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pcb专业英语


pcb 专业英语
PCB 印制电路板类词汇中英文对照: 1, 印制电路:printed circuit 2, 印制线路:printed wiring 3, 印制板:printed board 4, 印制板电路:printed circuit board (pcb) 5, 印制线路板:printed wiring board(pwb) 6, 印制元件:printed component 7, 印制接点:printed contact 8, 印制板装配:printed board assembly 9, 板:board 10, 单面印制板:single-sided printed board(ssb) 11, 双面印制板:double-sided printed board(dsb) 12, 多层印制板:mulitlayer printed board(mlb) 13, 多层印制电路板:mulitlayer printed circuit board 14, 多层印制线路板:mulitlayer prited wiring board 15, 刚性印制板:rigid printed board 16, 刚性单面印制板:rigid single-sided printed borad 17, 刚性双面印制板:rigid double-sided printed borad 18, 刚性多层印制板:rigid multilayer printed board 19, 挠性多层印制板:flexible multilayer printed board 20, 挠性印制板:flexible printed board 21, 挠性单面印制板:flexible single-sided printed board 22, 挠性双面印制板:flexible double-sided printed board 23, 挠性印制电路:flexible printed circuit (fpc) 24, 挠性印制线路:flexible printed wiring 25, 刚性印制板:flex-rigid printed board, rigid-flex printed board 26, 刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed 27, 刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer printed board 28, 齐平印制板:flush printed board 29, 金属芯印制板:metal core printed board 30, 金属基印制板:metal base printed board 31, 多重布线印制板:mulit-wiring printed board 32, 陶瓷印制板:ceramic substrate printed board 33, 导电胶印制板:electroconductive paste printed board 34, 模塑电路板:molded circuit board 35, 模压印制板:stamped printed wiring board 36, 顺序层压多层印制板:sequentially-laminated mulitlayer 37, 散线印制板:discrete wiring board 38, 微线印制板:micro wire board 39, 积层印制板:buile-up printed board 40, 积层多层印制板:build-up mulitlayer printed board (bum) 41, 积层挠印制板:build-up flexible printed board 42, 表面层合电路板:surface laminar circuit (slc) 43, 埋入凸块连印制板:b2it printed board

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多层膜基板:multi-layered film substrate(mfs) 层间全内导通多层印制板:alivh multilayer printed board 载芯片板:chip on board (cob) 埋电阻板:buried resistance board 母板:mother board 子板:daughter board 背板:backplane 裸板:bare board 键盘板夹心板:copper-invar-copper board 动态挠性板:dynamic flex board 静态挠性板:static flex board 可断拼板:break-away planel 电缆:cable 挠性扁平电缆:flexible flat cable (ffc) 薄膜开关:membrane switch 混合电路:hybrid circuit 厚膜:thick film 厚膜电路:thick film circuit 薄膜:thin film 薄膜混合电路:thin film hybrid circuit 互连:interconnection 导线:conductor trace line 齐平导线:flush conductor 传输线:transmission line 跨交:crossover 板边插头:edge-board contact 增强板:stiffener 基底:substrate 基板面:real estate 导线面:conductor side 元件面:component side 焊接面:solder side 印制:printing 网格:grid 图形:pattern 导电图形:conductive pattern 非导电图形:non-conductive pattern 字符:legend 标志:mark

PCB 基材类词汇中英文对照: 1, 基材:base material 2, 层压板:laminate 3, 覆金属箔基材:metal-clad bade material 4, 覆铜箔层压板:copper-clad laminate (ccl) 5, 单面覆铜箔层压板:single-sided copper-clad laminate

6, 双面覆铜箔层压板:double-sided copper-clad laminate 7, 复合层压板:composite laminate 8, 薄层压板:thin laminate 9, 金属芯覆铜箔层压板:metal core copper-clad laminate 10, 金属基覆铜层压板:metal base copper-clad laminate 11, 挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film 12, 基体材料:basis material 13, 预浸材料:prepreg 14, 粘结片:bonding sheet 15, 预浸粘结片:preimpregnated bonding sheer 16, 环氧玻璃基板:epoxy glass substrate 17, 加成法用层压板:laminate for additive process 18, 预制内层覆箔板:mass lamination panel 19, 内层芯板:core material 20, 催化板材:catalyzed board ,coated catalyzed laminate 21, 涂胶催化层压板:adhesive-coated catalyzed laminate 22, 涂胶无催层压板:adhesive-coated uncatalyzed laminate 23, 粘结层:bonding layer 24, 粘结膜:film adhesive 25, 涂胶粘剂绝缘薄膜:adhesive coated dielectric film 26, 无支撑胶粘剂膜:unsupported adhesive film 27, 覆盖层:cover layer (cover lay) 28, 增强板材:stiffener material 29, 铜箔面:copper-clad surface 30, 去铜箔面:foil removal surface 31, 层压板面:unclad laminate surface 32, 基膜面:base film surface 33, 胶粘剂面:adhesive faec 34, 原始光洁面:plate finish 35, 粗面:matt finish 36, 纵向:length wise direction 37, 模向:cross wise direction 38, 剪切板:cut to size panel 39, 酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper ccl) 40, 环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper ccl) 41, 环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates 42, 环氧玻璃布纸复合覆铜箔板: epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43, 环氧玻璃布玻璃纤维复合覆铜箔板: epoxide non woven/woven glass reinforced copper-clad laminates 44, 聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates 45, 聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates 46, 双马来酰亚胺三嗪环氧玻璃布覆铜箔板: bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47, 环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates 48, 聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates

49, 超薄型层压板:ultra thin laminate 50, 陶瓷基覆铜箔板:ceramics base copper-clad laminates 51, 紫外线阻挡型覆铜箔板:uv blocking copper-clad laminates PCB 线路设计词汇中英文对照: 1, 原理图:shematic diagra 2, 逻辑图:logic diagram 3, 印制线路布设:printed wire layout 4, 布设总图:master drawing 5, 可制造性设计:design-for-manufacturability 6, 计算机辅助设计:computer-aided design.(cad) 7, 计算机辅助制造:computer-aided manufacturing.(cam) 8, 计算机集成制造:computer integrat manufacturing.(cim) 9, 计算机辅助工程:computer-aided engineering.(cae) 10, 计算机辅助测试:computer-aided test.(cat) 11, 电子设计自动化:electric design automation .(eda) 12, 工程设计自动化:engineering design automaton .(eda2) 13, 组装设计自动化:assembly aided architectural design. (aaad) 14, 计算机辅助制图:computer aided drawing 15, 计算机控制显示:computer controlled display .(ccd) 16, 布局:placement 17, 布线:routing 18, 布图设计:layout 19, 重布:rerouting 20, 模拟:simulation 21, 逻辑模拟:logic simulation 22, 电路模拟:circit simulation 23, 时序模拟:timing simulation 24, 模块化:modularization 25, 布线完成率:layout effeciency 26, 机器描述格式:machine descriptionm format .(mdf) 27, 机器描述格式数据库:mdf databse 28, 设计数据库:design database 29, 设计原点:design origin 30, 优化(设计) :optimization (design) 31, 供设计优化坐标轴:predominant axis 32, 表格原点:table origin 33, 镜像:mirroring 34, 驱动文件:drive file 35, 中间文件:intermediate file 36, 制造文件:manufacturing documentation 37, 队列支撑数据库:queue support database 38, 元件安置:component positioning 39, 图形显示:graphics dispaly 40, 比例因子:scaling factor 41, 扫描填充:scan filling

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矩形填充:rectangle filling 填充域:region filling 实体设计:physical design 逻辑设计:logic design 逻辑电路:logic circuit 层次设计:hierarchical design 自顶向下设计:top-down design 自底向上设计:bottom-up design 线网:net 数字化:digitzing 设计规则检查:design rule checking 走(布)线器:router (cad) 网络表:net list 计算机辅助电路分析:computer-aided circuit analysis 子线网:subnet 目标函数:objective function 设计后处理:post design processing (pdp) 交互式制图设计:interactive drawing design 费用矩阵:cost metrix 工程图:engineering drawing 方块框图:block diagram 迷宫:moze 元件密度:component density 巡回售货员问题:traveling salesman problem 自由度:degrees freedom 入度:out going degree 出度:incoming degree 曼哈顿距离:manhatton distance 欧几里德距离:euclidean distance 网络:network 阵列:array 段:segment 逻辑:logic 逻辑设计自动化:logic design automation 分线:separated time 分层:separated layer 定顺序:definite sequence

PCB 英文专业综合词汇: 1 孔环 annular ring 2 挡水滚轮 water blocking roller 3 干片 dry film 4 内层 inner layer 5 内层制程 inner layer image transfer process 6 干片制成程 outer layer image transfer process 7 下陷 dish down

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杂质断路 open due to foreign particle 断口 nick 空洞 void 干膜翘 dry film lift 线路撞断 line cracked up 线路变形 line distortion 残铜 copper residue 曝光S exposure short 残铜S copper short 线路凸起 conduction protrusion Registration Hole 层偏 misregitration 虚影过大 excessive under cut 孔内铜渣 copper resuide in PTH 镭射孔偏破 micro-via break out 刮伤 scratch 通孔对破 breank out DF NC 钻偏破 break out NC 蚀刻不全 imcompeletely etching 贯孔不良 poor PTH 电镀 copper plating 板弯板翘 twist/bow 层偏 Misregistration 通孔 through hole PTH 盲孔 blind hole 埋孔 buried hole 暴板 delamination 转角分裂 &nbscrack 渗镀 wicking 板内气泡 internal bubble 钉头 nailheading 回蚀 positive etchback 反回蚀 negative etchback 板面白点 measling CUSO4 蚀刻 copper sulfate etching 流程卡 traveller 重工 rework 有机残留 organic residue 陶瓷 ceramic 巡厂 tour plant 带板 leading board 高锰酸 permanganate PPT 的页数 lidesle 模板 template ure 布局 layout 抗腐蚀 anti-corrosion 表面 interface

