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BS2S7HZ7803
DOC. FIRST DATA ISSUE No.

EC-10707 30.JUL.2010

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REVISION
IDENT.

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REF. PAGE PARAGRAPH DRAWING No.

REVISED No.

SUMMARY

CHECK & APPROVAL

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Description: This specification covers L-band to I and Q base-band tuner intended for use in digital modulated satellite receiver. [1] GENERAL SPECIFICATIONS 1-1 Receiving frequency range 1-2 Input signal level per channel 1-3 Nominal RF input impedance 1-4 Local frequency range 1-5 Channel Selection system 1-6 AGC input voltage 1-7 I/Q Output LPF cut off frequency(-3dB) 10MHz to 34MHz, variable(2 MHz step) 1-8 Nominal I/Q output level 0.6Vp-p at 1kohm load impedance 1-9 Nominal I/Q output impedance 50 ohm 1-10 Operating Voltage B2,B4 3.3V ± 0.165 V DC 1-11 Absolute maximum rating voltage B1A 25V DC, 400mA Max. B2,B4 -0.3~4.0V DC AGC,SDA,SCL -0.3~B2+0.3V DC Note)Breakdown voltage of each terminal is provided for in the state of nominal voltage. 1-12 Circuit block diagram Figure 1 1-13 Connection diagram Figure 2 1-14 Mass 21g 1-15 Storage condition Temperature 15 deg.C to 35 deg.C Humidity 25 %RH to 75 %RH Period 6 months 1-16 Environmental characteristics RoHS compliant (RoHS refers to the "DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND
OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment.")

950MHz to 2150MHz -65dBm to -25dBm 75ohm (F-connector) 950MHz to 2150MHz PLL synthesizer(Clock:16MHz) 0V to 3.3V 0V : Max. gain 3.3V : Min. gain

1-17 Attention items: 1) This unit contains components that can be damaged by electro-static discharge. Before handling this unit, ground your hands, tools, working desks and equipment to protect the unit from Electronic Static Destroy. 2) Avoid following actions; a)to store this unit in the place of the high temperature and humidity. b)to expose this unit to corrosive gases. [2] MECHANICAL SPECIFICATIONS 2-1 Dimension and mounting details 2-2

Figure 3

F-connector Strength: Chassis must not be deformed at 0.98N*m of the bending moment and must be connected electrically. F-connector clamping torque: Chassis must not be deformed when the nut is built at 0.98N*m of the clamping torque and must be connected electrically.

2-3

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[3] ENVIRONMENTAL SPECIFICATIONS (ELECTRICAL FUNCTIONAL OPERATION GUARANTEE) 3-1 Operating Temperature -10℃ to +60℃ Humidity Less than 85% 3-2 Storage Temperature -20℃ to +85℃ Humidity Less than 95% [notice] Water vapor pressure 6643Pa max. No condensation. Please be careful that sudden temperature changes may cause condensation during storage, and such condensation may cause corrosion. [4] Test condition 4-1 Supply voltage 4-2 Ambient temperature 4-3 Ambient humidity 4-4 I/Q output level [5] ELECTRICAL SPECIFICATIONS No. ITEM 5-1 5-2 5-3 5-4 5-5 Noise Figure RF input VSWR Gain deviation AGC control range 3rd order intermodulation(2 tone)
3rd order intermodulation

B2,B4 3.3V ± 0.1V DC 25℃ ± 5℃ 65% ± 5% 0.6Vp-p at 1kohm load impedance (Testing Condition is showed from 4-1 to 4-4) CONDITION SPECIFICATION MIN. TYP. MAX. UNIT at AGC voltage=0V 8 12 dB 950MHz to 2150MHz 2.0 2.5 950MHz to 2150MHz 7 10 dB AGC voltage: 0 to 3.3V 65 80 dB input level is -25dBm 40 60 dB
Desired signal : Fo undesired signal :
(Fo+38.36MHz,Fo+76.72MHz) or (Fo-38.36MHz,Fo-76.72MHz)

