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晶圆切割处理


Wafer mount & detape Machine System

Dyna Tech Co.,Ltd
TEL:82-31-962-9746 FAX: 82-31-962-9747 E-mail:sskwak@dynatech.co.kr http://www.dynatech.co.kr PDF created with pdfFac

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Table of Contents
1. Feature 2. MDS process 3. Function of Each Unit 4. Conversion process 5. Special function (Dynatech patent) 6. MDS Capability Comparison Chart 7. Goal 8. Utility
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1.Feature 1. All process in a single machine 2. Safe handling for thin wafer 3. Stable tape removing device 4. Small Footprint 5. Easy conversion

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2. Mount and Detape process

Wafer from CMG

UV
Lamination

Mount Tape

Bar Code printer (Optional item) Lamination Tape Remove Cassette In

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3.Function of each unit

Wafer Mount

OCR Bar code (Optional item)

Tape remove Robert hand

Unloader

Frame transfer
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3.1 Wafer Transfer Robot hand
? Auto balance function ? Robot transfers wafer from CMG

3.2 Centering Unit
? High accuracy Wafer Centering ? Safe handling for thin wafer ? No need conversion

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3.3 Ring frame stock & Frame transfer
? Frame transfer holds a frame ?Frame transfer carries frame to mount table ? Put frame on the frame chuck ? Auto conversion function

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3.4 Wafer Mount
? Attach dicing tape to wafer after air blower and suction cleaning ? Round cutting ? Turn over(180?)mounted frame after over(180? mounting

3.5 B/G Tape Remove
?Clean the chuck before work ? Peeling bar removes B/G tape ? Tool free conversion

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3.6 OCR Bar code printing System (Option)
? CCD Camera reads wafer ID. ? Bar code prints wafer ID ? Attach label to frame tape

3.7 Unload Frame Cassette
? After label printing, frame placed on the rail ? Pusher slides finished frame into frame cassette ? 2 Floors elevator loads dual frame cassettes

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4. Conversion Process
RECIPE BUTTON

Auto conversion

MANUAL CONVERSION

RING FRAME PICKER

RING FRAME BUFFER

START

RAIL WIDTH

MOUNTER CHUCK

TAPE WIDTH DETAPE CHUCK OCR PRINT POSITION WAFER HAND I.D CAEMRA POSITION CUTTER POSITION

BOND ROLLER POSITION

PEER BAR POSTION

END

MAGAZINE CHECK

END

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4. Conversion process
Manual conversion

Mount & Detape chuck - Tool free

Wafer hand

Cutter width -Tool free

Auto conversion Ring frame Buffer

Wafer & frame transfer

In/outlet Rail width

Tape width Simple & Convenience

ID Camera position

Peeling bar position

OCR bar code position

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5. Special function (Dynatech Patent)
Chuck cleaning unit
- Clean the chuck surface before wafer loading - Prevent wafer damage & breakage

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5. Special function (Dynatech Patent)
Tape remove unit
- No need to parameter adjustment depend on wafer thickness - Automatic adjustment depend on wafer condition from CMG (Wafer size & thickness) - Prevent wafer damage & breakage (Spring tension control)

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6. MDS Capability Comparison Chart
No 1 2 3 4 5 6 7 8 9 10 Comparison Items Footprint Tape Changeover Time Chuck Surface Cleaner Tape Width Adjustment Cutter Blade Lifetime Tape Consumption Set Up Time UPEH Conversion Time Remove Bar (Tape rem oval) Chuck Table Remove Tape Air Locker Convenience DYNATECH (Lapmaster) 1830(d) x 2400(w) x 2240(h) mm 10 minutes Built in Automated 20,000 times 8”(per 1pc) ― 300mm 12”(per 1pc) ― 400mm 1 week 8” : 30pcs 12” : 28pcs Within 15 minutes Special function to prevent wafe r breakage (Patent Pending) Reasonable price(Less than 6 0% approx.) Available Easy changeover Tape (10 minutes) Available to individual T 2345(d) x 2230(w) x 2100(h) mm 15~20 minutes Not available Manual 10,000 times 8”(per 1pc) ― 320mm 12”(per 1pc) ― 430mm More than 1 week 8” : 20pcs 12” : 18pcs More than 30 minutes Easy wafer breakage D 2050(d) x 3700(w) x 1900(h) mm 30 minutes Not available Manual No Cutting Function 8”(per 1pc) ― 290mm 12”(per 1pc) ― 390mm More than 1 week 8” : 22pcs 12” : 20pcs More than 30 minutes No data

11 12 13

High price Not available Narrow space to change Tape Not easy De-Tape Roll Not available to use Stand Alone No data

High price Available No data

14

CMG & Communication

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7. Goal
1. Speed (UPH) 2. Wafer Size : 25 wafer / h : 8 & 12 inch

3. Wafer Alignment : < 0.05mm 4. No wafer broken rate & Zero Void 5. Precut, Normal and UV tape capability 6. The operation system can be select in-line 7. Air cleaning function to eliminate the particle of chuck table 8. Easy conversion
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8. Utility
? Controller ? Monitor ? Power Supply ? Air Supply ? Weight ? Machine size ? Case : PLC : LCD Touch : AC220V, 1P, 60Hz : 0.5Mpa, Dia 10 hose : 800kgs : 2400(L) x 1500(W) x 2200(H) : SUS Frame

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