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PrimeSTACK


PrimeSTACK

Documentation and Operating Instructions Product: Application: Revision: PrimeSTACK Converters and Inverters Rev. 2.3 30 October 2008

? Infineon Technologies

AG 2006 – All rights reserved

CONTENTS

1 2

Introduction The PrimeSTACK overview
2.1 2.2
2.2.1 2.2.2 2.2.3 2.2.4

4 5
5 8
8 8 9 10

PrimeSTACK – what is it? The right PrimeSTACK for each purpose
PrimeSTACK components PrimeSTACK PrimeSTACK IPM PrimeSTACK System

2.3 2.4

PrimeSTACK system integration Appropriate use PrimeSTACK type designation PrimeSTACK datasheet PrimeSTACK electronics
User interface and pin-out Power supply of the electronics The digital inputs The digital outputs The analogue outputs Fault output and reset Time management The EiceDRIVER?

10 11

3

The PrimeSTACK in detail
3.1 3.2 3.3
3.3.1 3.3.2 3.3.3 3.3.4 3.3.5 3.3.6 3.3.7 3.3.8

12
12 13 18
19 20 20 21 22 22 24 25

3.4
3.4.1 3.4.2 3.4.3 3.4.4 3.4.5

PrimeSTACK protection concept
Monitoring the load current Monitoring of the IGBT saturation voltage Monitoring the DC-bus voltage (V option) Temperature measurement Temperature simulation (T option)

26
27 28 28 29 30

3.5
3.5.1 3.5.2 3.5.3 3.5.4 3.5.5 3.5.6 3.5.7

PrimeSTACK ancillaries and add-ons
DC-bus circuits (C-option) Fans (F-Option) Paralleling interface PD100 (M-Option) Optical Interface OEA240 (IO-Option) Chopper driver DR220 (D-option) Snubber capacitors Heatsink (G-, W-option)

30
30 32 33 33 34 35 35

3.6

PrimeSTACK sizes

37 38

PrimeSTACK traction

4

PrimeSTACK system integration
4.1 4.2 4.3 EMC concept Checklist for system integration Installation and commissioning

39
39 40 41
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? Infineon Technologie AG 2006

4.3.1 4.3.2 4.3.3

Connecting the controller Connecting the power terminals Earthing

41 41 43

4.4
4.4.1 4.4.2

Maintenance and repair on site
Maintenance Repair on site

43
43 43

4.5 4.6 4.7
4.7.1 4.7.2 4.7.3

Insulation concept IP class of protection Permissible environmental conditions
Operation Transport Storage

44 44 44
44 45 46

5

Safety notices
5.1 5.2 5.3 5.4 Transport and storage Commissioning Operation Maintenance Technical drawings
PrimeSTACK with air cooler PrimeSTACK with water cooler PrimeSTACK capacitor box Examples of PrimeSTACK systems

47
47 47 48 48

6

Appendix
6.1
6.1.1 6.1.2 6.1.3 6.1.4

49
49
49 52 55 56

6.2 6.3 6.4 6.5
6.5.1 6.5.2 6.5.3

Further associated documentation CE – declaration of conformity PrimeSTACK portfolio Indices
Index of terms List of figures List of tables

57 57 58 60
60 61 62

6.6 6.7

Conditions of use Contact

63 64

? Infineon Technologie AG 2006

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1 Introduction
This is the documentation for the PrimeSTACK product family. It describes the products ? ? ? PrimeSTACK, PrimeSTACK IPM and PrimeSTACK System

with regard to their technical features and thus gives all application relevant references and descriptions for the design-in, for the safe installation and the operation of the PrimeSTACK in an explanatory form. Further technical information can be found on the datasheet of the individual PrimeSTACK. This takes precedence over this document. The documentation begins with the question what the PrimeSTACK is in general. Then, building on the technical descriptions and the associated application options of the PrimeSTACK, all relevant details in dealing with the product family are described. Contained are: ? Descriptions and circuit diagrams of the PrimeSTACK electronics (interface, protection and monitoring electronics) ? The optional assemblies (electrical and mechanical) ? The Standards and certifications in use which where referenced for the development of the PrimeSTACK ? Description of the correct PrimeSTACK system integration and the EMC concept ? Technical drawings Please read this documentation completely before using the PrimeSTACK. Only in this way can a flawless and safe application be warranted. Also observe all safety notes (especially section 4 and 5).

ModSTACK? and EiceDRIVER? are registered Trademarks of Infineon Technologies AG.

Possibly other functions may be available, not described in this document. This fact, however, does not necessitate to provide such functions with a new controller or at the time of maintenance. The compliance of the document’s contents with hardware and software has been checked. Differences may still exist, however; a guarantee for total convergence can not be given. The information contained in this document is reviewed on a regular basis and changes required will be published with the next version. Recommendations for improvement are welcome. The document is subject to change without prior notice.

Reproduction, circulation or use of this document or of its content is permitted only with written authorisation. Contravention will be sued for damages. All rights are reserved including those arising from registered patents, trade names or designs.

? Infineon Technologie AG 2006

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2 The PrimeSTACK overview
This section introduces the PrimeSTACK product family. Fundamental features of the PrimeSTACK, its construction and possible fields of application are described. For technical details please read section 3 “The PrimeSTACK in detail”.

2.1 PrimeSTACK – what is it?
PrimeSTACK is a modularly constructed power electronic unit from Infineon (Figure 1). Its core are standardised base elements which may be omitted or added according to requirement. The attainable product spectrum extends from a straightforward single phase converter with simple functions for a few kW all the way to a complete water-cooled 4-quadrant 3-phase inverter in MW size with complex protection logic. Driver and protection logic

IGBT power modules

Heatsink

Figure 1: Construction of a standard PrimeSTACK with the three base elements: driver - power modules - heatsink

A PrimeSTACK consists of the following logical and physical components: ? Circuit topology of the power section. See also Table 1. The power section consists of Infineon 62mm IGBT modules. These are clearly categorised according to the power to be controlled and the circuit topology required. With the voltage classes 600V, 1200V and 1700V and module nominal currents up to 1600A per PrimeSTACK the following topologies are available: o ? B2I simple half-bridge o B2I single phase bridge o B6I three-phase bridge with/without break-chopper Control of the power section. The IGBTs are driven by the Infineon EiceDRIVER? integrated into the PrimeSTACK electronics. The electronics is adapted in accordance with the selected circuit topology of the power section and the implemented IGBT modules.

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Circuit topology
ZK+
TOP

Description ?B2I half-bridge According to the required power the following options exist:

L1
BOT

2, 3 or 4 IGBT modules paralleled in one PrimeSTACK for more power still: several paralleled PrimeSTACKs B2I single phase full bridge

ZK-

ZK+

Two fundamentally different versions: 2 or 4 IGBT modules in one PrimeSTACK, where one each or two parallel modules are operated as individual half-bridges 2 individual PrimeSTACKs each as a half-bridge circuit together acting as a B2I bridge B6I three-phase full bridge
ZK+

L1

ZK-

2 versions:
L1 L2 L3

one PrimeSTACK with 3 integrated IGBT modules where each is acting as an individual half-bridge three individual PrimeSTACKs each in half-bridge circuit and each with 2, 3 or 4 paralleled IGBT modules Brake chopper 2 versions: IGBT on DC+ or DC-: as a fourth module in a PrimeSTACK in B6I topology, where the other 3 IGBT modules each act as a half-bridge on request: as a separate PrimeSTACK with 2,3 or 4 paralleled chopper modules for high brake loads

ZK-

ZK+

ZK+

ZK-

ZK-

Table 1: Overview of the PrimeSTACK circuit topologies

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?

? ?

?

Protection of the system. According to requirements optional protection components are available in addition to the basic provision of standard self protection. The following physical parameters are monitored and/or measured in real time and are provided with “safe separation” as an analogue voltage value at the PrimeSTACK electronics interface: o Load current monitoring of each logical output phase (standard) o Bridge short circuit monitoring (standard) o Temperature monitoring with over-temperature protection (standard) o Monitoring of under-voltage supply of the controller; serves the safe switching of the IGBTs (standard) o Monitoring of DC-bus voltage incl. turn-off at over-voltage (optional) o Simulation of the junction temperatures of the IGBTs at hardware level to protect from transient over-temperature (optional) Cooling. According to application and power requirements: o Heatsink with forced air cooling (standard) o Water cooling DC-bus construction. Especially for the PrimeSTACK a DC-bus construction has been developed which requires a minimum of space whilst assuring the best possible electrical and thermal design. It consists of these components: o Capacitor box (incl. busbar) o Electrolytic capacitors o Snubber capacitors o Voltage sharing resistors Kit-set concept. If the power requirement exceeds that of a single PrimeSTACK then several PrimeSTACKs may be paralleled with or without DC-bus section. Optionally available is a specifically developed parallel interface as well as a DC-busbar to connect the individual DC-busses.

