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DieAttach Set-up Procedure2


Equipment Engineering 设备工程部 Line Maintenance Technician 生产线维护技术员 ASM898 change model Procedure

By: Fox Dai

STEP 1- Prepare Necessary Logistics 步骤1- 准备必要的配件

A

NVIL BLOCK ASSEMBLY WITHOUT DOWNSET DEVICE 未带有上下设备的真空底座

ANVIL BLOCK ASSEMBLY WITH DOWNSET DEVICE 带有上下设备的真空底座

PICK AND PLACE LOGISTICS AND TOOLINGS DEPENDING ON DIESIZES Die的尺寸决定捡、放Die的的配件
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STEP 2 – Manually Input FPC/PCB Parameters 步骤2-手动输入FPC/PCB参数
1). Remove anvil blocks from dispensing and bonding zones. 把画胶位和bond位的anvil block拆掉. 2). Go to "Conversion Mode", select 2 'Substrate Parameters' to access the menu then press [Enter]. 进入Conversion Mode菜单,选Substrate Parameters进入该目录. 3). Key-in all required parameters sequentially: 逐步输入所有的必要的参数. 0 Substrate Type(基板类别) L/F 1 Edge To Pad distance (边到派位的距离) 427 2 Edge To Orientation(边到定位孔的距离)222 3 Number Of units(单元个数) 10 4 Unit Length 1(派位内单元距离) 986 5 Unit Length 2(派位间单元距离) 0 6 Substrate Width(基板宽度) 2756 7 Downset Height(基板厚度) 28 8 Pad Parameters(派位参数) 0 Group Number in X (X方向上组数) 1 1 Group X Distance (X方向组间距离) 0 2 Number of Columns(列数) 1 3 Column Distance (列间距离) 0 4 Group Number in Y(Y方向上组数) 1 5 Group Y Distance(Y方向组间距离) 0 6 Number of Rows(行数) 3 7 Row Distance(行间距离) 815 8 Pad X(派位X方向长度) 250 9 Pad Y(派位Y方向宽度) 262 a Number of Targets(目标数) 1 9 LF Box Height (LeadFrame厚度) 0

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STEP 2 – Manually Input FPC/PCB Parameters
4). Press [Esc] to leave 按Esc退出. 5). Select "7 Save To Database" to store the substrate parameters into the database if necessary 如果有必要,选7Save To Database将当前基板参数保存到数据库. F1= select F2= toggle Enter= OK Stop, Esc= cancel ^v<>= move cursor <--= delete Note: User can select to store the data to either Drive C (C:\LFDB) or Drive A (Floppy Disk) 注:用户可自主选择将该数据存进C盘或是软盘. 6). Press [Enter] 按Enter. 7). Warning Message 'Confirm to Save Device Data? (Y/N() would be displayed, answer "Y" to update, then press [Enter] 出现提示信息”确认存储设备数据?”,选”Y”更新数据,Enter. 8). Select "9 Start Conversion" to start substrate conversion 选”9开始转换”,进行基板数据转换. 9). Three warning messages 'Confirm Start Conversion? (Y/N)', 'Change Downset? (Y/N)', 'Home All Modules? (Y/N)' would be displayed sequentially, answer "Y" to update 这时会相继出现3个提示信息:”确认开始转换?””改变下凹?””所有马达归位?”,选Y进行更新. 10). If fine adjustments are required , go to Setup Mode/ Indexer & Workholder Menu/ Trk Wid/ Downset Offset. 如果需要调节的更好,进Setup Mode/ Indexer & Workholder Menu/ Trk Wid/ Downset Offset. 11). Track width & downset would go to home position first, then user to enter any offset values for the two variables 轨道宽度和下凹度首先会停在Home位置,拥护可通过输入偏移值来改变二者. 12). Press [Enter] to confirm the changes Enter确认改变. 13). Install suitable dispensing And bonding anvil blocks 装上合适的画胶针和anvil block.

