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PCB软硬结合板技术详述


软硬结合板的详细介绍
Detail Introduction of Rigid-Flex Printed Circuit Board

Product Application

Application for Rigid-Flex

Application for Rigid-Flex

/> Application for Rigid-Flex

Application for Rigid-Flex

Application for Rigid-Flex

Application for Rigid-Flex

Application for Rigid-Flex

Application for Rigid-Flex

Application for Rigid-Flex

Application for Rigid-Flex

Application for Rigid-Flex

Rigid-Flex Boards ? Multi-Flex Boards ? Flex-Rigid Boards ? Hybrid Boards ? COF ?

Product Tendency

COG V.S. TAB

SMT mounting

TAB

FPC

Application for Rigid-Flex
( COG + Rigid-Flex) ( To Combine with COF !! )

Product Roadmap

Technology Development
Pine Pitch technology/ 2-L materials/ Equipment Laser /Cu plating

Product Roadmap
Fine pitch for display S/S &D/S COF HDI Flex-Rigid for Handheld Rigid Flex for DSC&DV Multi-Flex for Mobile

Plasma/Dimension Control/ Vacuum Lamination Design Rule/Punch/ Lamination Q-Lamination/ Materials/ Clean Room

S/S, D/S-Flex for NB & hinge

TIME

Rigid-Flex Boards Currently and Future Plan
Process or Feature Capacity 4L-Multi-Flex 6L-Hybrid 6L-Rigid-Flex Sf/mon Inner layer Outer layer Mass production, Now 300 K 400 K 300 K 10,000 4/4~3/3 mil line/space 4/4~3/3 mil line/space Limited , Q1/2005 600 K 800 K 600 K 20,000 3/3~2/2mil line/space 3/3~2/2 mil line/space (0.9 min hole copper thickness) 0.5 mm
2+n+2, staggered, stacked, buried , via in pad

Future , Q3/2005 1 KK 1.2 KK 1 KK 35,000 2/2 mil by LDI 2/2 mil or 1/1 mil Line /space for COF 0.45 mm Full menu in mass production Halogen free LPI (Liquid-Photo-image) Halogen free >10 Layer Lead free OSP Base on 100% each only. Not the summary.

BGA HDI

0.65 mm 1+n+1

Material Solder Mask Layer count

2-L, 3-L FCCL Non-flow prepreg Coverlay Flexible S/M(epoxy) 6~8 layer HASL, ENIG, OSP

Flexible-prepreg Flexible S/M(epoxy) 8~10 layer Imm/Sn, Imm/Ag

Surface finish

Materials Introduction

Rigid Flex Board Technology Roadmap –Materials
A: Investigation B: Evaluation C: Proto Type Development D: Limited Production E: Mass Production
Project Application Discussion: Process/Product Feature Status
Q 3 0 3 Q 4 0 3 Q 1 0 4 Q 2 0 4 Q 3 0 4 Q 4 0 4 2 0 0 5

Remarks

Material

FCCL --2 L material (Adhesiveless) --3 L material (With adhesive) Coverlayer LPI (PI base) Bonding sheet Bond Ply (With PI) Non-flow prepreg Flexible S/M (Epoxy base) Silver film/paste Stiffener

E

E B E E E E E E

2 L: Kyocera, ThinFlex 3 L: Taiflex, Rogers, Dupont, Kyocera, Microcosm LP I: Nippon Polytech

Isola, Polyclad Tasuta/DuPont Aluminum,stainless, FR4,PI, PET

Bonding Sheet

3 L material (With adhesive)

Coverlay FCCL Coverlay

2 L material (Adhesiveless)

Bond Ply : Adhesive : Copper

2L materials have good dimension stability, bending, and electronic migration performances than 3 L, but high cost and low peeling strength.