Figure 2: The PrimeSTACK kit-set concept

The PrimeSTACK and all its components are UL certified and designed and built under strict adherence to the relevant Standards.

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2.2 The right PrimeSTACK for each purpose
According to requirements the PrimeSTACK product family is suitably divided into three family members. 1. PrimeSTACK 2. PrimeSTACK IPM – head of the family and 3. PrimeSTACK System – the complete system solution Each of these family members consists of standard production components. Like kit-set, required components are added or omitted. Further, PrimeSTACKs are available as standard and traction versions. If not mentioned otherwise, reference is made to the standard version hereafter.

2.2.1 PrimeSTACK components
? PrimeSTACK Basic. This component is elementary to each PrimeSTACK. Only the requirements in power and circuit topology result in specific versions. The elements are: o EiceDRIVER? o PrimeSTACK electronics (wide range power supply, fault logic, protection logic) (see also section 3.3) o Standard protection concept (load current monitoring, temperature monitoring, bridge short circuit protection, monitoring of under-voltage supply of the electronics) PrimeSTACK Basic add-on. These components too are part of the standard PrimeSTACK, however, they vary with regard to numbers, voltage class and nominal current as well as application. o 62mm IGBT modules o Heatsink PrimeSTACK add-on. Encompasses all optionally available electronic assemblies or power components: o Temperature simulation o DC-bus voltage monitoring o Snubber capacitors o Brake chopper PrimeSTACK System add-on. Optional components with which a PrimeSTACK System is made from a PrimeSTACK: o DC-bus capacitor box o DC-bus capacitors o Voltage sharing resistors o Parallel interface

?

?

?

2.2.2 PrimeSTACK
This family member is the corner stone of the entire PrimeSTACK product family. Each PrimeSTACK consists of the following three elementary components: ? Control section (PrimeSTACK Basic) with integrated protection logic. The driver is formed by the EiceDRIVER? developed by Infineon. It is embedded in the partially standard and partially optionally available protection logic of the electronics (PrimeSTACK add-on).
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? Infineon Technologie AG 2006

?

?

Power modules (PrimeSTACK Basic add-on) always two, three or four power modules per PrimeSTACK. Design: Infineon 62mm IGBT modules always as a halfbridge. The final topology results from the interconnection of the individual 62mm modules. Heatsinks (PrimeSTACK Basic add-on) generally either air cooling or water cooling.

Figure 1 shows a PrimeSTACK in standard configuration consisting of driver with integrated protection logic, three 62mm IGBT modules each implemented as a half-bridge and the standard heatsink for forced air cooling. The application determines the interconnection of the IGBT modules as well as the additional protection option, an optical controller interface or the implementation of external ancillary circuitry (see section: “The PrimeSTACK in detail”).

2.2.3 PrimeSTACK IPM
IPM means Intelligent Power Module. It covers the same requirements as the PrimeSTACK described above. The supply, however, is without heatsink. This assures a maximum adaptation to the application. In short: PrimeSTACK IPM = PrimeSTACK minus heatsink.

Figure 3: PrimeSTACK IPM heatsink mounting

The PrimeSTACK IPM is mounted on the heatsink by customer. Support is provided by the Application Note AN2006-07 which describes this process and section 3.5.7 of this PrimeSTACK product documentation.

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2.2.4 PrimeSTACK System
Integrated driver with protection logic DC-bus with mounting frame and voltage sharing resistors Mounting plane: e.g. cabinet back wall

IGBT power modules. Here two 62mm modules per half-bridge combined to a B6I
Figure 4: Example of a PrimeSTACK System

Heatsink

The PrimeSTACK product family is completed by the PrimeSTACK System. It supplements the PrimeSTACK according to requirements with a DC-bus construction and/or a parallel interface (PrimeSTACK System add-ons) for parallel configurations with several PrimeSTACKs. The PrimeSTACK System depicted in Figure 4 as an example consists of three individual PrimeSTACKs with two power modules each in half-bridge configuration, heatsink, driver with monitor and protection electronics plus the DC-bus construction. Together the three individual half-bridges make up a powerful B6I three phase bridge with excellently matched components.

2.3 PrimeSTACK system integration
The integration of the PrimeSTACK into the surrounding system comprises the termination of control and power leads to standardised terminals: ? Control signals are accepted by the PrimeSTACK in CMOS standard or via fibre optic cable (optional). For the standard galvanic coupling the use of the SUB-D connectors assures a better EMC immunity compared to the IDC connector system. Both connector versions are compatible. On the power side robust screw terminals assure solid support for the DC and AC busbars. Per power module used in the PrimeSTACK an M8 bolt is required for the AC terminals and an M6 bolt for both the DC+ and DC- terminals. Other than in a pressure contact inside the power section the AC and DC power terminals are
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?

? Infineon Technologie AG 2006

mechanically non-critical and may be stressed liberally in the x-, y- and z-axis (see section 4.3.2 “Connecting the power terminals”). The PrimeSTACK is hence suitable for mechanically stressed as well as mostly immobile applications. ? The PrimeSTACK is designed within an EMC concept. This EMC concept, which is adhered to consequently, assures fault-free operation (see section 4.1 “EMC concept”).

2.4 Appropriate use
According to IEC 61800-5-1 the PrimeSTACK is a “converter section” of a “basic drive module (BDM)”. All members of the PrimeSTACK product family (PrimeSTACK, PrimeSTACK IPM and PrimeSTACK System) are open frame systems with a protection rating of IP00. They are designed for use in closed mobile or immobile installations. For their operation a user supply with suitable contactor arrangement and a controller are required. The PrimeSTACK is supplied without a fan as standard. The infrastructure required for cooling during operation has to exist in the switchboard. Please observe the safety notifications and installation and commissioning notes in section 4 and 5. The PrimeSTACK can be implemented universally. Typical applications are: ? ? ? ? Converter / inverter in immobile drive systems Wind and solar energy plants Traction UPS systems / flywheel storage

The PrimeSTACK may only be operated within the operating and safety conditions (section 5) listed in the datasheet and explained in this document. Further, mounting and commissioning notes (section 4) are to be observed. For damages resulting from ignoring these, solely the user is responsible.

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3 The PrimeSTACK in detail
This section describes the technical details of the PrimeSTACK which are necessary to understand the implemented functions and for a design-in.

3.1 PrimeSTACK type designation
The type designation gives a defined name for each PrimeSTACK variant. The most important electrical and mechanical data of the individual PrimeSTACK can be derived from it. Two type designations are differentiated: ? For PrimeSTACK System analogous to the ModSTACK? product family (see also www.eupec.com). ? For PrimeSTACK and PrimeSTACK IPM described here: All data is listed continuously without a space. For improved readability a hyphen separates the basic electrical data – to the left – from all standard or optional ancillary circuitry – to the right -. Options or customised modifications are listed at the end of the type designation in the same sequence and with a custom specific number. The sequence can be seen in Table 2. The type designation is explained with a sample PrimeSTACK of the type “2PS0600R12DLC-3G” with some added options. This is a forced air cooled PrimeSTACK in half-bridge configuration consisting of three paralleled IGBT half-bridges. The module nominal currents sum up to 600A. The chip generation is IGBT2. Full name Segregated name Place designation Posi For tion exam ple A 2 B C D E F G PS 0600 R 12 DLC -

2PS0600R12DLC-3G01C1VTB1IOM
2 A PS B 0600 C R D 12 E DLC F G 3 H G01 I C1VTB1IOM J

Meaning Circuit topology of the power section. The given number is the number of switches; here: 2 switches, thus half-bridge Type designation of the PrimeSTACK product family Installed nominal current of the power modules contained. Meaning here: 600A R=“reverse conducting“, i.e. each circuit has an antiparallel diode 12=1200V maximum blocking voltage divided through 100 Generation of the IGBTs used. Meaning here: Infineon low loss IGBTs of the second generation with EmCon Diode Hyphen – separates visually the basic electrical data from the additional information

Further possible data 6 (for B6I) Specifically graded values between 0100 and 1600 06 (for 600V) 17 (for 1700V) KE3, KT3 (Trench Fieldstop) KS4, DN2 (NPT) -

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H

3

I J G Gxx F W WC WS Wxx M IO B1 B3 V T Cxx D

G01

1 2 3 4

Sizes (see PrimeSTACK sizes); the number 2 or 4 shows, how many IGBT modules can be used in a PrimeSTACK, and thus defines its mechanical dimensions Cooling method. G=air cooler; 01=customised F (fan supplied) code W (water cooler) Meaning of the options indicated with “J“ Standard cooler for forced air cooling, fan is not included Air cooling with customised heatsink, xx = 01, 02 etc. Standard air cooling, fan is included Water cooler (W) made of aluminium Water cooler (W) with copper pipes (C) Water cooler (W) with stainless steel pipes (S) Water cooler (W) according to customised design (xx, e.g. 01, 02 etc.) Parallel interface Optical interface Cooler is sealed with sealing ring Mounting platform Voltage option for measurement and output of the DC-bus voltage Temperature option for real time simulation of the chip temperature DC-bus construction (C) for 600, 1200, 1700V, customised (xx e.g. 01) Integrated chopper, IGBT as BOT switch (between AC and DC-) Integrated chopper, IGBT as TOP switch (between AC and DC+) As D1, only without integrated chopper driver and on-off controller As D2, only without integrated chopper driver and on-off controller
Table 2: The PrimeSTACK type designation

3.2 PrimeSTACK datasheet
This section describes the layout and contents of the PrimeSTACK datasheet. The exact physical explanations can be found as an index in the appendix.

