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Ultimate in Vacuum since 1952

ULVAC Solutions for Si Thin Film Solar Cell Jun 7, 2008

Electronic Journal 2008

Ultimate in Vacuum since 1952

Popula

tion Energy Consumption Depletion of Oil,Coal

Era of New Energy
2006/8/25

PHOTO:「Wikipedia」
Electronic Journal 2008

EACH PROCESS
PROCESS
Single crystal Polycrystalline Amorphous

Ultimate in Vacuum since 1952

MERIT

DEMERIT

High Efficiency(18-22%) Expensive cost Better Energy Ballance Constant output Large Scale No-limitation Material Expensive cost Low Efficiency

Amorphous+μc-Si CI(G)S

High Efficiency(10-15%) Expensive system cost High Efficiency Material Issue

As ULVAC

Vacuum Technology is familiar with Thin Film
Electronic Journal 2008

Process Flow
Substrate Loading

Ultimate in Vacuum since 1952

METAL a-Si(pin) TCO GLASS
Laser Patterning (TCO) Laser Patterning (a-Si) Sputtering System Laser Patterning (back-side metal)

PE-CVD System

Piling Structure METAL GLASS a-Si(pin) TCO

Wiring & Encapsulation

Electronic Journal 2008

SYSTEM LINE UP
PE-CVD System

Ultimate in Vacuum since 1952

a-Si , ?c-Si ,

Solar Cell
Patterning System
TCO,a-Si ,
Thin Film Silicon

Sputtering System
Back Side Metals (Al,Ag,etc.) MetalOxides (ZnO,ITO,etc.)

Back Side Metal

Others(Component,Analysis、Material)
Electronic Journal 2008

ULVAC Solar History

Ultimate in Vacuum since 1952

Thin Film Production Thin Film 1970 1980 1990 2000 Experimental Machine CCH(PECVD)→For Production

Oil Shock

CCV(PECVD) 27MHz Plasma Tandem Solar Technology TFT CVD→ Display Cluster CVD Magnetron Sputtering
Electronic Journal 2008

Ultimate in Vacuum since 1952

PE-CVD System
CCV-Series

Electronic Journal 2008

PE-CVD System
Inline PE-CVD System CCV-Series for Solar Cell Production
? Large Deposition Area
Substrate Size G5.5

Ultimate in Vacuum since 1952

High throughput
Two Sets of Substrates with Holder

?High Film Quality
Separating Each Layers

?Low Cost
Low System Price and Running Cost

Electronic Journal 2008

CCV - : process chamber
Old System??→Fit with Solar 2 Substrate in One Chamber Plasma Heater Sub. carrier

Ultimate in Vacuum since 1952

Gas

ガス

Gas

Cathode Small Foot Print No Cleaning Gas→Running Cost

Cathode Vac.
Electronic Journal 2008

System View

Ultimate in Vacuum since 1952

Traverser Return Conveyer Unload Lock Chamber Deposition Chamber Heating Chamber Load Lock Chamber L/UL Position Traverser

Electronic Journal 2008

System Configuration
Sub. Exchange

Ultimate in Vacuum since 1952

Return System

L/C Substrate Holder

H/C

P/C

P/C

P/C

P/C

P/C

P/C

P/C

P/C UL/C

p Layer Deposition Chamber : Unload Lock Chamber : PMB/PR n Layer Deposition Chamber :

Heating Chamber :

Load Lock Chamber : i Layer Deposition Chambers :

Electronic Journal 2008

Specification of CCV

Ultimate in Vacuum since 1952

Substrate Size TACT Process High Vacuum Transfer

:G5.5 : 1.5 minutes : Double Side Cathode

: Contamination Free : Carrier Transfer

Electronic Journal 2008

Ultimate in Vacuum since 1952

Sputtering System

Electronic Journal 2008

Sputtering System
Inline Sputtering System for Solar Cell Production
High Productivity Low COO High Quality

Ultimate in Vacuum since 1952

Electronic Journal 2008

Specification of SPUTTER

Ultimate in Vacuum since 1952

Substrate Size TACT Cathode High Vacuum Transfer

:G5.5 : 1.5 minutes : α cathode for ZnO : α cathode for Ag : Cryo-pump : Tray Less Transfer

Electronic Journal 2008

Ultimate in Vacuum since 1952

Laser Patterning System

Electronic Journal 2008

Laser Patterning System

Ultimate in Vacuum since 1952

Optical system moves along the upper gantry (Y-axis) stepwise by pitch. Substrates are processed by LASER along lower stage (x-axis) movement.

Stage

Y-axis: Movement of Optics

Moving optical system

X-axis: Movement of Substrate

Moving optical system

Stage Substrate

Laser:Solid Laser (High Stability) Tact:High Scanning Stage

Electronic Journal 2008

SCRIBE LINE
Schematic of a-Si module

Ultimate in Vacuum since 1952

Back reflector a-Si TCO Glass

■ Fine Line Control ■ High Speed Scanning ■ Good Repeatability
Electronic Journal 2008

Ultimate in Vacuum since 1952

Panel

Electronic Journal 2008

Development Status
Substrate TCO a-Si TCO Electrode

Ultimate in Vacuum since 1952

Substrate TCO a-Si

μc-Si

a-Si 102W

Tandem

130W

TCO Electrode

Electronic Journal 2008

Ultimate in Vacuum since 1952

ULVAC will Contribute Solar Market.

Electronic Journal 2008


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