: PI

Material—Laminates (FCCL)
單 / 雙面銅箔基板: 經由膠體使銅箔與介質體做結合 線?之成形 2L / 3L

Material – Coverlay (覆蓋膜)
Protect conductors from outside environment Provide electrical insulation between conductors Reduce stress on conductors

Bonding sheet (Bond-ply / Sheet adhesive / Adhesive)
Bond-ply / Sheet adhesive: 隔絕?導電體面與外界環境的接觸 Multi-Layer / Rigid-Flex print circuit application

Bond-ply

Sheet adhesive

Material illustration
2 Layer - Adhesiveless / All Polyimide

D/S
Cu PI Cu 18 - 35um 25 - 50um 18 - 35um

S/S

3 Layer - Conventional
Copper Acrylic/Epoxy PI Acrylic/Epoxy Copper

D/S
18 - 35um 10 - 20um 25 - 125um 10 - 20um 18 - 35um

S/S

Material choice for Bending performance
Material

Material Structure
Copper
? oz ? oz ? oz

Remark
? mil ? mil ? mil Adhesive Adhesive Adhesive-Less

Type Type A Type B Type C

Base film
1 mil ? mil 1 mil

Coverlay

Type D

Thin Core( CCL) Combine with Flex material (FCCL)

(Bending times) Structure

40~70K
Type A Type C

70~100K
Type B Type C

Over 100K
Type C Type C

S/S + S/S Multi-Layer Rigid-Flex

Type D ( Bending times < 600 )

Flexible Materials Summary
Item Single-Sided FCCL Structure
CF AD BF

No. BF

Layer Base Film

Material Polyimide

AD
CF

Adhesive

Epoxy

Double-Sided FCCL

AD BF AD CF CF

Rolled and Annealed Copper (RA)

CF

Copper Foil

Electro-deposited Copper (ED)

2-Layer FCCL

BF

Sputtered Copper

CO

AD

Adhesive

Epoxy

Coverlay

AD

CO

Coverlay

Polyimide

Thickness (um) 12.5 25 50 15 20 25 12 18 35 12 18 35 12 18 35 15 20 25 12.5 25

Materials: 3L: Roger, Dopund, Kyocera, Taiflex, Microcosm 2L: Kyocera, Thinflex NF-PP: Isola, Nelco, Polyclad

Various thickness requirements for S/S and D/S flexible boards
Single-Sided FPC
Coverlay PI Film Adhesive Cu Foil Adhesive S/S FCCL PI Film Total Thickness Cost 25 12.5 12.5 25 20 35 18 25 20 25 25 135 95 Low 15 18 15 12.5 73 High Total Thickness 275 Cost Low 195 165 High D/S FCCL

Double-Sided FPC
Coverlay PI Film 25 12.5 20 18 20 25 20 18 20 12.5 15 18 15 12.5 15 18 15 Adhesive 25 Cu Foil 35

Adhesive 25 PI Film 25 Adhesive 25 Cu Foil 35

Adhesive 25 PI Film PTH 25 30

12.5 12.5 30 30

Product Structure

Single side + Single side
Coverlay FCCL Bonding Sheet FCCL Coverlay

Adhesiveless Area for Flexibility

Single side + Single side with GND ASSY
Top Side GND ASS’Y by solder Solder FCCL Bond Adhe. Sheet FCCL

Bot. Side GND ASS’Y by solder

Multilayer ( 4 layer )

Top Side GND Bond Adhe. Sheet FCCL ( Inner-layer ) Bond Adhe. Sheet FCCL ( Inner-layer ) Bond Adhe. Sheet Bot. Side GND

Air Gap

Rigid-Flex Board ( I )
Solder Mask

Copper Foil PP
Copper

Copper Foil PP Coverlay

D/S FCCL

PI PI

Adhesive

Coverlay PP Copper Foil

PP Copper Foil Solder Mask

Rigid-Flex Board ( II-1)
Solder Mask

Copper PP D/S CCL D/S CORE CCL

Copper PP D/S CCL Coverlay

Coverlay

Rigid-Flex Board ( II-2 )

Rigid-Flex Board ( II-3 )

Rigid-Flex Board ( II-4 )

Rigid-Flex Board ( III )

S/M Cu I S/S FCCL (L1) Adhesieve 2 mil FR4 Cu H/H (L2/3) Adhesieve S/S FCCL (L4) Cu I S/M Stiffener

Rigid-Flex Board ( IV )
L1 8 mil 無銅箔基板 N.F. P.P. L2/3 Cover-layer

補強材 L4

Rigid Flex Board Technology Roadmap –-Structure
Project Application Discussion: Process/Product Feature Status
Q 3 0 3 Q 4 0 3 Q 1 0 4 Q 2 0 4 Q 3 0 4 Q 4 0 4 2 0 0 5

Remarks

Structure

Handy product Pocket product Cell-phone DSC DV Mobile

Hybrid board (coverlayer only) 4 layers without coverlayer 6 layers with coverlayer 8 layers with coverlayer (2 air gap) Multi flex board (without FR-4) 4 ~6 layers 6 layers with HDI Rigid flex board (with FR-4) 4 layers with 2 layers flexible 4 layers with 1 layer flexiable