3.2.1.1 Structure and composition
All PrimeSTACK datasheets are composed the same. They contain individual blocks with special functional contents assigned. According to PrimeSTACK type the contents and extent can vary. The following blocks may be contained: ? Cover sheet: Basic information about the PrimeSTACK such as circuit topology, monitoring options and applied Standards. ? Electrical data: Defines the permissible minimal, typical and maximum parameters on the power side. ? Controller interface: Specifies the limit values for the controller ? Heatsink: Parameter to be fulfilled to be able to achieve the values listed under “Electrical data” ? Environmental conditions: Defines permissible environmental conditions which affect the PrimeSTACK externally. Also contained are the weight and the external dimensions. ? Mechanical drawing: The technical drawing depicting the PrimeSTACK in three different perspectives ? Circuit diagram: PrimeSTACK conceptual block diagram with all control and power in- and outputs.
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? Conditions of use and safety notices. The following describes the composition of the datasheet with the example of a PrimeSTACK 2PS1600R12KE3-4G and the parameters and values contained.

3.2.1.2 Headline
The headline can be found on each page of the datasheet.

1
1. - Technical information points out that the document is a datasheet. This specifies technical data for the correct use. - PrimeSTACK defines which product family is concerned (related product families: ModSTACK?, BipSTACK) - Data from the type designation (see also section “PrimeSTACK type designation”)

3.2.1.3 Cover sheet

1 2 3 4

5

1. Maximum steady state electrical corner data for permanent operation at the reference operating point (see Electrical data); cooling type.
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2. Characterisation of the PrimeSTACK. Note of the technical character of the datasheet. 3. - Details regarding the circuit topology of the power section (B6I, ?B2I or sim.) - Permissible load type: resistive - inductive load - Cooling type: forced air cooling - Possible field of application - Monitoring of current and temperature - Module (unit 2): listing of the 62mm IGBT modules which make up the power section of the PrimeSTACK. (Number of modules) x (Type of modules used) - Standard for the PWM signal interface to the PrimeSTACK. Here: CMOS. Optionally - an optical interface is available. - Which Standards and regulations does the PrimeSTACK fulfil. 4. 3D-pictureof the PrimeSTACK type described in this data sheet. 5. Block diagram of the PrimeSTACK. The designations (e.g. Unit 2) can be found under Electrical data.

3.2.1.4 Electrical data

1 2

3

1. Permissible operating conditions on the DC side Usually this will be the value for the permissible voltages of the DC-bus. 2. Permissible operating conditions on the AC side What permanent current at what voltage (both AC and DC) is permissible, what overload current and what switching frequencies are possible, what surge current will affect a shut-down and what losses will be generated by the power section when operating at nominal conditions.
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3. General values associated with electrical data Value of the maximum losses generated by the control unit of the PrimeSTACK. Very important data in this block make reference to the values and parameters of EMC and insulation structure. These values may not be exceeded under any circumstances.

3.2.1.5 Controller interface
This section describes the conditions necessary for the reliable operation of the controller (see also section 3.3). 1. Supply voltage of the wide range power supply and power loss of the controller 2. Main elements of the PrimeSTACK controller interface (see also section 6.2 “Further associated documentation”) 3. - Acceptable voltage limits of the digital inputs and outputs. - Monitoring of current and temperature (optionally also DC-bus voltage monitoring). The voltage given equates the parameter defined to the left (e.g. the controller gives out a voltage of typically 3.10VDC, when the current measured at the AC terminals is 717A). 4. Data for time management (see section 3.3.7)

1 2 3 4
3.2.1.6 Heatsink

1

2

Two basically different heatsinks exist: air cooled and water cooled. Depending on the cooling method used for the PrimeSTACK, only one of the heatsinks and datasheet blocks will appear which is explained as follows. 1. Air cooling: The values given define the operating point airflow/pressure drop as the intersection of the fan and heatsink characteristics in the permissible temperature
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range of -40 to +70°C. These values have to be adhered to for safe operation, as it is detailed in the block “Electrical data”. 2. Water cooling: The values given here correspond with those of air cooling. As an additional value the connection of water in and out is specified.

3.2.1.7 Ambient conditions
This block gives all those environmental parameters important for the safe operation of the PrimeSTACK. The individual terms are mostly self explanatory. 1. Required natural climatic conditions and/or caused by forced air with regard to temperature, humidity and installation level (height above sea level) during operation and storage. 2. - permissible mechanical stresses through vibration, shock of the entire PrimeSTACK and bolt torque at the AC and DC terminals - IP protection class and permissible pollution 3. mechanical dimensions and weight

1

2

3

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3.3 PrimeSTACK electronics
EiceDRIVER? ?X1“ - SUB-D interface (IDC compatible) Wide range power supply

PCB for signal evaluation with protection and fault logic Robust busbar with explosion protection

Current sensor

Figure 5: PrimeSTACK electronics Temperature measurement and evaluation with optional simulation NTC

Control

Driver plus SUB-D interface to user Supply Signal conditioning Galvanic separation Driver supply Protection logic

Fault

Optional: DC-bus voltage measurement and evaluation

Driver minus

Measured values

Current values measurement and evaluation

Auxiliary voltage generation

Figure 6: PrimeSTACK block diagram

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The PrimeSTACK electronics comprises the following elements and functions: ? User interface X1 (SUB-D), ? Driver for the IGBTs (EiceDRIVER?), ? Auxiliary voltage generation ? Protection and fault logic ? Evaluation and processing of the measured values ? Uniform EMC concept Figure 6 depicts a simplified block diagram detailing the co-operation of the controller with the rest of the system, in particular with the control and protection of the IGBTs.

3.3.1 User interface and pin-out
Depending on the circuit topology of the power section, the following pin numbers apply: 1. Half-bridge 25-pin 2. Three phase bridge B6I 37-pin B6I with/without chopper
Pin IDC
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 -----------------------

Half-bridge
Pin SUBD
1 14 2 15 3 16 4 17 5 18 6 19 7 20 8 21 9 22 10 23 11 24 12 25 13

Pin SUB -D
1 20 2 21 3 22 4 23 5 24 6 25 7 26 8 27 9 28 10 29 11 30 12 31 13 32 14 33 15 34 16 35 17 36 18 37 19

I/O
--IN OUT IN IN OUT IN IN OUT IN OUT OUT OUT IN IN OUT OUT IN IN OUT OUT OUT OUT OUT OUT OUT --IN OUT IN OUT --------OUT OUT

Signal
Shield (TE) Half-bridge A IGBT minus Half-bridge A Fault Half-bridge A IGBT plus Half-bridge B IGBT minus Half-bridge B Fault Half-bridge B IGBT plus Half-bridge C IGBT minus Half-bridge C Fault Half-bridge C IGBT plus Over-temperature GND digital VZK (V DC-bus) analogue Supply +13…30V DC Supply +13…30V DC +15V DC / 50mA +15V DC / 50mA Supply GND Supply GND Temperature analogue GND analogue I analogue out half-bridge A GND analogue I analogue out half-bridge B GND analogue I analogue out half-bridge C NC Chopper IGBT ON external Chopper Fault Chopper Reset Overvoltage (optional) NC NC NC NC GND digital GND digital

I/O
--IN OUT IN OUT IN IN OUT OUT IN IN OUT OUT OUT OUT OUT OUT OUT ----------OUT OUT

Signal
Shield (TE) IGBT minus Fault IGBT plus Over-temperature Supply +13…30V DC Supply +13…30V DC +15V DC / 50mA +15V DC / 50mA Supply GND Supply GND Temperature analogue GND analogue I analogue out GND analogue VZK (V DC-bus) analogue (optional) GND analogue Overvoltage (optional) NC NC NC NC NC GND digital GND digital

Table 3: Pin-out of the PrimeSTACK controller interface for IDC and SUB-D connectors

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The user interface, connecting the controller with the PrimeSTACK electronics, is implemented as a male SUB-D connector with bolt lock (UNC4/40 thread) compatible to IDC plug connectors. For superior EMC properties of the signal link we recommend the use of a round shielded cable. All signal cables provide “reinforced isolation”.

