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20V P沟道增强型MOSFET(MOS管)


20V P-Channel Enhancement-Mode MOSFET

VDS= -20V RDS(ON), Vgs@-4.5V, Ids@-2.8A = 100 mΩ RDS(ON), Vgs@-2.5V, Ids@-2.0A = 150 mΩ

XP2301L
3

Features
Adv

anced trench process technology High Density Cell Design For Ultra Low On-Resistance Fully Characterized Avalanche Voltage and Current Improved Shoot-Through FOM we declare that the material of product compliance with RoHS requirements.
2 1

SOT– 23 (TO–236AB)

3

D

▼ Simple Drive Requirement ▼ Small Package Outline ▼ Surface Mount Device G 1 2
Maximum Ratings and Thermal Characteristics (TA = 25oC unless otherwise noted) Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current 1) Maximum Power Dissipation TA = 25 C TA = 75 C Operating Junction and Storage Temperature Range Junction-to-Case Thermal Resistance Junction-to-Ambient Thermal Resistance (PCB mounted)
2) o o

S

Symbol VDS VGS ID IDM PD TJ, Tstg RqJC RqJA

Limit -20 ±8 -2.3 -8 0.9 0.57 -55 to 150

Unit V

A

W
o

C

o

C/W

140

Note: 1. Repetitive Rating: Pulse width limited by the Maximum junction temperation 2 2. 1-in 2oz Cu PCB board 3. Guaranteed by design; not subject to production testing

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XP2301L
ELECTRICAL CHARACTERISTICS Parameter Static Drain-Source Breakdown Voltage Drain-Source On-State Resistance Drain-Source On-State Resistance Gate Threshold Voltage Zero Gate Voltage Drain Current Gate Body Leakage Gate Resistance Forward Transconductance Dynamic
3)

Symbol

Test Condition

Min

Typ

Max

Unit

BVDSS RDS(on) RDS(on) VGS(th) IDSS IGSS Rg gfs

VGS = 0V, ID = -250uA VGS = -4.5V, ID = -2.8A VGS = -2.5V, ID = -2.0A VDS =VGS, ID = -250uA VDS = -9.6V, VGS = 0V VGS = ±8V, VDS = 0V

-20

69 83

100 150 -0.95 -1 ±100

V mΩ mΩ V uA nA Ω

-0.45

VDS = -5V, ID = -4.0A

6.5

S

Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Source-Drain Diode Max. Diode Forward Current Diode Forward Voltage
Note: Pulse test: pulse width <= 300us, duty cycle<= 2%

Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss VDS = -6V, VGS = 0V f = 1.0 MHz VDD = -6V, RL = 6Ω ΙD = ?1Α, VGEN = -4.5V RG = 6Ω VDS = -6V, ID = -2.8A VGS = -4.5V

15.23 5.49 2.74 17.28 3.73 36.05 6.19 882.51 145.54 97.26 pF ns nC

IS VSD IS = -0.75A, VGS = 0V -0.8

-2.4 -1.2

A V

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XP2301L

SOT-23

NOTES:
A L 3 1 V G 2 B S DIM A B C D G H J J K L S V MIN 0.1102 0.0472 0.0350 0.0150 0.0701 0.0005 0.0034 0.0140 0.0350 0.0830 0.0177 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M,1982 2. CONTROLLING DIMENSION: INCH. INCHES MAX 0.1197 0.0551 0.0440 0.0200 0.0807 0.0040 0.0070 0.0285 0.0401 0.1039 0.0236 MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.35 0.89 2.10 0.45 0.177 0.69 1.02 2.64 0.60

C D H K

0.037 0.95

0.037 0.95

0.079 2.0 0.035 0.9 0.031 0.8
inches mm

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XP2301L Tape & Reel and Packaging Specifications for Small-Signal Transistors, FETs and Diodes
Embossed Tape and Reel is used to facilitate automatic pick and place equipment feed requirements. The tape is used as the shipping container for various products and requires a minimum of handling. The antistatic/conductive tape provides a secure cavity for the product when sealed with the “peel–back” cover tape. ? Two Reel Sizes Available (7"and 13",) ? SOT–23, SC–70/SOT–323, ? Used for Automatic Pick and Place Feed Systems SC–89, SC–88/SOT–363, SC–88A/SOT–353, ? Minimizes Product Handling SOD–323, SOD-523 in 8 mm Tape ? EIA 481, –1, –2 Use the standard device title and add the required suffix as listed in the option table below (Table 1). Note that the individual reels have a finite number of devices depending on the type of product contained in the tape. Also note the minimum lot size is one full reel for each line item, and orders are required to be in increments of the single reel quantity.
SOD-323 8 mm SC-59, SC-70, SC-75,SOT-23 8 mm SC-88, SOT-363 T1 Orientation 8 mm SC-88A, SOT-353 T1 Orientation 8 mm