DSC, Car, Industrial. E E E Hinge, Mobile. E D DSC, DV, Mobile. E D

Hybrid board

Multi flex board Rigid flex board

4 layers multi flex board (after SMT) 6 layers hybrid board with cover-lay (DSC product)
Cu 0.5 oz 1080 * 1 5 mil core Cu H/0 Cover lay 2.5 mil core Cu H/H 1080 * 2
62mil

4 layers rigid flex board

8 layers hybrid board with cover-lay (2 air gap)
Cu 0.5 oz 1080 × 1 2.5 mil core 2.5 mil core No-Cu CCL 2.5 mil core

5 layers multi flex board (after SMT)

Hinge board for hand-phone

Cover lay

Flexible FR-4: A Low-Cost Replacement for Polyimide-based Circuits Sources: Circuit Tree Posted: 06/01/2004

Normal 4-L FR-4 board

Flexible 4L-FR4

Flexible 6&8L FR-4 with one air gap

Flexibility test

Flexible FR-4 is a valid replacement technology for applications with low- to medium-flexure requirements and where per piece cost savings is critical.

Process flow chart

Manu. Process ( I )
F.P.C. MATERIAL SHARING C.N.C DRILLING PRE-TREATMENT P.T.H DRY-FILMINATE EXPOSURE DEVELOP ETCHING STRIPPING LAMINATE PLATING(Pb/Sn,Au,Ni) PUNCH ELCTRUCAL TEST ASSMBLY ELECTRICAL (FUNCTION) TEST INSPEC & PACKING F.Q.A COMPONENTS COVER-FILM C.N.C DRILLING ART-WORK,DRAWING OPERATION-FILM FILM-INSPEC COVER-FILM PUNCH TOOLING STFFENER PUNCH

Manu. Process ( II )

Main Equipment & Technology

Major Manufacture Equipment List
No 1 2 3 4 5 6 7 ITEM Automatic-Shearing Quick-lamination Sensor punch Single cylinder puncher Multi-cylinder puncher D.E.S line for Thin Core Vacuum quick laminator

Rigid Flex Board Technology Roadmap –-Process and equipment
Project Application Discussion: Process/Product Feature Status
Q 3 0 3 Q 4 0 3 Q 1 0 4 Q 2 0 4 Q 3 0 4 Q 4 0 4 2 0 0 5

Remarks

Process & equipment

Handy product Pocket product Cell-phone DSC DV Mobile

DES (fig 1) Quick lamination Small panel size (fig 2) Large panel size (fig 3) Vacuum quick lamination (fig 4) Pre-lamination (fig 5) Punch (fig 6) Method Board profile punch Gold finger punch Tooling Steel punch tooling Normal punch tooling Sensor punch (fig 7) Fig 3

E E E E E E

For FR-4 material with coverlayer

E E E E E Fig 5

+/- 0.05 mm

Fig 1

Fig 7

Fig 2

Fig 4

Fig 6

Clean room

Technology Roadmap – Imaging
A: Investigation B: Evaluation C: Proto Type Development D: Limited Production E: Mass Production
Attribute Application Discussion: Process/Product Feature
Status

Q 3 0 3

Q 4 0 3

Q 1 0 4

Q 2 0 4

Q 3 0 4

Q 4 0 4

2 0 0 5

Remarks

Inner layer

Controlled impedance + fine pitch BGA

100um/100um line/space (1 oz) 75um/75um line/space (H oz) 50um/75um line/space(H oz) 50um/50um line/space Laser direct image Flex board inner layer

E E D C E E

< 50um/50um is applied on BGA substrate & Flip chip substrate Need LDI+Semi Additive production, still high cost Common for O/L not I/L Min 50um/50um L/S for flex board For 75um/75um design : CuT= base copper + plating copper Requires thinner foil / copper reduction & Requires semi additive Good product experience, still high cost CAM STATION Plot film Develop film Resist Coating Stabilize film Register/Frame Press malyer Conventional Direct Image Resist Coating Laser Exposure Develop Resist Etch Copper Strip Resist AOI

Outer layer

100um/100um line/space 75um/75um line space (CuT <0.7) 75um/75um line space (CuT <1.0) 50um/50um line space 1/3 oz foil 3~5 ?m Ultra-thin copper foil Semi additive Laser direct image