SUB-D connector (male)

SUB-D for IDC-ribbon cable

IDC system

3.3.2 Power supply of the electronics
The PrimeSTACK features a wide voltage range power supply. This allows operation from an unregulated supply voltage within the following limits1: VCC-min=13V < VCC < VCC-max=30V The supply voltage for a PrimeSTACK in B6I topology is connected to pin 26 or 8, in case of a half-bridge this is pin 16 or 4. Both pins are shorted internally. Theoretically it would therefore be sufficient to connect to one pin each2. For the ground potential we recommend to use the pins 28 and 10 for B6I or 18 and 6 for simple half-bridge especially provided for the supply to improve the EMC immunity (see also section 4.1 “EMC concept”). Stabilisation and regulation of the supply voltage is done internally. The regulated voltage is VCC-intern=15V and is present at the interface. The maximum permissible load of this terminal is Imax=50mA. If the input voltage drops below 13V the PrimeSTACK turns off. A voltagelow fault occurs (see section 3.3.6 “Fault output and reset”). This serves the protection of the IGBTs, as, once the supply voltage drops below 13V, the gate voltage of +/-15V for safe switching on and off of the IGBTs can no longer be guaranteed.

3.3.3 The digital inputs
Digital inputs (internal circuit see Figure 7) are those connector pins of the SUB-D plug at which the PWM signal or generally the digital turn-on and turn-off signal for the IGBTs is connected. The inputs are CMOS compatible. Therefore, the following applies to a signal at a digital input (in the range of 0…+15V):
Input A,B,C 330? 0n47 0n47 10k 2k2 EiceDRIVER?

TE

Mdig Mdig

Mdig

Figure 7: Internal input circuit of the digital inputs of the PrimeSTACK electronics

The values given in the window are referenced to the measured voltages directly at X1 (see Figure 5: “PrimeSTACK electronics”). Long leads may cause significant voltage drop between the cable ends. 2 We recommend to use as many spare leads as possible for the power supply (incl. ground). This increases the conductor square section and reduces parasitic influences (e.g. unintentional voltage drop)

1

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? ?

low high

< 4.0V > 11.5V

IGBT = Off IGBT = On

turn-off command for IGBT; VGE=-15V turn-on command for IGBT; VGE=+15V

The digital inputs use a common ground with the digital outputs. This ground potential is solely reserved for digital signals and is decoupled from other ground potentials by LC-filters. The digital inputs may be fed a maximum switching frequency shown in Figure . The limits are valid for the permissible temperature area.
20

15 fTakt max [kHz]

10

C2
5

C3 C4

0 100 200 300 400 INenn [A] @ 80°C je integriertem 62mm-IGBT-Modul

Figure 8: Maximum permissible PrimeSTACK switching frequency referred to module rated currents. Parameter: size (C2,3,4)

3.3.4 The digital outputs
All digital outputs (“half-bridge A, B, C fault; over-temperature; over-voltage; chopper fault”) are open collector outputs according to Figure 9. This means that a transistor is turned on internally of which the emitter (source) is at ground potential and the collector (drain) is open, hence not connected. In a fault situation the transistor is in blocking mode. The drain has to be pulled up to the required High potential by an external resistor. Limit values are: ? Vmax=30V ? Imax=15mA

36V

Mdig

Digital Output

/Error

47p

47p

Mdig

Mdig

TE

Figure 9: Internal circuit of the digital outputs of the PrimeSTACK electronics

The output current of maximum15mA limited by the external pull-up resistor should preferably be used to its full extend for good EMC performance. The digital outputs are
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referenced to a common potential “GND digital”. No other signals should be referenced to this ground.

3.3.5 The analogue outputs
Analogue are those outputs which carry processed measurement data (“VDC-bus analogue; temperature analogue; I analogue out half-bridge A, B, C”). All analogue outputs are referenced to a separate ground. Thus measured values are not disturbed by other signals. The load of the analogue outputs must not exceed 5mA.
Analogue Output 470R Rx 10p Mana Mana 2n2

Figure 10: Internal circuit of the analogue outputs of the PrimeSTACK electronics

According to the individual analogue output value an adjustment of the resistor Rx is done (Figure 10, Figure 9 and Table 4). Further explanations in section “PrimeSTACK protection concept”. Analogue output Temperature DC-bus voltage Load current Resistor value Rx 10k? 24k? 47k?

Table 4: Adaptation of the analogue output by variable resistor values

3.3.6 Fault output and reset
All fault outputs from the PrimeSTACK electronics are digital outputs (see section “The digital outputs”). The fault interfaces build a fault matrix. This is depicted in Table 5 and Table 6. Fault type Fault Voltage fault Temperature (Pin2) (Pin22) fault (Pin22) Driver fault ● Overcurrent ● DC-bus overvoltage ● ● electronics power supply voltage ● ● low Over-temperature of the power ● ● section Over-temperature of the electronics ● ●
Table 5: PrimeSTACK fault matrix for ?B2I half-bridge

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Fault type Driver fault half-bridge A Driver fault half-bridge B Driver fault half-bridge C Overcurrent DC-bus overvoltage Electronics power supply voltage low Over-temperature of the power section Over-temperature of the controller

Half-bridge A fault (pin2)

Half-bridge B fault (pin22)

Half-bridge C fault (pin5)

Voltage fault (Pin16)

Temperature fault (Pin6)

● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● ●

Table 6: PrimeSTACK fault matrix for B6I full bridge

A bullet point in one of the table cells means that a fault is present at this output. In this case the open collector transistor of the individual fault output is blocked. The external pull-up resistor brings the output to HIGH potential. If no fault is present, however, then the open collector transistor is turned on. Then the fault output shows the logic level ZERO or LOW. If a fault is set the PrimeSTACK electronics ignores incoming PWM control signals and the power section is turned off. The fault is registered (saved). If operation is to continue, the following conditions have to exist: 1. There must not be a status present which causes the generation of a fault condition 2. All inputs of the controller have to be at LOW level for a minimum of 9?s

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3.3.7 Time management
ton – X1 TOP toff – X1 BOT toff – X1 TOP ton – X1 BOT Minimalpuls X1 BOT

X1: HB x IGBT TOP

X1: HB x IGBT BOT

Gate (+/-15V): HB x IGBT TOP

Gate (+/-15V): HB x IGBT BOT

td-off

td-on

ton – IGBT TOP

ton – IGBT BOT

tTD

Figure 11: Time management of the PrimeSTACK electronics:

Size value / ?s

ton-min recommended 5

td-on typical 1.8

td-off typical 2.0

tTD typical 3.8

tmd typical 0.5

Table 7: Time management of the PrimeSTACK electronics:

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? ?

X1 Controller interface of the PrimeSTACK. SUB-D socket Minimum turn-on time (ton-min) recommended approximate value. If this falls below, the switch rise times of VCE and IC can increase significantly and produce increased switching overvoltages accordingly. Transition time for turn-on pulse (td-on) defines the processing time of the turn-on signal of an IGBT. Measured between the terminal X1 (SUB-D connector of the PrimeSTACK) and the output of the driver (gate of the IGBT). Identical times for TOP- (connected to DC+) and BOT (connected and DC-) IGBT. Signal time for turn-off pulse (td-off) Definition analogue td-on, however, with regard to the turn-off control pulse of an IGBT. Bridge interlock time (tTD) Control signal interlock between each other set on the driver site, referred to one individual half-bridge. As soon as one of both inputs is turned off, tTD starts. While tTD is active, a turn-on signal on the other channel is blocked. Only at the end of tTD it will be passed to the gate. Minimum pulse suppression (tmd) is filtering out signals coupled into the control cable; otherwise they can be misinterpreted by the PrimeSTACK as control signals. The indicated time is valid both for turn-on and -off pulses. Response time of the electronics (tA) Response time interval measured from the beginning of the incident (e.g. overcurrent, over-voltage etc.) to the beginning of an action. tA maximum 50?s 10?s 10?s

?

?

?

?

?

Fault type Over-voltage Over-current Bridge short circuit

Table 8: Response times of the PrimeSTACK electronics in the case of fault

3.3.8 The EiceDRIVER?
The EiceDRIVER? is a power driver. It is, embedded in the electronics, an essential part of the PrimeSTACK and serves the control of the implemented IGBTs inside the 62mm modules. It has been developed and designed especially for modern Infineon IGBT generations. Each EiceDRIVER? can control two logic switches where a maximum gate current of 30A is possible. Depending on the circuit topology a PrimeSTACK contains one (?B2I half-bridge), two (B2I single phase bridge) or three (B6I three phase bridge) EiceDRIVER?.
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Figure 12: EiceDRIVER?