Direction of Feed

Typical Reel Orientations

Table 1. EMBOSSED TAPE AND REEL ORDERING INFORMATION
Package Tape Width (mm) 8 8 8 SC–70/SOT–323 8 8 SC–89 8 SC–88/SOT-363 8 8 8 SC–88A/SOT-353 8 8 8 8 SOD-523 8 330 (13) 10,000 T3 4 4 4 4 330 178 330 178 330 178 330 178 (13) (7) (13) (7) (13) (7) (13) (7) 10,000 T3 3,000 T1 10,000 T3 3,000 T1 10,000 T3 3,000 T1 10,000 T3 3,000 T1 4 4 4 Pitch mm Reel Size mm(inch) 178 330 178 330 178 Devices Per Reel and Minimum Order Quantity (7) (13) (7) (13) (7) Device Suffix 3,000 T1 10,000 T3 3,000 T1 10,000 T3 3,000 T1

SOT–23

SOD-323

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EMBOSSED TAPE AND REEL DATA FOR DISCRETES CARRIER TAPE SPECIFICATIONS

K t Top Cover Tape B1 K0 See Note 1 D

P0

P2

10 Pitches Cumulative Tolerance on Tape ± 0.2mm( ± 0.008’’ )

E A0 F B0 P Embossment Center Lines of Cavity D1 For Components 2.0mm x 1.2mm and Larger W

For Machine Reference Only Including Draft and RADII Concentric Around B0

User Direction of Feed

10

o

R Min Bar Code Label Tape and Components Shall Pass Around Radius “R” Embossed Carrier Bending Radius Without Damage 100 mm (3.937 ’’) Maximum Component Rotation 1 mm Max Typical Component Cavity Center Line

*Top Cover Tape Thickness(t 1 ) 0.10mm (0.004’’ )Max.

Embossment

Tape

Typical Component Center Line

1 mm(.039’’ ) Max 250 mm (9.843’’) Camber (Top View) Allowable Camber To Be 1 mm/100 mm Nonaccumulative Over 250 mm

DIMENSIONS Tape Size 8mm B1 Max D 1.5+0.1mm - 0.0 (.059+.004’’ - 0.0) D1 E F 3.5 ± 0.05mm (.138±.002’’) 5.5 ± 0.05mm (.217 ± .002’’) 7.5 ± 0.10mm (.295 ± .004’’) 11.5 ± 0.1mm (.453 ± .004’’) K P0 P2 2.0 ± 0.1mm (.079 ± .002’’) RMin TMax 25mm 0.6mm (.98’’) (.024’’) 30mm (1.18’’) WMax 8.3mm (.327’’) 12 ± .30mm (.470 ± .012’’) 16.3mm (.642’’) 24.3mm (.957’’)

4.55mm (.179’’) 8.2mm 12mm (.323’’) 12.1mm 16mm (.476’’) 20.1mm 24mm (.791’’)

1.0Min 1.75 ± 0.1mm (.039’’) (.069±.004) 1.5mmMin (.060’’)

2.4mm Max 4.0 ± 0.1mm (.094’’) (.157 ± .004’’) 6.4mm Max (.252’’) 7.9mm Max (.311’’) 11.9mmMax (.468’’)

Metric dimensions govern - English are in parentheses for reference only. NOTE 1: A 0 , B 0 , and K 0 are determined by component size. The clearance between the components and the cavity must be within .05 mm min. to.50 mm max., NOTE 2: the component cannot rotate more than 10 o within the determined cavity. NOTE 3: If B1 exceeds 4.2 mm (.165”) for 8 mm embossed tape, the tape may not feed through all tape feeders.

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EMBOSSED TAPE AND REEL DATA FOR DISCRETES
T Max Outside Dimension Measured at Edge 13.0mm ± 0.5mm 1.5mm Min (.512 ±.002’’) (.06’’) A
20.2mm Min (.795’’)

50mm Min (1.969’’)

Full Radius

G Inside Dimension Measured Near Hub

Size 8 mm 12mm 16mm 24 mm

A Max 330mm (12.992’’) 330mm (12.992’’) 360mm (14.173’’) 360mm (14.173’’)

G 8.4mm+1.5mm, -0.0 (.33’’+.059’’, -0.00) 12.4mm+2.0mm, -0.0 (.49 ’’+ .079’’, -0.00) 16.4mm+2.0mm, -0.0 (.646’’+.078’’, -0.00) 24.4mm+2.0mm, -0.0 (.961’’+.070’’, -0.00)

T Max 14.4mm (.56’’) 18.4mm (.72’’) 22.4mm (.882’’) 30.4mm (1.197’’)

Reel Dimensions
Metric Dimensions Govern –– English are in parentheses for reference only

Storage Conditions Temperature: 5 to 40 Deg.C (20 to 30 Deg. C is preferred) Humidity: 30 to 80 RH (40 to 60 is preferred ) Recommended Period: One year after manufacturing (This recommended period is for the soldering condition only. The characteristics and reliabilities of the products are not restricted to this limitation) www.ic-jiazhi.com Tel:400 660 8382

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Shipment Specification

CPN
LABEL LABEL

LABEL 10Reel/Inner Box 30KPCS/Inner Box

Dim(Unit:mm)

195mm*195mm*150mm
10 Reel
3000PCS/Reel 8000PCS/Reel (SOT-723,SOD-723)

80KPCS/Inner Box (SOT-723,SOD-723)

Dim(Unit:mm)

460mm*400mm*420mm

LABEL

MARK

12 Inner Box/Carton 360KPCS/Carton
960KPCS/Carton (SOT-723,SOD-723)

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