E E D C E D C D

Roller coater

Copper reduction : ? oz to ? oz

Materia l Conventional copper foil Reveres Side Treated Foil

Advantage of LDI * High resolution : 50/50um * Good accuracy: +/- 25um * Good uniformity

UV Exposure AOI Develop Resist Inspection Etch Copper Strip Resist AOI

Technology Roadmap – Mechanical Drilling
Attribute Application Discussion: Process/Product Feature Status
Q 3 0 3 Q 4 0 3 Q 1 0 4 Q 2 0 4 Q 3 0 4 Q 4 0 4 2 0 0 5

Remarks

Registration control

High layers count + fine pitch (<1.0 mm) Eventually notebook and automotive

Rigid flex material

Stack tolerance +/- 125um Stack tolerance +/- 100um Stack tolerance +/- 87.5um Equipment Hitachi Topper Pluritec PI mixed material

E E D E E E E

Standard production +5% cost Cpk is currently 1.0 (+15% cost) Provide good performance of accuracy in small hole drilling Parameters for specific wall Roughness

Control point of +/- 3.5 mils stack tolerance 1. 2. 3. 4. A/W dimension control (+/- 1 mil) Inner layer dimension control (+/- 3 mil) X-ray drilling control (2 mil per section) Hitachi machine only

Supplier / Brand

Hitachi

Topper

Pluritec

Speed (rpm) Min. drill bit (mm) Accuracy (mil) Equipment Quantity

160000 0.1 mm 50um (Min. 1 mil) 11

160000 0.1 mm 50um(Min. 1 mil) 15

110000 0.2 mm 75um(Min. 50um) 64

Technology Roadmap – Aspect Ratio
Attribute Application Discussion: Process/Product Feature Statu s
Q 3 0 3 Q 4 0 3 Q 1 0 4 Q 2 0 4 Q 3 0 4 Q 4 0 4 2 0 0 5

Remarks

Aspect ratio (thickness ÷ drill size)

Server, backplane and thick boards Blind via – smart phone, PDA

180mil 10:1aspect ration 250mil 10:1 aspect ratio 105 mil 10.5:1 aspect ratio 180mil 13:1 aspect ratio 280mil 12.8:1 aspect ratio 250mil 16:1 aspect ratio Blind via aspect ratio 1:1 Stacked via 1.2: 1 1.5: 1 aspect ratio (all cases)

E E E D D C E E D E E

Panel plate + pulse plate + pattern plate. Note: additional panel plate and pulse plate steps needed for 16:1 A/R Up to 6.25mm thick board

Aspect ratio for blind via (depth ÷ lasing diameter) Rigid-Flex boards Handy product Pocket product

Plasma etch + de-smear for all: 1.Thick board 2.High Tg or Low Dk material 3.Blind or stacked via 1. Alkaline chemicals will attack PI and adhesive layer. 2. Well Lamination

1. Dry de-smear 2. Surface activity modification

Differential Pulse Reverse Plating

DC Plating

Vertical

Horizontal
Differential Pulse Reverse Plating

Tepla

Plasma Etching

Hole size 250um Board thickness 2.625mm A/R=10.5:1

Technology Roadmap – Blind and Buried Via
Attribute Application Discussion: Process/Product Feature Status
Q 3 0 3 Q 4 0 3 Q 1 0 4 Q 2 0 4 Q Q 3 4 0 0 4 4 2 0 0 5

Remarks

Material Type

Hand phone, PDA, smart phone, blue tooth.

Resin Coated Copper Laser drillable pre-preg Thermount Normal pre-preg Polyimide 1+n+1 (fig 1) 2+n+2 (fig 2) Sequential Lamination (fig 3) Stacked via (fig 4) Filled via (fig 5) Filled via + core cap (fig 6) Filled via + build up (fig 7 a,b) Full menu with FR408/Nelco-13 Full menu with Halogen Free

E E E E E E E E E D D D E E

More expensive than pre-preg
1067 (1), 1067(2), 1086 (1)

High reliability option
1080(1), 2116(1) Rigid flex board

Build up structure

Extra plate, extra lam 2X extra plate, extra lam Extra lam Dedicate plating chemical