The EiceDRIVER? is characterised by the following features: ? Reincorced isolation according to EN50178 (surge voltage test: 9.6kV) ? “Soft shut down” during short circuits for especially low over-voltages ? Maximum gate current or power per channel: +/-30A or 4W ? Maximum switching frequency: 60kHz ? For IGBTs up to 1.7kV blocking voltage or 1600A nominal current. Note: The EiceDRIVER? can be purchased both individually as well as integrated into a PrimeSTACK. A separate datasheet and separate application notes exist (see section 6.2 “Further associated documentation”).

3.4 PrimeSTACK protection concept
To protect the PrimeSTACK and its surrounding installation against damage, the PrimeSTACK protection concept has been developed. Data from the sensors are monitored in real time, processed, transferred via the analogue controller interface and compared with internal set values. If one of the measured values exceeds its internal maximum set value the PrimeSTACK turns itself off (with or without an interlock delay time). Additionally a fault signal is given out matching the reason for turn-off (see Table 5 and Table 6). The protection concept includes: 1. Monitoring the load current o Standard: Current measurement at each AC terminal with analogue actual value output in real time Overcurrent trip individually adapted (see datasheet) 2. Protection against bridge shorts o Standard: Permanent monitoring of the collector-emitter voltage of the IGBTs. Trip occurs within 10?s, when dVCE/dt ≠ 0, without a switching process being sensed, while the IGBTs are in On-state. 3. Monitoring the DC-bus voltage o Optional: Voltage measurement with analogue actual value output in real time Trip occurs application specific (see datasheet) 4. Monitoring the temperature
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o Standard: Temperature measurement via the NTC directly below the power module with analogue actual value output in real time Trip occurs at 80…85°C heatsink temperature (or 60…65°C for water coolers). This corresponds to a chip temperature of approx. 125°C in steady state thermal condition o Standard: Temperature measurement via NTC on the PrimeSTACK electronics Monitoring of the immediate ambient temperature during operation. If the ambient temperature exceeds 75°C the PrimeSTACK turns off. o Optional: Temperature simulation of the chip temperature In case of short term overload the temperature at the NTC can not immediately follow the actual chip temperature due to thermal capacity. To protect the chip from undetectable over-temperature, the actual chip temperature is simulated based on measurable values such as load current. If the calculated chip temperature exceeds 125°C the PrimeSTACK is turned off.

3.4.1 Monitoring the load current
The acquisition of the load current at the PrimeSTACK AC terminals serves two purposes. Firstly, the PrimeSTACK is protected against overcurrents by processing of the current measurement via the internal electronics. Secondly, an exact, processed, linear and currentproportional voltage signal of each AC terminal is provided at the controller interface. The current sensor employed makes use of the compensation principle. A current signal produced through induction is represented with a voltage and compensated to zero with the sensor electronics. The magnitude of the compensation voltage is directly proportional to the load current. A standardised current sensor is used in all PrimeSTACKs. The adaptation of the current-proportional voltage signal is done with burden resistors. According to the model, referencing of the nominal current is thus achieved to the datasheet voltage value. Independently of that, turn-off always occurs at Ianalog Out=10V By the model dependent value of the analogue output signal at nominal current a model specific adjustment for overload is possible. Overload trip may therefore vary between 150% and 300% of the PrimeSTACK nominal current. Relevant data of the current sensor: ? Insulation: Reinforced isolation according to EN50178 Test voltage: burst 5kV/50Hz/1s; surge 12kV/1.5/50?s ? Accuracy @ 25°C: <|+/-0.5|% ? Linear error < 0.1% for I<300A ? Temperature drift of the measured value = 0.01% / K referenced to I=300A ? Response time up to 30A: <1?s ? Response time for 30…270A: <0.5?s ? Frequency range: 0Hz (DC)…100kHz ? Temperature range: -40…85°C Due to its linearity, the high temperature stability and the high frequency range the currentproportional voltage signal is well suited for the use in control loops e.g. as set value or also as feedback signal (see Figure 13).

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20

90 80 70

18

16 60 Gain [dB] 14 50 40 30 10 20 8 Phase [degree]

12

Vout / Vin [dB] phi [°]
0,1 1 10 100 1000 10000

10 0
100000

6 Frequency [Hz]

Figure 13: Transfer characteristics of the PrimeSTACK current sensor versus the frequency of the load current

Depending on the circuit topologies of the PrimeSTACK power section differences exist in the analogue output of the current-proportional voltage signal: ? Simple half-bridge: Only one connection pin of the controller exists for the analogue output: Independently of the frame sizes (see 3.6 “PrimeSTACK sizes”) the AC currents of each 62mm module are individually measured, however, only the summed total current is brought out as a current-proportional voltage signal. B6I full bridge: A connected pin exists for each of the output phases of the power section at the PrimeSTACK controller interface. Each phase current is measured individually and given out as a current-proportional voltage signal.

?

3.4.2

Monitoring of the IGBT saturation voltage

If both the IGBTs on the DC+ and DC- rail in a half-bridge are conducting, the positive and negative potential of the DC-bus is short circuited. Such bridge shorts are actively inhibited by the EiceDRIVER? by interlocking the upper IGBT (collector on DC+) against the lower IGBT (emitter on DC-). If a bridge short still occurs it can not be detected by the AC current sensors. Whilst the IGBTs actively limit the short circuit current, this current, however, combined with the DC-bus voltage, generates enormous losses at the conducting IGBT. To recognise bridge shorts VCE voltage monitoring is used on the IGBTs. This is permanently active and monitors all IGBTs. If the collector-emitter voltage VCE on one IGBT suddenly rises without a control signal to turn off is present, then this is recognised as a short circuit. The “Soft Shut Down” integrated in the PrimeSTACK is activated. This affects, compared with other turn-off processes, a slow switching off of the short. Too high turn-off voltages generated otherwise by a high turn-off di/dt, which may exceed the blocking capability of the IGBT, are thus avoided.

3.4.3

Monitoring the DC-bus voltage (V option)

With this optionally available assembly the DC-bus voltage is measured and potential separated given out as an analogue bus-voltage proportional voltage signal to the PrimeSTACK controller interface. Firstly the DC-bus voltage is divided by the resistance ratio of the measuring resistor bridge. This value is then potential separated and via burden resistors normalised to 10V for the PrimeSTACK specific voltage class available at the VZK (VDC-bus) analogue output.
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Depending on the voltage class, the following reference levels apply: ? ? ? …06… …12… …17… 600V PrimeSTACK: 1200V PrimeSTACK: 1700V PrimeSTACK: VZKanalog=10V VZKanalog=10V VZKanalog=10V VZK=444V VZK=1000V VZK=1333V

The threshold at which the PrimeSTACK turns off due to overvoltage is 9V as standard at the analogue output. The turn-off time is 5ms. However, these values may vary specifically to application. The valid values can be taken from the PrimeSTACK datasheet.

3.4.4

Temperature measurement

The PrimeSTACK features two independently working NTC temperature sensors as standard: one - for monitoring the chip temperature, the other one - for monitoring the ambient temperature. Monitoring the chip temperature The temperature is measured by means of an NTC (characteristic see Figure 14) beneath the baseplate of a power module and given out in real time as a temperature proportional voltage signal. It has to be differentiated between the implementation of a water cooler and that of an air cooler: ? Air cooler: The trip level at TNTC = 80…85°C ? Water cooler The trip level due to the better thermal resistance of the cooler at TNTC = 60…65°C In both cases this corresponds to a chip temperature of approx. 125°C. The analogue temperature output is affected by a certain inertia due to the thermal capacities. To equalise and counteract this time step in transient processes, such as high temporary overload, an optional assembly for temperature simulation is available (see section “Temperature simulation (T option)”.

Figure 14: Characteristics of the temperature monitor signal at the analogue output module

measured temperature beneath the

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Note Please note, that for temperature lower than described in Figure 14 negative voltages can occur at analogue output. Monitoring the ambient temperature During operation the electronics of the PrimeSTACK heats up to a certain temperature level above the ambient. In order to protect the electronics from over heating and damage arising from this, the PrimeSTACK is turned off at an electronics ambient temperature of 75°C. This is measured with an NTC which is situated on the PrimeSTACK electronics. The measured value is not given out. Instead an over temperature fault is generated.