IM3
Fo Fo+38.36MHz Fo+76.72MHz

LPF_Fc=22MHz

5-6 5-7 5-8 5-9 5-10

5-11 5-12

I/Q phase balance I/Q gain balance Pass band flatness of BB LPF Local oscillator signal leak at RF input terminal Phase noise 1kHz offset 10kHz offset 100kHz offset PLL lock up time Current consumption Clock out level Clock out frequency error
RF output VSWR RF output gain

-3 -2

0 0 -68 -85 -85 -95

+3 +2 2 -63

deg. dB dB dBm
dBc/Hz dBc/Hz dBc/Hz

freq. offset is 100kHz freq. offset is 100kHz 0.1MHz to fc×0.7 950 to 2150 MHz measured at I/Q out

15 170 25 15 2.0 -80
-5

ms mA mA uA
Vpp

within VT±5% VT is tuning voltage

B2 B4 AGC

3.3V 3.3V

5-13 5-14
5- 15 5- 16

200 40 50 3.3 +80
2.5 +5

Rectangular wave form (*1) -10℃ to +60℃ 950MHz to 2150MHz measured at RF out

0
2.0 0

ppm
dB

*1: Since the amplitude value is influenced of the circuit connected to the latter part from the “CLOCK OUT” terminal, please check in an actual circuit.

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6-3. I2C bus characteristic(SCL,SDA) Item MIN Input high voltage 2 Input low voltage -0.3 SCL clock rate

MAX 3.6 0.8 400

UNIT V kHz

6-4. The interface of this tuner is as following figure.

DIRECT CONVERSION IC with PLL SYNTHESIZER
"IX2610VA"

SCL
220Ω 220Ω

SDA

33pF

33pF Tuner inside

SCL [7] PIN LIST PIN NAME PIN No.
B1B 1

SDA PIN DESCRIPTION

B1A
B4

2
3

B2 Q out I out AGC SDA SCL
CLK OUT

4 5 6 7 8 9 10

Voltage supply of LNB B. Please ground it with a 1000pF ceramic capacitor. Voltage supply of LNB A. Please ground it with a 1000pF ceramic capacitor. 3.3V supply for RF Booster Amp of tuner. 3.3V supply for tuner. Please keep a ripple at power supply less than 10mVp-p. Output for Baseband“Q” Output for Baseband“I” AGC voltage input. I C-Bus for PLL IC. Bus clock speed is 400kHz maximum. 4MHz output.( rectangular wave form)
2