Figure 1

Figure 3

Figure 5

Figure 7 a Min. via size: 250/100uml , Min. Pad size: 406.4uml Capture land

Target land of L2 Figure 2 Figure 4 Figure 6 Figure 7 b Target land of L3 Min. via size: 100um Min. Pad size: 250um

Technology Roadmap – Electrical
Embedded passives are passive components placed between the interconnecting substrates of a PCB.The high level of current interest is primarily focused on capacitors and resistors since they represent the majority of passive components used on a circuit board.
Project Application Discussion: Process/Product Feature Status
Q 3 0 3 Q 4 0 3 Q 1 0 4 Q 2 0 4 Q 3 0 4 Q 4 0 4 2 0 0 5

Remarks

Capacitance

Back panel – signal integrity and noise reduction at high frequency Cell phone – component count reduction

Thin film Sanmina BC2000 (62.5umcore) Shipley InSite (deposited silica ) Dupont Interra Thin film Gould Ni+Cr Gould Ni+Cr+Al+Si Shipley InSite (<100 nm, doped-platinum + Cu foil) Thick film Du Pont PI/metal

A B

Sequential lamination also available

25um gap – polyimide or Kapton film B B B Requires additional dry film and etching steps to achieve. (available PWB chemistries)

Resistance

B

Copper NiCrAlSi Resistor layer Polyimide Copper

Commercial material: Capacitance

Low ?

High ?

Insite material

Samina BC2000 & EmCap; Du Pont HiK; Vantico Probelec CFP; 3M CPly; Gould Electronic TCC. Resistance Gould Electronic Ni-Cr; Ohmega Technologies Ni-P; Shipley Platinum; Asahi Chemical Carbon.

Rigid Flex Board Technology Roadmap – Surface Finishes and Lead Free
Attribute: Application Discussion: Process/Product Feature Status
Q3 03 Q 4 0 3 Q 1 0 4 Q 2 0 4 Q 3 0 4 Q 4 0 4 2 0 0 5

Remarks

Solder ability and reliability

All customers

HASL Electro less Ni/immersion Au Selective ENIG + OSP Selective ENIG + immersion Ag Gold finger (tab) - Electrolytic Deep tank gold – Electrolytic Immersion Ag Immersion Tin OSP Lead free process

E E E E E E E E D

Leading alloy implemented Sub contracted service Entek 106 A, 106AX Immersion/Tin is popular on Flexible Boards ENTEK-OMI ENTEK CU-106AHT

IR Reflow Profile

4.0 3.5 3.0 w etting tim e (m in) 2.5 2.0 1.5 1.0 0.5 0.0

Cu106A

Cu106A HT
106A

Wetting time

HT Ni/Au Silver

ENIG

Immersion Ag
IR0 IR1 IR2 IR3

Rigid Flex Board Technology Roadmap – Quality and Reliability
Project Application Discussion: Process/Product Feature Status
Q 3 0 3 Q 4 0 3 Q 1 0 4 Q 2 0 4 Q 3 0 4 Q 4 0 4 2 0 0 5

Remarks

Quality System Certification

Telecom Automotive Computer

ISO 9001 ISO 9001: 2000 ISO 14000, QS 9000 TL 9000 TS 16949 100% inner layer AOI 100% outer layer AOI 100% Electrical Test 100% inner layer registration check 100% impedance check Gold finger AOI PerfecTest .MIT ( Mechanical Test) Interconnect Stress Test (200 cycles min)(fig.A) Thermal shock/cycle/IST –55? to 125?C Thermal shock/cycle/IST -65? to 155?C ISO14000

1994 2002 1998 2002 2004 E E E E E D E E E E E D Fig.A

Reliability

IPC 6012 Class 3 Automotive High Relability

Flexibility test

ISO9000

Fig.B

Technology Roadmap – Laminate Materials including Halogen Free
Project Application Discussion: Process/Product Feature Status
Q 3 0 3 Q 4 0 3 Q 1 0 4 Q 2 0 4 Q 3 0 4 Q 4 0 4 2 0 0 5

Remarks

High Tg

10 Layer and above

170 Tg (6 suppliers) 180 Tg (2 suppliers) BT (1 supplier) Getek Rogers 4003/4350 Nelco 4000 –13 Rogers 3210 Taconic RF35 /Megtron 140-150 Tg (3 suppliers) 170 Tg (3 suppliers) RCC