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STEP 3 - Teach Dispense and Bond PRS 步骤3-做画胶和Bond的PRS
Alignment Method: Patt/ PattG or Edge 校验方法:Patt/ PattG 或者Edge. 1). Go to Set-up Mode/ Vision System/ Bond PRS Alignment to access 进入菜单Set-up Mode/ Vision System/ Bond PRS Alignment 2). Press "F4 DspIdx" to index a LF to the bonding area 按F4送一块板到bonding 区域. 3). Adjust lightings by "Coaxial/ Ring Light“ 通过"Coaxial/ Ring Light"调整灯光. 4). Define Alignment method as "Pattern” 定义校验方法为 as"Pattern" 5). Select "Learn Alignment" to start PRS learning 选择”Learn Alignment” 开始做PRS. 6). A message "Free Original PR ID? (Y/N)" maybe displayed if there is a PR record existed 如果已存在有PR记录,则会出现一条"Free Original PR ID? (Y/N)" 提示信息. 7). Press "Y" to free the old PR record 按Y释放原始PR记录. 8). Another message "Define Die Pad" & "Adjust Upper Left Corner" would be displayed 接着将会出现"Define Die Pad" & "Adjust Upper Left Corner"提示 信息.

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STEP 3 - Teach Dispense and Bond PRS 步骤3-做画胶和Bond的PRS
9). Use joystick to adjust the drawn rectangle to the upper left corner of the die pad 用摇杆调整矩形框到die的左上角 10). Press [ENTER] to accept 按Enter接受. 11). Another messages "Define Die Pad" & "Adjust Upper Right Corner" would be displayed 下面将会显示: "Define Die Pad" & "Adjust Upper Right Corner" 12). Use joystick to adjust the drawn rectangle to the lower right corner of the die pad 用摇杆调整矩形框到die的右下角. 13). Press [ENTER] to accept 按Enter接受. 14). A message "Loading Alignment… Please wait" would be displayed 这时会出现"Loading Alignment… Please wait"提示信息. 15). Wait until a message "Alignment Learned" 一直等到出现信息框"Alignment Learned" 16). Define Search Range to include the taught template 定义搜索范围,应该能够包括已学之校验模块. 17). Perform alignment trial by "Align Substrate" 通过”Align Substrate”测试校验.

