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RT3070设计大功率WiFi模块(WL-UM01P-3070)规格书


HK NATER TECH LIMITED
WL-UM01P-3070 Specification

Customer:

Description:

WL-UM01P-3070-V1.1

Customer P/N:______________________________________

Date:
Customer Approve Auditing Admit

Provider Approve Auditing Admit

Customer: Add: Tel: Fax: Attn: E-mail:

Provider:HK NATER TECH LIMITED Add: 2F,NO.27,2 Baomin Rd.,Baoan Dist.SZ City,China Tel:0086-755-61522172/13510620050 Fax:0086-755-61522171 Attn:Lingo E-mail:hsdgood@163.com

SPECIFICATIONS
IEEE 802.11 b/g/n 2.4GHz Wi-Fi 1T1R

WL-UM01P-3070-V1.1
USB MODULE

1.General Description
The RT3070 is a highly integrated MAC/BBP and 2.4 GHz RF single chip with 150Mbps PHY rate supporting. It fully complies with IEEE 802.11n draft 8.0 and IEEE 802.11 b/g feature rich wireless connectivity at high standards, delivers reliable, cost-effective, throughput from an extended distance. Optimized RF architecture and baseband algorithms provide superb performance and low power consumption. Intelligent MAC design Deploys a high efficient USB engine and hardware data processing accelerators without overloading the host processor. The RT3070 is designed to support standard based features in the areas of security, quality of service and international regulation, giving end users the greatest performance anytime in any circumstance.

Features
? ? ? ? ? ? ? CMOS Technology with RF, Baseband, and MAC Integrated. 1T1R Mode with 150Mbps PHY Rate for Both Transmit and Receiving. Legacy and High Throughput Modes 20MHz/40MHz Bandwidth Reverse Direction Grant Data Flow and Frame Aggregation WEP 64/128, WPA, WPA2,TKIP, AES QoS-WMM, WMM-PS ? ? ? ? ? ? ? WPS,PIN,PBC Multiple BSSID Support USB 2.0 Cisco CCX Support Bluetooth Co-existence Low Power with Advanced Power Management Operating Systems - Windows XP 32/64, 2000, Vista 32/64 , Linux, Macintosh

2.General Specification
Model Product Name Major Chipset Standard Data Transfer Rate Modulation Method WL-UM01P-3070-V1.1 WLAN 11b/g/n USB2.0 module RT3070 IEEE802.11n 、IEEE 802.11g、IEEE 802.11b、IEEE 802.11j、IEEE 802.11e 1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 and maximum of 150Mbps DSSS,DBPSK, DQPSK, CCK and OFDM (BPSK/QPSK/16-QAM/ 64-QAM)

Frequency Band Operation Range Bus Interface Operating Channel Power Consumption Operating Temperature Storage Temperature Humidity Dimension

2.400GHz ~ 2.4835 GHz Up to 180 meters in open space USB2.0 WiFi 2.4GHz: 11: (Ch. 1-11) – United States;13: (Ch. 1-13) – Europe ;14: (Ch. 1-14) – Japan 5V I/O supply voltage -10 ~ +70° C ambient temperature -10 ~ 70°C ambient temperature 5 to 90 % maximum (non-condensing) 39.2 x 15.0 x 3.03mm (LxWxH) +-0.2MM

3.Block Diagram

4.Power Supply DC Characteristics
Parameters
3.3V Supply Voltage 1.2V Supply Voltage Receiving 3.3V Current Consumption 1.2V Current Consumption Transmission 3.3V Current Consumption 1.2V Current Consumption Icc33tx Icc12tx HT40 MCS7 HT40 MCS7 31 124 mA mA Icc33rx Icc12rx HT40 MCS7 HT40 MCS7 37 243 mA mA

Symbol
Vcc33 Vcc12

Parameter

Min
3.0 1.14

Typ
3.3 1.2

Max
3.6 1.4

Units
V V

DC Characteristics
Module WL-UM03P-3070-V1.1 Voltage 5V Current Consumption (linking) (上网或者看电影时的功耗)

5.Electrical Specifications
1) RF Characteristics for IEEE802.11b
Items Specification Mode Channel frequency RX (per≤85 dBm@8%) Freq err limit TX Characteristics Power Level EVM (≤-18) (21±1 dBm)

( 11Mbps mode unless otherwise specified)

Contents IEEE802.11b CCK 11 Mbps 2412 ~ 2484 MHz -87dBm ±13PPM Min. Typ. 21 -18 Max. Unit dBm dB

2) RF Characteristics for IEEE802.11g
Items Specification Mode Channel frequency RX (per≤70 dBm@10%) Freq err limit TX Characteristics Power Level EVM (≤-25) (19±1dBm)

( 54Mbps mode unless otherwise specified)

Contents IEEE802.11g OFDM 54 Mbps 2412 ~ 2484 MHz -74dBm ±13PPM Min. Typ. 19 -25 Max. Unit dBm dB

3) RF Characteristics for IEEE802.11n (BW20_MCS7)
Items Specification Mode Channel frequency RX (per≤65 dBm@10%) Freq err limit TX Characteristics Power Level EVM (≤-27) (18±1 dBm) Contents IEEE802.11n (BW20_MCS7) OFDM 65 Mbps 2412 ~ 2484 MHz -69 dBm ±13PPM Min. Typ. 18 -27 Max. Unit dBm dB

4) RF Characteristics for IEEE802.11n (BW40_MCS7)
Items Specification Mode Channel frequency RX (per≤65 dBm@10%) Freq err limit Contents IEEE802.11n (BW40_MCS7) OFDM 135 Mbps 2412 ~ 2484 MHz -69 dBm ±13PPM

TX Characteristics Power Level EVM (≤-27) (18±1 dBm)

Min.