E E E E E E D C E D D

UL.Approval CAF Resistant

Low Loss High speed, frequency need RF

UL.Approval

Halogen Free

Environmental

UL.Approval

compliance

List of suppliers: Nanya, Isola, Polyclad, Hitachi, Toshiba, EMC, Nelco, Rogers, Taconic, Sunitomo, Matsushita, GE
How to Strengthen CAF Resistance
Raw Material Selection: Upgrade Glass Wettability Improve Resin Thermal Resistance Reduce Copper Foil Roughness Varnish Control: Accurate Ingredient Viscosity Consistency Treatment Control: Void/Bubble Free, Low Volatile Content Minimum Embedded Conductive Inclusion Pressing Conditioning: Melt Viscosity/Flow Control

4-L Flexible FR-4 Board
P/N 846G4007B APPILCATION Automobile FEATURE 4 layers hybrid PCB SPECIFICATION Material Dielectric Layers Line width/space Finish thickness Surface finish Stiffener

FR-4 FR-4 1080 4 5/5 mil 12 mil Entek --

0.5 oz Cu FR4 1080
2.5 mil Core, Cu 1oz /1oz

4-L Multi-Flex Board
CVL PI Ad Cu I L1 Cu Ad PI Adhesieve CVL PI Ad Cu Ad PI Adhesieve L3 PI Ad Cu Ad PI Adhesieve L4 PI Ad Cu Cu I CVL Ad PI 12.5 (unit: um) 15 15 18 15 12.5 10 12.5 15 18 15 12.5 10 12.5 15 18 15 12.5 10 12.5 15 18 15 15 12.5

P/N 000F4461A APPILCATION Cell phone FEATURE 4 layers multi-flex board SPECIFICATION FCCL Dielectric Layers Line width/space Finish thickness Surface finish Stiffener

L2

CVL

3 layer, double side Adhesieve 10um 4 4/4 mil 330 um Immersion gold SUS301 T=0.2mm, 1/2H

5-L Multi-Flex Board
CVL L1 PI Ad Cu I Cu PI Adhesieve PI Ad Cu PI Adhesieve PI Ad Cu PI Adhesieve PI Cu Ad PI Adhesieve PI Cu Cu I Ad PI 12.5 (unit: um) 25 15 18 P/N 25 164F5A01A 10 12.5 APPILCATION 15 18 Cell phone 25 10 FEATURE 12.5 15 5 layers multi-flex board 18 25 SPECIFICATION 10 FCCL 25 18 Dielectric 15 Layers 12.5 Line width/space 10 25 Finish thickness 18 Surface finish 15 Stiffener 25 12.5

CVL L2

CVL L3

L4 CVL

L5

CVL

2 layer, single side Adhesieve 10um 5 4/4 mil 490 um Immersion gold 0.1mm myler(black) with 0.05mm 3M 467 adhesive

4-L Rigid-Flex Board
S/M L1 Cu I Cu PP CVL PI Ad Cu Ad PI Ad Cu Ad PI PP L4 Cu Cu I S/M 10 (unit : mil) 15 18 70 12.5 15 18 13 12.5 13 18 15 12.5 70 18 15 10

P/N 413F4A01C APPILCATION Digital Camcorder FEATURE 4 layers rigid-flex board SPECIFICATION Material Dielectric Layers Line width/space Finish thickness Surface finish Stiffener

L2/3 (FCCL)

CVL

Non flow PP + FCCL (2 layer, double side) 1080 1080 4 4 5/5 mil 0.3mm Immersion gold 7mil PI + 3M 9461 1 mil adhesieve

6-L HDI-Multi-Flex Board
S/M Cu I Cu Ad PI Ad Cu Ad PI Adhesieve CVL PI Ad Cu Ad PI Adhesieve L4 PI Ad Cu Ad PI Adhesieve CVL PI Ad Cu Ad PI Ad Cu Cu I S/M 20 25 17.5 12.5 12.5 12.5 17.5 15 12.5 15 12.5 15 17.5 12.5 12.5 15 12.5 12.5 17.5 15 12.5 15 12.5 15 17.5 12.5 12.5 12.5 17.5 25 20 L1/2 (FCCL)

micro via

P/N 167F6A01A APPILCATION Cell phone FEATURE 6 layers multi-flex board + HDI SPECIFICATION FCCL Dielectric Layers Line width/space Finish thickness Surface finish Stiffener

CVL

L3

CVL

L5/6

micro via

3 layer Adhesieve 10um 6 4/4 mil 0.4mm Immersion gold --

Example: Sample thickness Simulation
20 30 17.5x2+12.5x2+12.5 Cu Foil Plating D/S FCCL Coverlay S/S FCCL Adhesive PI Film Adhesive

cu1

15+12.5 12.5 co2 15+12.5 cu2 17.5+12.5+12.5 12.5 cu3 17.5+12.5+12.5

co1

la1 la2

Cu Foil

Adhesive
S/S FCCL Coverlay D/S FCCL

co3 co4 cu4

15+12.5 12.5 15+12.5

Adhesive

la3PI Film
Plating S. T.

