当前位置:首页 >> 机械/仪表 >>

晶圆切割处理


Wafer mount & detape Machine System

Dyna Tech Co.,Ltd
TEL:82-31-962-9746 FAX: 82-31-962-9747 E-mail:sskwak@dynatech.co.kr http://www.dynatech.co.kr PDF created with pdfFactory trial version www.pdffactory.com

Table of Contents
1. Feature 2. MDS process 3. Function of Each Unit 4. Conversion process 5. Special function (Dynatech patent) 6. MDS Capability Comparison Chart 7. Goal 8. Utility
Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

1.Feature 1. All process in a single machine 2. Safe handling for thin wafer 3. Stable tape removing device 4. Small Footprint 5. Easy conversion

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

2. Mount and Detape process

Wafer from CMG

UV
Lamination

Mount Tape

Bar Code printer (Optional item) Lamination Tape Remove Cassette In

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

3.Function of each unit

Wafer Mount

OCR Bar code (Optional item)

Tape remove Robert hand

Unloader

Frame transfer
Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

3.1 Wafer Transfer Robot hand
? Auto balance function ? Robot transfers wafer from CMG

3.2 Centering Unit
? High accuracy Wafer Centering ? Safe handling for thin wafer ? No need conversion

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

3.3 Ring frame stock & Frame transfer
? Frame transfer holds a frame ?Frame transfer carries frame to mount table ? Put frame on the frame chuck ? Auto conversion function

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

3.4 Wafer Mount
? Attach dicing tape to wafer after air blower and suction cleaning ? Round cutting ? Turn over(180?)mounted frame after over(180? mounting

3.5 B/G Tape Remove
?Clean the chuck before work ? Peeling bar removes B/G tape ? Tool free conversion

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

3.6 OCR Bar code printing System (Option)
? CCD Camera reads wafer ID. ? Bar code prints wafer ID ? Attach label to frame tape

3.7 Unload Frame Cassette
? After label printing, frame placed on the rail ? Pusher slides finished frame into frame cassette ? 2 Floors elevator loads dual frame cassettes

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

4. Conversion Process
RECIPE BUTTON

Auto conversion

MANUAL CONVERSION

RING FRAME PICKER

RING FRAME BUFFER

START

RAIL WIDTH

MOUNTER CHUCK

TAPE WIDTH DETAPE CHUCK OCR PRINT POSITION WAFER HAND I.D CAEMRA POSITION CUTTER POSITION

BOND ROLLER POSITION

PEER BAR POSTION

END

MAGAZINE CHECK

END

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

4. Conversion process
Manual conversion

Mount & Detape chuck - Tool free

Wafer hand

Cutter width -Tool free

Auto conversion Ring frame Buffer

Wafer & frame transfer

In/outlet Rail width

Tape width Simple & Convenience

ID Camera position

Peeling bar position

OCR bar code position

PDF created with pdfFactory trial version www.pdffactory.com

5. Special function (Dynatech Patent)
Chuck cleaning unit
- Clean the chuck surface before wafer loading - Prevent wafer damage & breakage

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

5. Special function (Dynatech Patent)
Tape remove unit
- No need to parameter adjustment depend on wafer thickness - Automatic adjustment depend on wafer condition from CMG (Wafer size & thickness) - Prevent wafer damage & breakage (Spring tension control)

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

6. MDS Capability Comparison Chart
No 1 2 3 4 5 6 7 8 9 10 Comparison Items Footprint Tape Changeover Time Chuck Surface Cleaner Tape Width Adjustment Cutter Blade Lifetime Tape Consumption Set Up Time UPEH Conversion Time Remove Bar (Tape rem oval) Chuck Table Remove Tape Air Locker Convenience DYNATECH (Lapmaster) 1830(d) x 2400(w) x 2240(h) mm 10 minutes Built in Automated 20,000 times 8”(per 1pc) ― 300mm 12”(per 1pc) ― 400mm 1 week 8” : 30pcs 12” : 28pcs Within 15 minutes Special function to prevent wafe r breakage (Patent Pending) Reasonable price(Less than 6 0% approx.) Available Easy changeover Tape (10 minutes) Available to individual T 2345(d) x 2230(w) x 2100(h) mm 15~20 minutes Not available Manual 10,000 times 8”(per 1pc) ― 320mm 12”(per 1pc) ― 430mm More than 1 week 8” : 20pcs 12” : 18pcs More than 30 minutes Easy wafer breakage D 2050(d) x 3700(w) x 1900(h) mm 30 minutes Not available Manual No Cutting Function 8”(per 1pc) ― 290mm 12”(per 1pc) ― 390mm More than 1 week 8” : 22pcs 12” : 20pcs More than 30 minutes No data