3.4.5 Temperature simulation (T option)
If the PrimeSTACK is operated with high transient overloads, the chip junction temperatures of the IGBTs increase faster than the temperature rise at the NTC is recognised and registered. The reason for this is the time lag of the system due to “charging” of the thermal capacities. To close this protection gap the optional temperature simulation was developed. This is recommended in particular if varying overload situations are regularly encountered and the PrimeSTACK is to be used safely and to its limits. Basis for the temperature simulation is the knowledge of the thermal parameters of the PrimeSTACK. The following values are included in the calculation of the simulated chip temperature: 1. RMS value of the load current 2. DC-bus voltage 3. NTC temperature 4. Switching frequency As soon as the calculation has reached a value greater than 125°C chip temperature, regardless of the reason, an over-temperature fault is given out to the PrimeSTACK controller interface. The fault output through simulated over-temperature is identical with that of the measured over-temperature. An analogue output of the simulated temperature is not provided. The temperature simulation is permanently active.

3.5 PrimeSTACK ancillaries and add-ons
This section describes the PrimeSTACK (System) add-ons available. These are sensible electronic assemblies or power assemblies.

3.5.1 DC-bus circuits (C-option)
Selection of the DC-bus is application specific. Voltage, current and ambient conditions are vital design criteria. The PrimeSTACK DC-bus circuits are referenced to these criteria and to some extent use standard assemblies (e.g. capacitors, voltage sharing resistors) and partially components designed specifically for the PrimeSTACK (e.g. capacitor box, busbar).

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Kondensatorbox Symmetrierwiderst?nde DC-Busbar

PrimeSTACK DCKontaktierung

Elektrolytkondensatoren

Standfü?e mit Auflagefl?che für Kühlk?rpermontage

Figure 15: PrimeSTACK DC-bus construction (here 1200V PrimeSTACK in size C3)

Design criteria: ? Electrically and thermally the DC-bus is designed for the required currents and a minimal inductance. The capacitors are selected in a way that for the nominal load of the application no thermal over-stressing of the capacitors will occur and even overload conditions can be handled. The specifically integrated high temperature resistors take care of a symmetric division of the DC-bus voltage over the seriesed electrolytic capacitors and a discharge of the capacitors within a defined time period after turn-off. ? Mechanically the construction is both robust and stable and constructed matching the PrimeSTACK DC-terminals. Several possibilities to connect a DC-feed exist which can be freely selected according to the existing infrastructure. The assembly is carried out in the depicted position (Fehler! Verweisquelle konnte nicht gefunden werden.). The construction is placed over the PrimeSTACK onto the heatsink. Robust feet for the bolts are positioned at the contact faces; this acts as the direct contact to the heatsink. The link to the DC-terminals is also done with bolt connections (see “Table 14: Recommended nominal and fastening torques”). All bolt connections feature good mechanical stability. Note Part of the PrimeSTACK DC-bus construction are also the snubbers to dampen turn-off overvoltages as described in section “Fehler! Verweisquelle konnte nicht gefunden werden. Fehler! Verweisquelle konnte nicht gefunden werden.”.

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Mounting Aluminium is characterised by high conductivity and low weight. It is thus extremely well suited as a busbar in DC-bus constructions. DC busbars in the PrimeSTACK systems consist of Al99.5 with a conductivity of approx. 35m/(?mm?). The surface of this high-purity aluminium forms an oxide and thus a comparatively high contact resistance which can lead to high temperatures spots due to the resistive power losses there. In order to prevent this, we recommend, before the galvanic connection of any individual electric circuit with the PrimeSTACK busbar, the pre-treatment of the junction or contact points as following: 1. Roughen or brush the contact point in order to remove the oxide from the aluminium surface. 2. Apply contact grease for example Klüber’s Wolfracoat C in a thin layer onto the roughed, oxide free surface. 3. Make the connection

Figure 16: Two layer aluminium sheet to connect three individual PrimeSTACK DC-buses to a single DC-bus system

Note: The formation of the oxides on a A199.5 surface takes place rapidly. We recommend, therefore, carrying out step 2 immediately after step 1. Figure 16 shows a layer, as it can be used in order to connect individual PrimeSTACK DC-buses. Basis forms the PrimeSTACK system shown in Figure 4. Copper bars for connecting several DC-buses with each other are possible but they are not recommended due to their comparatively high inductance.

3.5.2 Fans (F-Option)
Fan type D2E133AM4723 D2E133AM4701 D2E133DM4701 D2E146AP4702 Manufacturer F [Hz] 50 60 60 60 V [V] 230 230 230 230 Free blowing air flow [m?/h] 685 510 600 690 P [W] 190 200 195 330 Tamb[°C] 45 40 40 35
max

ebm-papst

Table 9: Recommended fans for PrimeSTACK air cooling where a PrimeSTACK standard heatsink is used

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Air-cooled PrimeSTACKs are designed for forced air cooling as a standard. The fan itself is optionally available. It is important to operate the fan correctly. Only with correct air flow and air current (exact values see each fan datasheet) the PrimeSTACK may be operated under nominal conditions.

3.5.3 Paralleling interface PD100 (M-Option)
The parallel interface serves the parallel operation of several identical PrimeSTACKs. This is of interest in particular when the power of one individual PrimeSTACK does not suffice and two or more PrimeSTACKs are to be connected in parallel. The following functions are implemented: ? ? Splitting of the PWM control signals The PWM signal from the controller designated for each logical switch is split by the parallel interface into two identical PWM signals. Analogue output: Analogue values measured in the parallel PrimeSTACKs are conceptually combined. The following analogue signals are given out at the PrimeSTACK parallel interface: o Load current generation of the average value of the individual PrimeSTACK currents o Temperature output of the highest individual NTC temperature o DC-bus voltage VZK output the highest individual measured DC-bus voltage (VZK) where not necessarily each PrimeSTACK has to be equipped with the V option, in particular when the same DC-bus is used Fault management: Each PrimeSTACK protects itself to a large extend by the protection mechanism described and turns itself off. In case of a fault the generated fault signal is given out to the parallel interface. This immediately blocks the PWM signals for the remaining paralleled PrimeSTACKs and turns them off.

?

Figure 17: The parallel interface PD100 for the parallel operation of two PrimeSTACKs

3.5.4 Optical Interface OEA240 (IO-Option)
The optical interface OEA240 serves to control a PrimeSTACK in half-bridge configuration with optical timing signals. The following functions are implemented: ? ? 2 optical inputs. For each the IGBTs on plus (top) and minus (bottom) 1 to 3 optical outputs. o Combined fault (standard)
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o Over-temperature fault (optional) o Over-voltage fault (optional) Sub-D connector for the remaining, non optical signals

If an OEA240 is used, the feeding of the supply voltage of the PrimeSTACK occurs via the OEA240. The required controlled internal operating voltage of +15V is fed back from the PrimeSTACK into the OEA240. This is part of the EMC concept (see section 4.1). Note: For the OEA240 individual documentation is available on request.

Figure 18: Optical interface OEA240

3.5.5

Chopper driver DR220 (D-option)

The chopper driver DR220 serves to control 62mm modules with circuit variants shown in Figure 19. It is optionally available as an additional component of a PrimeSTACK in B6I configuration (6PS…). The mechanical size of the PrimeSTACK increases here from C3 (three integrated 62mm modules) to C4 (four 62mm modules).

Figure 19: Boost-/buck converter and chopper

The DR220 has following characteristics: ? ? 2 control modes: Control via external switching signal or Control by internal on-off controller Maximum switching frequency: fTakt max = 5kHz
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VCE sat monitoring Temperature monitoring with additional NTC under the module baseplate

The control with external switching signal occurs similarly compared with the control of the other IGBTs through the customer controller. The internal on-off controller, however, offers the possibility to have this task done by the PrimeSTACK. As a standard, the following on-off controller switching thresholds are fixed: Overvoltage fault Turn-on threshold Turn-off threshold Version 1: 730V 681V 667V Version 2: 860V 802V 786V

Table 10: Switching thresholds for PrimeSTACK chopper (DR220)

Application note The brake resistor is to be connected in such a way that the parasitic inductance is minimized and the resistive characteristic of the brake still exists. The maximum length of the cable is to be chosen according to: ? Braking current (preferably RMS instead of peak current) ? Cross section of the cable ? Parasitic inductance of the brake resistor This length must not be exceeded. The use multi-core cable is preferred.