17.5x2+12.5x2+12.5 30 20
( unit : um )

Total Thickness

407.5

GCE can supply the HDI-rigid & HDI-Multi-flex boards

To Modify The Structure Of Rigid-Flex Board for DSC
S/M Cu II Cu I Cu 0.5 oz 1080*1 Cu Dielectric Cu 1080*1 1080*1 Cu Dielectric Cu 1080*1 Cu Dielectric Cu 1080*1 1080*1 Cu 0.5 oz CU I Cu II S/M Original Design 0.6 0.4 0.8 0.7 3 0.7 5 0.7 3 3 0.7 2.5 0.7 3 0.7 5 0.7 3 3 0.7 0.8 0.4 0.6 39.7

L1

L1

L2

L2

L3/4

L3/4

L5

L5

L6

L6

S/M Cu II Cu I Cu 0.5 oz 1080*1 Cu Dielectric Cu 1080*1 Cu Dielectric Cu 1080*1 Cu Dielectric Cu 1080*1 Cu 0.5 oz CU I Cu II S/M Modify Design

0.6 0.4 0.8 0.7 3 0.7 8 0.7 3 0.7 2.5 0.7 3 0.7 8 0.7 3 0.7 0.8 0.4 0.6 39.7

Analysis of Mobile ( LG LP-3000 )

Structure Analysis
RPC (2Pics)
D/S

Camera Body Connector Conn. Solder ball. Connector Conn. Hot bar Conn.

Side-Key L6 S+S 2 layer Hinge D/S LCD-Base S/S FPC IR-module (8Pics) Camera-module S/S
D/S D/S D/S

No.1 No. 2

MP3 Function Write Light LED Carrier for LCD backline

Main FPC
Connector
(To Body RPC)

LCD COG Connector
(To Camera FPC)

Hot Bar
(To LED FPC)

Connector
(To LCD FPC)

Connector
(To Hinge FPC)

Connector
(To MP3 FPC)

COG LCD Speaker LCD FPC

Hinge FPC

Micro Section Plan
Plan item 1.North Bump spec. 2.Line width&Space 3.Dielectric Layer T/K 4.Layer Count 5.FPC 2 or 3layer

Body RPC
8Layers Cu Bump Technique 4.45cm .Line width&Space 4mil/4mil 8.7cm

RPC 0.9mm

FPC ~0.13mm
2Layers DS

Side-Key
Steel Sheet 0.36mm

3.5cm

0.7cm

LCD-Base

Hinge

LCD-Base
7cm

FPC ~0.14mm
2Layers DS 5.8cm

COG
Black Tape 0.05mm

Black Tape 0.05mm Blue Tape 0.06mm

IR module

IR module
1ayers SS 1.2cm
PI Stiffener ~0.11mm Paste tape ~0.11mm

FPC 0.13mm

2.15cm

MP3 Function
PI Stiffener ~0.11mm

FPC 0.15mm
2Layers DS

3.8cm

4.7cm

LED-Base
5.1cm

FPC ~0.08mm
2Layers DS

0.7cm

Black Tape Gold Electric Cloth 0.1mm On Black Tape 0.2mm 0.2mm Gold Electric Cloth 0.1mm

Hinge

FPC 0.55mm

6Layers/Air Gap PI SS

CCD Stiffener 2.42mm

Hinge

4.15cm

3.6cm

Hinge

10.7cm

Camera module
FPC ~0.18mm
2Layers DS
0.8cm PI Stiffener ~0.11mm 0.75cm 1.5cm 0.5cm

FPC ~0.12mm
1Layers SS
1.1cm Ag Film

RPC ~0.61mm
6Layers

~0.02mm PI Stiffener ~0.11mm
1.4cm

1.4cm

2.1cm

2.15cm

1.1cm

1.1cm

North Bump Micro-section

Plating Cu

Plating Ni


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