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STEP 4 – Perform Wafer PRS 步骤4-做Wafer 的 PRS
1). Go to Set-up Mode/ Vision System/ Wafer PRS Alignment to access 进入菜单Set-up Mode/ Vision System/ Wafer PRS Alignment. 2). Adjust lightings by "Coaxial/ Ring light" 通过"Coaxial/ Ring light"调整灯光. 3). Select "Alignment Method“as Pattern 选择"Alignment Method“as Pattern 4). Select "Learn Method" 选择"Learn Method" 5) Start teaching good Die by "Learn Good Die" 通过"Learn Good Die"开始做一个好的Die通过"Learn Good Die" 6). A message "Locate Die would be displayed 将会出现"Locate Die”的提示信息. 7). Use joystick to move the desired die to the screen center 用摇杆移动想要的Die到屏幕中心. 8). Press [ENTER] to accept Enter接受. 9). Another messages "Define Die" and "Adjust upper left corner " would be displayed 将会出现另一组提示信息"Define Die" 和 "Adjust upper left corner " 10). Use joystick to move the drawn rectangle to the upper left corner of the die 用摇杆将矩形框移动到Die的左上角. 11). Press [ENTER] to accept Enter接受. 12). Another messages “Define Die" and "Adjust Lower Right Corner" would be displayed 这时将会出现另一组提示信息“Define Die" 和"Adjust Lower Right Corner".
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STEP 4 – Perform Wafer PRS 步骤4-做Wafer 的 PRS
13). Use joystick to move the drawn rectangle to the lower right corner of the die 用摇杆移动矩形框到Die的右下角. 14). Press [ENTER] to accept Enter接受. 15). A message "Define Insp Window" and "Adjust Upper Left Corner" would be displayed 此时将会显示信息"Define Insp Window"和 "Adjust Upper Left Corner" 16). Use joystick to move the drawn rectangle to the upper left inspection window 用摇杆将矩形框移动到左上角检查窗口. 17). Press [ENTER] to accept Enter接受. 18). Another message "Define Insp Window" and "Adjust Lower Right Corner" would be displayed 另一组消息将显示: "Define Insp Window"和"Adjust Lower Right Corner" 19). Use joystick to move the drawn rectangle to the lower right inspection window 用摇杆将矩形框移动到右下角检查窗口. 20). Press [ENTER} to accept Enter接受. 21). A message "Number of ignore Window" would be displayed 将会显示信息: "Number of ignore Window" 22). Enter the number of ignore windows by using the numerical keys 0-4 可输入0~4个可忽略的窗口. 23). Press [ENTER] to end the input Enter结束输入. 24). Similar to procedure 15-20 to define the "Ignore Windows" of the die 类似于定义Die的忽略窗口定义的步骤15~20.
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STEP 4 – Perform Wafer PRS 步骤4-做Wafer 的 PRS
25). After completing the information input, a message "Loading die, please wait…." would be displayed 完成信息输入后,将会显示信息: "Loading die, please wait…." 26). Wait until a "Die Loaded Successfully" is shown 稍等,直到出现"Die Loaded Successfully" 27). Press [ENTER] to proceed 按Enter继续. 28). Another message "Do Calibration (Y/N)" would be displayed 将会出现另一则信息: "Do Calibration (Y/N)" 29). Answer "Y" if calibration is required 如果需要做校正选Y. 30). Press [ENTER] to start calibration 按Enter开始做校正. Set Search Range For Wafer PRS 1). After completing good & inked dice learning 完成好的和好的Die的PRS设定. 2). Select item "Set Search Range" to define the search range . 选择"Set Search Range"定义搜索范围. 3). Press [ENTER] to begin the setting 按Enter开始设定. 4). Use arrow keys (UP) & (DOWN) to adjust the size of the search range in the vertical direction while using (LEFT) & (RIGHT) arrow keys to adjust the size of the search range in the horizontal direction 用上,下按键调整垂直方向上的搜索范围, 用左,右按键调整垂直方向上的搜索范围 5). Press [ENTER] after finishing 完成后Enter.
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STEP 5 - Perform 3 pt. Alignment Procedure 做三点校正
?Conditions to do/check the three point alignment: ?做/检查三点校正 *For device conversion 改变设备 *Bondarm or ejector alignments was adjusted 调整邦头和顶针位置 ADJUST THE PICK POSITION 调整PICK的位置 1. Since the position of wafer optic is fixed,the wafer optics would be used as reference Wafer optic 的位置是固定的,但可以用来参考 2. Remove the spring type collet shaft cover from the bondarm 从邦头上挑开吸嘴上方像弹簧一般的盖子 3. Go to ‘SETUP’ menu> ‘Pick and Place’menu 进入’SETUP’菜单下>>>’Pick and place’菜单 4. Go to ‘BONDHEAD Y POSNS(um)’ and select ‘PICK’ 在’bondhead Y posns’选项中选择’PICK’ 5. Put a Metal plate on the wafer to reflect the image of the collect hole into the wafer optic 在wafer上放一金属块,从wafer optic到吸嘴上方的洞中可以看到 6. Check if the centerof collet is located at the crosshair of the wafer optic or not.Only concentrate on the Y direction 检查吸嘴孔中心是否和wafer optic上的十字架中心重合 7. If the collet center is not match with the crosshair of the camera,adjust the value of Y-Pick position 如果吸嘴中心在和十字架不匹配,调节摄像系统. 8. Go to ‘BONDHEAD X POSN(um)’ and select ‘PICK’ 进入’bondhead x posn ‘中选择’pick’

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Check the center of the collet is located at the crosshair of the wafer optic or not. 检查吸咀中心是不是在 wafer镜头上显示. 10 . If the center of the collet is not matched with the crosshair of the optic,adjust the value ? of the X-pick position by key-in number假如吸咀中心不在wafer镜头上相匹配,这时就需要输入数值来 调整X方向吸DIE的位置 11. Home the Bondarm 还原邦头马达 12. Restore the spring type collet shaft cover of the bondarm.把吸咀支架等部件装回邦头. 9.