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合金 alloy 明显的 significantly 喷淋设备 Spray chamber 油墨下杂质 foreign inclusion under S/M (压合)缺胶 resin starvation (压合)蛇纹 resin crazing 玻纤突出 glass protrusion 孔粗 drill gouging 树脂空洞 resin void 基板空洞 laminate void 压合空洞 lamination voids 楔形(咬蚀) wedging 楔形空洞 wedg voiding 单点... single reading… (电镀)环形空洞 circumferential void 边框 panel border 阻抗 Resistivity 尺寸稳定性 Coefficient Thermal of Elongation 阻燃性 Flammability 喷嘴 nozzle 延展性 ductilit 下料 Cut Lamination 裁板 Sheets Cutting 原物料发料 Shear material to Size 一次孔 Outer Layer Drilling 二次孔 2nd Drilling 盲(埋)孔钻孔 Blind Buried Hole Drilling 化学前处理,化学研磨 Chemical Milling 选择性浸金压膜 Selective Gold Dry Film Lamination 叠板 Lay up 后处理 Post Treatment 铣靶 spot face 薄化铜 Copper Reduction 电镀 Horizontal Electrolytic Plating 水平电镀 Horizontal Electro-Plating 锡铅电镀 Tin-Lead Plating 砂带研磨 Belt Sanding 剥锡铅 Tin-Lead Stripping 微切片 Microsection 塞孔 Plug Hole 193 预烤 Precure194 表面刷磨 Scrub195 后烘烤 Postcure196 C 面印刷 Printing Top Side S 面印刷 Printing Bottom Side 静电喷涂 Spray Coating

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文字印刷 Printing of Legend 喷砂 Pumice 金手指镀镍金 Gold Finger 浸镍金 Immersion Ni/Au 水平喷锡 Horizontal Hot Air Solder Leveling 垂直喷锡 Vertical Hot Air Solder Leveling 捞型 Routing 模具冲 Punch 金手指斜边 Beveling of G/F 泛用型治具测试 Universal Tester 专用治具测试 Dedicated Tester 飞针测试 Flying Probe 压板翘 Warpage Remove 包装及出货 Packing shipping 离子残余量测试 Ionic Contamination Test 冷热冲击试验 Thermal cycling Testing 焊锡性试验 Solderability Testing 雷射曝光对位孔 Laser Ablation Registration Hole 粗化 abrade 允收 ACC ( accept ) 活化液 activator 附著力 adhesion 气泡 air inclusion 环状垫圈;孔环 annular ring 纵横比(厚宽比) aspect ratio 背光 back lighting 垫板 back-up 基材 base material 批 batch 切斜边;斜边 beveling 毛边(毛头) burr 隔板;钢板 caul plate 无尘室 clean room 补偿 compensation 零件孔 component hole 接触电阻 contact resistance 铜箔基板 copper claded laminates (CCL) 线路露铜 copper exposure 铜渣 copper residue (copper splash) 电流效率 current efficiency 周期 date code 去毛头 deburring 凹陷 / 针孔 dent / pin hole 尺寸安定性 dimension stability 孔内异物 dirty hole 延展性 ductility

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化学铜 electroless plate 蚀刻液 etchants 回蚀 etchback 铆钉孔 eyelet hole 纤维显露 fiber exposure 纤维突出 iber protrusion 电测夹具(治具) fixture 助焊剂 flux 基材内异物 foreign material 有效长度 gauge length 夹头 grip 解析度 resolution 孔径 hole diameter 孔位 hole location 孔壁品质 hole wall quality 牛皮纸 kraft paper 压膜机 laminator 线距 line space 线宽 line width 微蚀 microetching 微切片法 microsectioning 迁移 migration 钉头 nail head 反回蚀 negative etchback 欧姆计 ohmmeter 1 盖板 overlay entry 平面 planar 回收槽 recovery tank 对位用标记 register mark 对位孔 registration hole 树脂下陷 resin recession 胶渣 resin smear 孔壁粗糙;粗慥 oughtness 孔内绿漆 S/M on hole 刮伤 scratches 跳印;漏印 skip printing 焊锡性 solderability 钻轴 spindle 刮刀 Squeegee 标准化 standardizing 表面绝缘电阻 surface insulation resistance (SIR) 表面粗慥度 surface roughness 孔破 oid in PTH hole 仓库 warehouse 良率 yield

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