Typ. 18 -27

Max.

Unit dBm dB

6.Mechanical
Dimensions (mm) Length 39.2
(Tolerance:±0.2mm)

Width 15.0
(Tolerance:±0.2mm)

Height 3.03
(Tolerance:±0.2mm)

8.Module Pin Assignment

Pin
1 2 3 4 5 6

Function
NC NC GND UDP UDM 5V

Description
NC NC Ground High-Speed USB D+ Signal High-Speed USB D- Signal VDD5V for Digital IO

9. interface electrical characteristics

注:1.USB 数据线需要做 90Ohm 的阻抗。 2.建议电源输入端留一个电源开关,每次开关卡时可以做一个上电断电的作用 可以使用 wifi 复位,就不会有打不开 wifi 的错误现象出现。 Note:1.Two root go line do difference , but also required to make 90Ohm the impedance test.e get lock can do

2.Suggested that leave a power switch power supply input terminal ,every tim a electric power
is on

10.Recommended Reflow Profile
Referred to IPC/JEDEC standard. Peak Temperature : <250°C Number of Times : ≤2 times

ENVIRONMENTAL
Operating
Operating Temperature: Relative Humidity: 0°C to +70 °C 5-90% (non-condensing)

Storage
Temperature: Relevant Humidity: -40°C to +80°C (non-operating) 5-95% (non-condensing)

MTBF caculation
Over 150,000hours

11.Wireless module before the SMT note: ? When customers Open stencil must be sure the

11.Wifi 模块贴片装机前注意事项:

hole bigger to the Wireless module plate, please press 1 to 1 and 0.7 mm is widened to open outward, the thickness of 0.12 mm. ? Can't get the wifi module bare hands when

1.客户在开钢网时一定要将 wifi 模块焊盘的孔开大, 请按 1 比 1 再向外扩大 0.7mm 比例开钢网,厚度按 0.12mm. 2.有需要拿 wifi 模块时不可以光手去拿, 一定要戴上手套 以及静电环. 3.过炉温度要根据客户主板的大小而定, 一般像平板电脑 上的标准温度为250+-5°,也可以做到260+-5°

needs,must we wear the gloves and static ring. 3.The furnace temperature according to the size of the customer the mainboard ,generally like to stick on a tablet standard temperature of 250 + - 5,can do 260 + 5. Storage and use Wifi module control should pay attention to the following matters: 3. Module of the storage life of vacuum packaging: 1-1.Storage life:12 months. Storage conditions:<40℃. Relative humidity:<90%R.H. 1-2.After this bag is opened , devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing must be : 1-3.Check ≦20%RH.If the humidity card :stored greater at than

Wifi 模块储存及使用管制应注意事项如下:

1.模块的真空包装之储存期限: 1-1.保存期限:12个月,储存环境条件:温度在:<40℃, 相对湿度:<90%R.H. 1-2.模块包装被拆后,SMT 组装之时限: 1-3. 检 查 湿 度 卡 : 显 示 值 应 小 于 30% ( 蓝 色 ) ,如: 30%~40%(粉红色)或者大于40%(红色)表示模块已吸 湿气. ? 工 厂 环 境 温 度 湿 度 管 制 : ≦30%℃ ,

:30%~40%(pink)or

≦60%R.H。 ? 拆封后,车间的保存寿命为 168 小时.

40%(red).Labeling module has moisture absorption. ① Mounthed within 168 hours at factory

1-4.如在拆封后的 168 个小时内未使用完,需要烘烤,烘 烤条件如下: 5.模块须重新烘烤,以除去模块吸湿问题. 6.烘烤温度条件:125℃,8 小时. 7.烘烤后,放入适量的干燥剂再密封包装. 1-5. 模块真空包装数量以客户要求的实际包装数量为准.

conditions of: t≦30%℃,≦60%R.H. ② Once opened, the workshop the preservation

of life for 168 hours. 1-4.If baking is required,devices may be baked for: ? Modules must be to remove module

moisture problem. ? ? Baking temperature: 125 ℃, 8 hours. After baking, put proper amount of 2.模块卷盘包装事项如下: 2-1.保存期限:12个月,储存环境条件:温度在:<40℃, 相对湿度:<90%R.H. 1-5. The actual number of module vacuum packing 2-2.模块拆开包装168小时后,如要上线贴片需要重新烘 烤,以除去模块吸湿问题,烘烤温度条件:125℃,8小 时。 2-3. 模块卷盘包装以客户要求的实际包装数量为准. which is based on the actual number of packages to the customer requirements. 2.Module reel packaging items as follows. 2-1.Storage life:12 months. Storage conditions:<40℃. Relative humidity:<90%R.H. 2-2.Module apart packing after 168 hours,To launch patch need to bake, to remove the module hygroscopic, baking temperature conditions:125℃,8hours.

desiccant to seal packages.

3.模块托盘包装事项如下: 3-1.保存期限:3个月,储存环境条件:温度在:<40℃, 相对湿度:<90%R.H.

2-3. The actual number of

module reel packing which

3-2.模块如在 48 小时内未使用,在上线之前需要进行烘 烤,烘烤温度条件:125℃,8 小时。 3-3. 托盘包装每盘为 100pcs,模块托盘包装以客户要求 的实际包装数量为准. 注: 以上包装方式根据客户要求而定, 包装以实际出货为 准.

is based on the actual number of packages to the customer requirements. 3.Module pallet packaging items as follows: 3-1.Storage life:3 months. Storage conditions:<40℃. Relative humidity:<90%R.H. 3-2.Module if not used within 48 hours, before launch the need for baking, baking temperature: 125 ℃, 8 hours. 3-3. Pallet packaging each plate is 100 PCS.The actual number of module pallet packing which is based on

the actual number of packages to the customer requirements.



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