11 12 13

High price Not available Narrow space to change Tape Not easy De-Tape Roll Not available to use Stand Alone No data

High price Available No data

14

CMG & Communication

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

7. Goal
1. Speed (UPH) 2. Wafer Size : 25 wafer / h : 8 & 12 inch

3. Wafer Alignment : < 0.05mm 4. No wafer broken rate & Zero Void 5. Precut, Normal and UV tape capability 6. The operation system can be select in-line 7. Air cleaning function to eliminate the particle of chuck table 8. Easy conversion
Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

8. Utility
? Controller ? Monitor ? Power Supply ? Air Supply ? Weight ? Machine size ? Case : PLC : LCD Touch : AC220V, 1P, 60Hz : 0.5Mpa, Dia 10 hose : 800kgs : 2400(L) x 1500(W) x 2200(H) : SUS Frame

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com

Simple & Convenience
PDF created with pdfFactory trial version www.pdffactory.com


相关文章:
晶圆切割机_图文
晶圓切割機 一.目的 儀器介紹 晶圓切割的目的,主要是要將晶圓上的每一顆晶粒(...晶圆切割处理17页 免费 晶圆 13页 免费 晶圆---简介 15页 免费 ...
晶圆制造工艺-ETCH
晶圆制造工艺流程 1、表面清洗 2、初次氧化 3、CVD(Chemical Vapor deposition)...晶圆切割处理17页 免费 晶圆---简介 15页 免费 晶圆 13页 免费 ...
晶圆切割 开槽grove
晶圆切割 开槽grove_电子/电路_工程科技_专业资料。晶圆切割 开槽groveApplications...晶圆切割处理 17页 免费 晶圆切割刀片技术资料 暂无评价 34页 免费 用热激光切割...
晶圆处理工程用语
是指搭载处理后之遮光罩,晶圆等基板之收纳匣 盒,及将基板由处理装置取出之机构...切割不足,蚀刻不足 side etching 侧面蚀刻 D8219 D8220 D8221 D8222 D8223 ...
晶圆(Wafer) 制程工艺学习
切割 晶圆经过所有的制程处理及测试后,切割成壹颗颗的 IC。举例来说:以 0.2 微 米制程技术生产,每片八吋晶圆上可制作近六百颗以上的 64M DRAM。 封装 制...
不同晶圆清洗技术的介绍与分析比较
(1997)[38] 使用雷射清除微粒的设备清洗成本估计其平均每片晶圆处理价格需 1.09~1.52 美元。 FSI 发展出来的低温动力清洗系统, 而 使用 SEMATECH 的成本估计...
晶圆处理工程用语_图文
晶圆处理工程用语 D.1 基本、共同用语 编号 编号 D1001 D1002 用语(英文/中文) 用语(英文/中文) unloader 卸载机、卸货机 Indexer 指针器,索引器 用语说明用语...
2017年晶圆切割机行业现状及发展趋势分析 (目录)
2017 年全球及中国晶圆切割机现状调研及 市场前景走势分析报告 报告编号:2066031 中国产业调研网 www.cir.cn 晶圆切割机 2017 年全球及中国晶圆切割机现状调研及...
晶圆处理工程用语_图文
晶圆处理工程用语_其它_高等教育_教育专区。晶圆处理工程用语 编号 D1013 用语(英文/中文) Carrier box 运载盒 用语说明 指为要输送或保管晶圆之容器 . 在制造...
晶圆制造工艺流程
货前需做何动作 答:Seasoning(陈化处理) 何谓 Seasoning(陈化处理) 答: 是在蚀刻室的清净或更换零件后, 为要稳定制程条件, 使用仿真 (dummy) 晶圆进行数次的...
更多相关标签: