 index θ Lp 1 e bp 4 w M L detail X (A 3) A

0

2.5 scale

5 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 5.0 4.8 0.20 0.19 E (2) 4.0 3.8 0.16 0.15 e 1.27 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 Q 0.7 0.6 v 0.25 0.01 w 0.25 0.01 y 0.1 Z (1) 0.7 0.3 θ

0.010 0.057 0.069 0.004 0.049

0.019 0.0100 0.014 0.0075

0.244 0.039 0.028 0.050 0.041 0.228 0.016 0.024

0.028 0.004 0.012

8 0o

o

Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT96-1 REFERENCES IEC 076E03S JEDEC MS-012AA EIAJ EUROPEAN PROJECTION

ISSUE DATE 95-02-04 97-05-22

September 1986

9

Philips Semiconductors

Product specication

Low voltage PLL stereo decoder
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Reow soldering Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C. Wave soldering Wave soldering techniques can be used for all SO packages if the following conditions are observed: A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. The longitudinal axis of the package footprint must be parallel to the solder flow. The package footprint must incorporate solder thieves at the downstream end.

TDA7040T
During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Repairing soldered joints Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

September 1986

10

Philips Semiconductors

Product specication

Low voltage PLL stereo decoder
DEFINITIONS Data sheet status Objective specication Preliminary specication Product specication Limiting values

TDA7040T

This data sheet contains target or goal specications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains nal product specications.

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specication is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specication. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

September 1986

11

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