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ADJUST THE EJECTOR XY POSITION顶针XY位置的调整
1. 2. Remove the wafer from the expander从扩张器中取下wafer盘. Go to ‘SETUP’ menu>’VISION SYSTEM’>’GENERAL LIGHTING’ 进入‘SETUP’主菜单中的;VISION SYSTEM’菜单,选择’GENERAL LIGHTING’分菜单 3. Increase the intensity of ring light by selecting ‘RING’ and ? increase the value of the Ring light.Usually 70-80 is enough 通过选择‘RING’项并且加大它的数值来 达到增加环型灯光.一般70-80就足够了! 4. Go to ‘SETUP’ menu>’PICK and PLACE’ menu>’EJECTOR POSN(cnts)’menu进入‘SETUP’主菜单中的Pick and place’菜单,再进入其中的’EJECTORPOSN(cnts)’ 分菜单. 5. Select ‘EjUP’ and observe the ejctor pin position from the ? Wafer monitor 选择‘EjUP’项,从显示屏上去观察顶针所在的位置 6. If the location of the ejector pin cannot be seen from the monitor clearly,adjust the ejector pin up level by key-in the larger value假如在显示屏幕上不能很清晰的看到顶针,可以大幅度的调整它顶起来的位置 7. Or adjust the intensity of wafer optics as mention in procedure no.3按照上面的第3步的步骤来调整 wafer 位置的灯光.

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STEP 6 – Dispense and Bond Parameter set-up
Pick Delay Suck Bond Delay WBlow Bond Delay Ejector Up Delay Ejector Vacuum Delay Wafer PRS Delay WH PRS Delay PR Confirm Srch BnSH Head Bond / Pick Time Arm Bond / Pick Ht(um) 250 ms 0 ms 0 ms 50 ms 150 ms 100 ms 150 ms Yes 700 um 300 / 300 3000 / 3000

Pat/Die Ratio X/Y (%) Use Fast Pattern Pre/Post Squeeze Delay Z contact offset X/Y Vel X/Y Acc / Dec X/Y Jerk

75 / 75 Yes -30 / -30 -70 cnts 46.875 mm/s 30000 mm/s2 4600 mm/s3

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Input/output Elevator Set-up 设置进料/出料升降台. 1 Go to conversion Mode/Magazine Parameters to access menu 进入conversion Mode/Magazine Parameters菜单. 2 Key in all the required magazine parameters as define in figure 1 below 输入所有必要的料盒参数,如下定义: 1st Magazine last .3 Select "Start Conversion" to activate 选择”Start Conversion”激活参数. 4 Place a magazine onto the output elevator lower platform 在升降机Output端下平台放一个料盒. 5 Go to " Setup Mode/ Output Elevator" to access 选择" Setup Mode/ Output Elevator"菜单进入. 6 Select "Position Adjustment" to adjust the related positions. 选择"Position Adjustment"调整相关位置. 7 Select "Get Magazine Position Y & Z" sequentially to adjust the get magazine positions in Y-& Z- Direction of the output elevator lower desk. 选"Get Magazine Position Y & Z"依次调整在下平台得到料盒的Y&Z轴坐标位置. 8 Select "Put Magazine Posn Y & Z sequentially to adjust the put magazine position in Y & Z direction of the output elevator upper deck

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STEP 7 – Post-Bond Inspection teaching NOTE: Attached One Die at AutoMode then Perform Post –Bond inspection teaching
Post-bond Inspection Post-bond 检查. 1) Enable Epoxy Writer from Diag M ode/ Select M odules 在Diag M ode/ Select M odules打开画胶头. 2) Press [ESC] to return 然后ESC返回. 3) Press "F4 BndIdx" to dispense the substrate & to bonding area 按”F4”将画过胶的基板送到bonding区域. 4) Go to Bond M ode 进入bond模式. 5) Select "1 Die Bond" to bond 1 die on current pad 选择"1 Die Bond"在当前派位bond一个Die. 6) Press [ESC] after finishing 结束后按ESC. 7) Go to Setup M ode/ Vision System/ Postbond Inspection to access 进入Setup M ode/ Vision System/ Postbond Inspection菜单. 8) Adjust lightings by "Coaxial/ Ring Light' 通过"Coaxial/ Ring Light'

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STEP 8 – Measurement and Adjustments

QA will Measure the Die Placement,BondLine Thickness and Die tilt on the First unit attached Using the Ff. criteria QA 将使用Ff. 测量第一块IC的水平偏移,Bondline 厚度,和IC翘起幅度 标准如下 DIE PLACEMENT +- 1 mil BondLine Thickness .8-1.5 mils Die Tilt < 1 mil

EE to get the Data to be Use for Adjustments on Machine. 数据将被EE用与调整机器 NOTE: Given the QA reading, EE to adjust Machine Parameter to meet the requirements 注意: 跟据QA所测的数据,EE调整机器参数满足产品要求.
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STEP 9 cont. – Measurement and Adjustments
Die Placement Adjustments : 水平调整
Go to Conversion menu,TargetParameters and Input the no.of Units required to meet the correct Reading 进入菜单Conversion menu,TargetParameters 输入
数据,使需要调整的单位满足正确的标准

EX. BD req. for X1(left)= 30 mils, X2(Right)= 23mils 例如 bond 需要:X1(left)= 30 mils,
X2(Right)= 23mils

X2 Using The 1 mil Criteria 按以下标准 X1=29-31 MILS X2=22-24 MILS -50(2mils)

DIE

If QA Reading is X1= 32mils,X2= 21 mils, adjust to negative value 假如QA的标准是X1= 32mils,X2= 21 mils, 调整底片数 值 so that 32-2=30 mils for X1 meet requirement 所以X1方向减2满足要求 and 21+ 2 mils for X2 meet requirement X2方向+2满足要求

X1

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STEP 9 cont. – Measurement and Adjustments

BondLine Thickness and Die Tilt Adjustments :
Go to Set-up menu,Pick and Place ,Bonhead Z level. Input the no.of Units required to meet the correct reading 进入菜单Set-up menu,Pick and Place 中的Bonhead Z level,在需
要调整的单位上输入数值去满足要求.
OLD BLT DATA
No. DT 0.0203=.8mil 0.0381=1.5 mil Corner 1 0.3100 0.3303 0.3481 Corner 2 0.3100 0.3303 0.3481

EX. Using The .8- 1.5 mil Criteria 例如使用.8- 1.5 mil 标准
Corner 3 0.3100 0.3303 0.3481 Corner 4 0.3100 0.3303 0.3481

NEW BLT DATA
Corner 1 0.3100 0.3303 0.3481 Corner 2 0.3100 0.3303 0.3481 Corner 3 0.3100 0.3303 0.3481 Corner 4 0.3100 0.3303 0.3481

No. DT 0.0203=.8mil 0.0381=1.5 mil

1 2 3 4 Min Max Average Std Dev B LT Tilt BLT mils Tilt mils

0.3370 0.3120 0.3430 0.3180 0.3120 0.3430 0.3275 0.014844 0.0175 0.031 0.688976 1.220472

0.3430 0.3300 0.3170 0.3100 0.3420 0.3580 0.3510 0.3180 0.3300 0.3160 0.3430 0.3680 0.3100 0.3180 0.3170 0.3510 0.3430 0.3680 0.3300 0.3333 0.3433 0.02005 0.011758 0.023768 0.0200 0.0233 0.0333 0.041 0.025 0.051 0.787402 0.915354 1.309055 1.614173 0.984252 2.007874

1 2 3 4 Min Max Average Std Dev B LT Tilt BLT mils Tilt mils

0.3430 0.3350 0.3340 0.3480 0.3340 0.3480 0.3400 0.006683 0.0300 0.014 1.181102 0.551181

0.3420 0.3410 0.3460 0.3320 0.3360 0.3440 0.3380 0.3380 0.3410 0.3490 0.3460 0.3350 0.3320 0.3360 0.3350 0.3490 0.3460 0.3440 0.3403 0.3403 0.3415 0.007136 0.004349 0.004796 0.0303 0.0303 0.0315 0.017 0.01 0.009 1.190945 1.190945 1.240157 0.669291 0.393701 0.354331

Increase BLT Decrease BLT

Bondhead Z level (um) From To Unit No. 6338 6375
EXAMPLE
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