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[9] Reliability 9-1. High temperature high humidity load (40deg.C, 90% RH, 500h) 1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial value. 2) After cycling DUT in the constant chamber at 40deg.C/90-95% RH in on state, for total 500h, leave the DUT at room temperature and humidity for 2h and then measure value after test. 3) Must meet the specifications of Table 17. 4) The contact resistance of F-connector must be less than 0.02 ohm. (*) 9-2. High temperature load (70deg.C, 40% RH, 500h) 1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial value. 2) After leaving DUT in the constant chamber at 70+/-2deg.C/40% RH for total 500h, leave the DUT at room temperature and humidity for 2h and then measure value after test. 3) Must meet the specifications of Table 17. 9-3. Cold test (-25deg.C, 500h) 1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial value. 2) After leaving DUT in the constant temperature chamber at -25deg.C for 500h, leave the DUT at room temperature and humidity for 2h and then measure the values after test. 3) Must meet the specifications of Table 17. 9-4. Shock (686 m/s , 6 planes, 3 times) 1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial values. 2) Using the shock tester, apply shock of 686 m/s2 three times to each of 6 planes and then measure the values. 3) Must meet the specifications of Table 17. 4) This test is to be conducted using a single tuner. 9-5. Vibration (10-55 Hz, 1.5 mm, in each of three mutually perpendicular directions, each 2 times) 1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial values. 2) Using the vibration tester, apply motion having an amplitude of 1.5 mm (constant), the frequency being varied uniformly between 10 and 55 Hz, to DUT, for 2h in each of three mutually perpendicular directions (X, Y and Z, total of 6h). After the test, measure the values. 3) Must meet the specifications of Table 17. 4) This test is to be conducted using a single tuner. 9-6. Heat shock test (1 cycle=1h (-25deg.C; 0.5h, 85deg.C;0.5h), 100 cycles)) 1) After leaving DUT at room temperature and humidity for 24h or longer, measure the initial value. 2) Using the heat shock tester, apply heat shock to DUT. After the test, measure the values. 3) Must meet the specifications of Table 17. 4) The contact resistance of F-connector must be less than 0.02 ohm. (*) 9-7. Solderability of terminal Pretreatment of heating terminal at 150deg.C for 1h is performed and leave it at room temperature for 2h or longer. Immerse 1.9 mm length of terminal (from the tip) to be soldered into rosin (JIS-K-5902), isopropyl alcohol (JIS-K-8839 or JIS-K-1522, rosin concentration (10-35% range) approx. 25% by weight unless otherwise specified) or equivalent solution for 3–5s, and then immerse the length of the terminal into a pool of molten solder (Sn/3.0Ag/0.5Cu, or equivalent) at 240 +/-2deg.C for 3s.Dipped terminal portion shall be wetted by more than 95%. (Excluding the cutting plane of the chassis) 9-8. Soldering heat resistance Immerse the terminal mounted on a PCB (1.6t thick) into solder at 350±5deg.C for 3.0-3.5 seconds or at 260 +/-5deg.C for 10 +/-1 seconds. Remove the PCB from the solder and leave it for 1 hour at room temperature. The test sample shall show no degradation in appearance and electrical characteristics.
2

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9-9. ESD protection Table 16; ESD Test Condition (IEC61000-4-2 Compliant) terminal Limits condition RF_IN +/-6kV DC Air discharge (coaxial center) (The varistor is connected between LNB terminal and GND.) 150pF/330ohm, each 5 times Others +/-200V DC Contact discharge 150pF/330ohm, each 5 times

Table 17 item I/Q phase noise NF I/Q gain balance I/Q phase balance Local frequency specification (initial values)±2.0 dB Less than 12dB (initial values)±1.0dB (initial values)±2.0deg. (initial values)±100KHz condition IQ output level: 0.3Vp-p (differential 0.6Vp-p) RF input lebel:-45dBm Measured at IQ out .AGC voltage=0V IQ output level: 0.3Vp-p (differential 0.6Vp-p) RF input lebel:-45dBm Measured at IQ out

(*)Method of measuring contact resistance Center-contact Insert the gauge pin(φ0.8mm) to F-connector. Measure the resistance between the gauge and the center-contact of F-connector. Outer-shell Connect the plug(3/8-32 UNEF-2B) to F-connector at 29.4N?cm of the clamping torque. Measure the resistance between the plug and chassis. (Measuring device: Milliohm meter) ?F-connector is made from iron. If the plating is peeled off, rust might occur to surface of F-connector. But it makes no influence of electric specifications, under contact resistance is less than 0.02 ohm. ?The cutting plane of chassis and shield cover is not plated, therefore rust might occur. But it makes no influence of electric specifications.

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Fig.1

CIRCUIT BLOCK DIAGRAM

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RF IN B4(3.3V) SDA CLOCK OUT SCL Q OUT I OUT B2(3.3V) B1A B1B

AGC(0-3.3V)

RF OUT
MODEL No.

BS2S7HZ7803

Network Analyzer
Demodulator IC

+ -

+ -

SPEC

EC-10707

(Attention) From CLOCK OUT to demodulate line is as short as possible.

No.

Fig.2 Connection diagram
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EC-10707

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EC-10707

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pad×4


partition_A×33



partition_B×33



partition×60



frame×2



outer box×1

antistatic sheet 259±8
35 0± 8 8 ± 420

Unit : mm Quantity: 300pcs Fig.4 Packing figure

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