3.5.6 Snubber capacitors
Snubber capacitors serve the reduction of turn-off overvoltages of the IGBT. They are connected to the PrimeSTACK DC-terminals. If snubbers are used, then always all of the 62mm power modules of the individual PrimeSTACK should be equipped with a snubber capacitor. Apart from the selecting the correct capacitance for the snubber capacitors it is important to determine their adequacy for the respective application. The latter is not a part of the specification: ? ? ? CSnubber too low: CSnubber too high: CSnubber correct: Snubber capacitors ineffective: long decay time Correct dampening of the turn-off overvoltage

We recommend the following metallised-dielectric capacitors in conjunction with the PrimeSTACK: Capacitor type CSnubber Vmax Manufacturer Appropriate for number [?F] [V] B32654-S0474-K566 0.47 1000 1200V – PrimeSTACK (…R12…) Epcos B32654-A7224-K 0.22 1250 1700V – PrimeSTACK (…R17…)
Table 11: Recommended snubber capacitors

3.5.7 Heatsink (G-, W-option)
Two basically different heatsinks exist: air cooled and water cooled. When using air coolers the PrimeSTACK standard is forced air cooling. For air cooled systems the capability is usually limited by the heatsink. If a water cooler is to be used in the application, wider prospects exist regarding power density.
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Mounting holes with thread

Contact surface for (here: 3) power modules

Reserved space for NTC

For forced air cooling optimised cooling fins structure

Figure 20: PrimeSTACK standard heatsink (forced air cooling) of a C3 PrimeSTACK

Figure shows the standard heatsink for forced air cooling of a PrimeSTACK size C3 (three 62mm IGBT modules integrated). The arched groove on the top site of the depicted heatsink is the space reserved for the NTC temperature sensor. All other holes feature M5- or M6threads to mount the standard and optional PrimeSTACK components. Note for water coolers An in- and outlet of the cooling liquid exists for each water cooler (see Figure 30: Technical drawing PrimeSTACK in size C3 with water cooler”). Positioning these is possible in five different positions (designated with A…E in the technical drawing). By default these are positioned in B and C). Please note the dimension of the mechanical connection. As a standard this is a pipe thread of the size “G ?” according to the DIN ISO 228 T1. Customised heatsinks (for example for PrimeSTACK IPM) have to have the necessary mounting holes and the groove required of the NTC. Technical drawings for production of such heatsinks are available on request. Further information can be taken from the Application Note AN2006-07.

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E

A B C

D

Figure 21: Optional position of the water in and outlets

3.6 PrimeSTACK sizes
The term “sizes” refers to the mechanical dimensions of the various PrimeSTACKs. The entire portfolio is based on three sizes: “C2”, “C3” and “C4”. The number after the “C” refers to the number of integrated 62mm power modules within a PrimeSTACK. This number is also found in the type designation immediately after the hyphen (see section 3.1 “PrimeSTACK type designation”). Connecting both electrically and mechanically equal sizes of PrimeSTACKs will result in an extension of the range: Size C2 C3 C4 CA CB CC CD CE CF Component Basic PrimeSTACK in C2 Basic PrimeSTACK in C3 Basic PrimeSTACK in C4 2 units C2 on one heatsink 2 units C3 on one heatsink 2 units C4 on one heatsink 3 units C2 on one heatsink 3 units C3 on one heatsink 3 units C4 on one heatsink 1/2B2I 800A 1200A 1600A 1600A 2400A 3200A B2I --400A 800A ------------B6I --400A --------800A 1200A 1600A B6I + Brake ----400A -------------

Table 12: Relationship between the sizes and the configurations and currents (IGBT nominal current). Notice: B6I and B2I circuits can be realised by 3 or 2 individual 1/2B2I respectively

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C3 C2
PrimeSTACK traction
Traction as an operating field - depending on the respective application – makes for very different requirements of the PrimeSTACK in many respects. These requirements are defined in many regulations. The PrimeSTACK complies with many traction regulations. However, the subject areas dewpoint, humidity and condensation should be checked thoroughly with regard to each application case. If using appropriate switchboards or cases the PrimeSTACK can be used in vehicles. However, according to the required insulating clearance, not entire bandwidth of installation sites (e.g. wheel housing) is available. In order to asses the traction suitability in each case, the following categories must be known: a.) Overvoltage category OV1 to OV4 b.) Pollution level PD1 to PD4 (A,B) c.) Rated insulation voltage

C4

Figure 22: Standard PrimeSTACK sizes C2, C3 and C4

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4 PrimeSTACK system integration
This section describes the integration of the PrimeSTACK into the surrounding system. Hints are given for installation and commissioning, regarding the permissible limits of operation and the maintenance of the PrimeSTACK.

4.1 EMC concept
A solid EMC concept strictly adhered to assures operating of the PrimeSTACK free of EMCdisturbances and, of course, also of the system into which the PrimeSTACK is integrated. Such a concept mainly consists of: 1. Introduction of different grounds - PE-ground current conducting earth (return currents from motors, earthing of switchboard cabinets etc.), solid construction, voltage differences of 50…100V induced by high current pulses can occur within the PE-ground - TE-ground electronics shield (connected with PE at one place only; strictly separated otherwise. Entering the switchboard insulated from the cabinet walls). Not designed for high currents, only to evade disturbances by generating a ground shield. - Signal / supply ground (further separated according to requirements) Supply ground for the electronics (V24) (least sensitive) Reference ground for digital signals (moderately sensitive) Reference ground for analogue signals (most sensitive) 2. Correct earthing of the ground connections and connecting the grounds to each other - TE is galvanically connected to PE at exactly one spot only. This position should be as close as possible to the PE-connection, e.g. the factory hall to the outside world. Several connections may lead to circulating currents and should be avoided. - Signal / supply ground V24 is to be connected with TE only, under no circumstances with PE. A connection may be made at several positions (capacitively and/or via a varistor and/or hard galvanic etc.) - Usually the controller, which drives the PrimeSTACK, is supplied with this V24. Inside this controller the digital and analogue grounds should be separated internally. 3. Consistent shielding - Signal leads anywhere should be shielded with the screen to the TE-ground (shielded cable). - SUB-D plugs should be used in preference over IDC connectors. Appropriately shielded plugs can be purchased through your stack supplier. Figure 23 depicts this concept. The entire system is divided into several zones indicated here with circles. Each zone has its own ground. From a steady state point of view i.e. very low frequencies (ideal DC), these zones are shorted to each other. Dynamically, however, they are separated from each other by a specially designed de-coupling circuit. Thereby transient voltage drops or voltage variations, due to current pulses on parasitic inductances of earth leads, are kept away from freely defined sub-systems. The influence of the EMC disturbance described as an example is thus limited to one circle. These circles may be freely defined and should then be strictly adhered to.
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Multiple earthing to TE possible low-pass capacitance varistor etc.
Supply / signal ground Analogue / digital ground

ground outside world

Protection screen earth TE-ground

Single earthing Solid earthing next to the connection to the outside world

Current carrying earth: PE-ground

e.g. factory hall with all switch board cabinets as well as motor return

e.g. cases of all units as for example controller or induction machine which are in the cabinet

e.g. analogue or digital grounds within the electronics of the controller as well as its voltage supply

Figure 23: Example of an EMC concept

4.2 Checklist for system integration
The following shows a checklist to integrate the PrimeSTACK into the system. This checklist is only meant as a brief set of instructions. Make sure that all points of the list have been followed before commissioning. Please also read the sections referred to in the checklist. 1. Check the delivery 2. Read the safety notes carefully (section 5) 3. Make sure the required space for the PrimeSTACK is available and the permissible ambient conditions are observed. 4. Check for rating and safe connections of the DC supply wiring 5. Check for rating and safe connections of the AC supply wiring 6. Check for rating and safe connection of the break chopper wiring (if existing) 7. In case of parallel connection of several PrimeSTACKs to one PrimeSTACK system, check the rating and the safe connection of the DC-bus wiring. 8. Check the rating and the safe fit of the control cable(s). Make sure, that no cables have been mixed up.
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9. Make sure, that the rules of the EMC concept have been observed. 10. Follow the commissioning instructions 11. The PrimeSTACK is now ready for operation.

4.3 Installation and commissioning
Prior to installation and commissioning of your PrimeSTACK, the safety instructions and the frame conditions in section 4 and 5 described by Standards have to be read! It is important to observe the required distance of the PrimeSTACK to other components. We recommend a minimal distance of 15 to 20mm between the plastic housing of the PrimeSTACK electronics and other components.

4.3.1 Connecting the controller
See also section 3.3. We recommend to use a round shielded cable for the control connection. The shield must be connected EMC-suitably on both sides (SUB-D case according to telecom Standard). The correct pin-out can be taken from section 3.3.1 “User interface and pin-out”. For EMC-suitable connection we recommend the use of a SUB-D plug instead of an IDC connector. The pin-outs are compatible with each other (see Table 3). The purpose of the control unit (not part of the PrimeSTACK) is to drive the PrimeSTACK and to evaluate the analogue and digital signals of the PrimeSTACK. We recommend to supply the PrimeSTACK with 24V. A supply voltage below 13V is not permitted. Notices for layout of cables Machine and line cables are to be run separately and at a distance to control cables. Avoid long parallel runs to line or machine cables. Should a parallel run to a line be unavoidable, following distances have to be observed in order to avoid RF-interference: Cable distance [m] 0.3 1 Screened cable length [m] <50 <200

Table 13: Recommended cable lengths for controller connection

4.3.2 Connecting the power terminals
Cables and fuses are not part of the PrimeSTACK and have to be rated according to the nominal current. The temperature on the PrimeSTACK power terminals may not exceed 120°C. However, local regulations have to be observed. Power cables, in particular line and machine cables have to cross other cables perpendicularly. Make sure that line and machine cables are not swapped. The cable must not run over sharp corners or edges. After connection, check again that the power cables are fixed properly on the terminals. Please also use appropriately designed dV/dt-filters. Please also observe both the recommended fastening torques of the power terminals as well as their maximum permissible load through external forces. To achieve the quoted fastening torques, bolts of the material class 8.8 are necessary. To secure the bolts, we recommend lock washers in S form in M6 and M8.

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Terminal DC at the DC-bus3 AC DC at the PrimeSTACK

Thread M8 M6

Mmax [Nm] 20 10

Mnom [Nm] 17 8

T +/-10% +/-10%

Table 14: Recommended nominal and fastening torques for the power terminals

Fz Fy M

Fx
Figure 24: Spatial definition of the maximum permissible forces and recommended fastening torques

DC terminal AC terminal

Force (pull and push) Fx-max [N] Fy-max [N] Fz-max [N] Fx-max [N] Fy-max [N] Fz-max [N]

Size C2 200 250 375 400 500 750

Size C3 135 250 250 250 500 500

Size C4 100 200 185 200 375 375

Table 15: Maximum permissible forces per power terminal

The maximum permissible forces have been derived by a type test and contain an appropriately high safety margin. Mnom Nominal fastening torque Mmax Maximum fastening torque T Permissible tolerance regarding the quoted torques Fx,y,z Maximum permissible force F in +/-x-, +/-y- or +/-z-direction (see Figure 24) per power terminal.

3

Only for PrimeSTACK system with DC-bus construction

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4.3.3 Earthing
In accordance with section 4.1 the correct earthing of a PrimSTACK is illustrated here with a figure. The main components, controller, 24V supply for the PrimeSTACK driver and the PrimeSTACK itself should to be connected to TE and PE as shown in figure 25.
Switch board for controller (?clean“ zone)
Controller TE Bar (True Earth) Power Supply 24V Earth Ground (PE) TE 24 M

Switch board for power section (PrimeSTACK) (partially ?dirty“ zone)

PrimeSTACK
The driver of the PrimeSTACK is in the “clean zone” with integrated EMC-barrier

TE

M

0 24

PE Bar

PE Bar

It is recommended to position the drive-sense and 24V cables (both screened) as closely as possible

Figure 25: Example of the correct earthing for a PrimeSTACK

4.4 Maintenance and repair on site
4.4.1 Maintenance
Basically the PrimeSTACK is designed for maintenance free operation. Within appropriate intervals it should be made sure, however, that the defined ambient conditions regarding operation and storage (see section 5) are observed. The PrimeSTACK itself does not cause contamination by its operation. If, however, other contamination occurs e.g. of the heatsink, this should be removed regularly. Before maintaining the PrimeSTACK, make sure you have read the safety instructions in section 4 and 5!

4.4.2 Repair on site
If a fault occurs on the PrimeSTACK itself, it is possible in principle to repair on site. This includes all components used in the PrimeSTACK. It the fault is located, the defective component can be repaired or replaced. Among others: ? ? Cases Driver board
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? ? ?

Sensors IGBT modules as well as all DC-bus components

can be replaced individually. Intact and still working components can remain in the PrimeSTACK for further use. The possibility of the repair on site is a key advantage that helps to keep MTTR3 and costs as low as possible. Instructions and documentation for repair on site is available on request.

4.5 Insulation concept
The PrimeSTACK insulation concept features consistent observance of “reincorced isolation”. All signals available to the user from the PrimeSTACK controller interface are safely separated. For this, the Standard IEC 61800-3 has been consistently applied and both the rated voltages as well as the clearance and creepage distances according to IEC 60664-1 have been observed. In addition, the PrimeSTACK is UL listed. Earth-free mains The PrimeSTACK can basically be used in earth-free mains as long as the voltages occurring thereby do not exceed the values specified in the Standards IEC 61800 and IEC60664 which are relevant for the design rating. Control electronics and sensors accessible to the user at X1 (see also “User interface and pin-out”) are potential separated from the power section. Additionally, the peak voltages occurring in earth-free mains due to the parasitic capacitances are to be taken into consideration

4.6 IP class of protection
The PrimeSTACK complies with class of protection IP00. Except for the accessible life power terminals (DC+/- and AC) IP20 is complied with. The case is designed accordingly.

4.7 Permissible environmental conditions
4.7.1 Operation
The PrimeSTACK is designed for operation according to the Standard IEC 60721-3-3. In most cases the PrimeSTACK is integrated into installations which themselves are housed in a switchboard cabinet. The operating conditions defined under this Standard and the values specified in the datasheet may not be violated. The following environmental ratings are valid for operation according to the Standard IEC 60721-3-3: ? Climatic 3K3 o Air pressure 90kPa to 103kPa o Temperature heatsink air in -40°C… +70°C o Ambient temperature PrimeSTACK -25°C…+55°C (+85°C) ? Biological 3B1 ? Chemical active substances 3C2, no salty air, however
3

Mean Time To Repair

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? ?

Mechanical active substances 3S1 Mechanical 3M2

The main values are as follows: ? Temperature range o cooling air drawn in: -40°C…+70°C o Ambient of the PrimeSTACK electronics: -25°C…+55°C o For electronics: Design temperature of +85°C minimum needs to be observed ? Temperature drift 0.5K/min ? Relative humidity 5%...85%, no condensation ? Air pressure o 90kPa= 1000m level of installation o 103kPa= 0m= normal air pressure o Power derating at installation levels above 1000m ? Forced air cooling: Minimum 1m/s ? Negligible biological strain ? No salty ambient air ? Sine-wave vibration o 1.5mm @ 2Hz - 9Hz and o 5m/s? @ 9Hz - 200Hz ? Shock o Type L o 40m/s? Note: The terms ambient temperature and design temperature have different meanings and are hence not identical. The design temperature (sometimes called operating temperature) defines permissible operating temperatures given by the manufacturers of the components themselves, whilst ambient temperatures (room temperature, temperature inside the switchboard cabinets etc.) are quoted at some distance to the individual component (PrimeSTACK). Therefore, design temperatures are usually rated at higher levels than the permissible ambient temperatures.

4.7.2 Transport
The following technical specifications have to be observed additionally to the quoted safety regulations for a safe transport. This is based on the assumption that the transport of the PrimeSTACK takes place in the packaging supplied. The following environmental ratings are valid for transporting the PrimeSTACK according to the Standard IEC 60721-3-2: ? ? ? ? ? Climatic 2K2, however, temperature -40°C…+85°C Biological 2B1 Chemical active substances 2C2, no salty air, however Mechanical active substances 2S1 Mechanical 2M2
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The main values are as follows: ? Temperature range -40°C…+85°C ? Relative humidity 75% at 30°C, not in conjunction with fast temperature drift ? Negligible biological strain ? No salty ambient air ? Sine-wave vibration o 3.5mm @ 2Hz - 9Hz and o 10m/s? @ 9Hz - 200Hz o 15m/s? @ 200Hz - 500Hz ? Shock o Type I o 100m/s?

4.7.3 Storage
For storage without packaging please observe additionally to the safety regulations quoted under 4.7.1 the following limits. The environmental ratings are given in IEC 60721-3-1. ? ? ? ? ? Climatic 1K2, however, temperature -40°C…+85°C Biological 1B1 Chemical active substances 1C2, no salty air, however Mechanical active substances 1S1 Mechanical 1M2

The main values are as follows: ? Temperature range -40°C…+85°C ? Temperature drift 0.5K/min ? Relative humidity 5%...85% ? no condensation ? Negligible biological strain ? No salty ambient air ? Sine-wave vibration o 1.5mm @ 2Hz - 9Hz o 5m/s? @ 9Hz - 200Hz ? Shock o Type L o 40m/s?

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5 Safety notices
Please read this section thoroughly before installing, commissioning or maintaining the PrimeSTACK. The described device bears dangerous voltages and controls rotating mechanical parts which may also be dangerous. Disregarding the warnings or not observing the instructions contained in this document and other effective documents can be dangerous for life, cause grievous bodily harm or severe property damage. Only correctly qualified personnel is permitted to work on these devices and only after they have acquainted themselves with all safety notices, instructions for installation, operation and maintenance contained in this document and other effective documents. The successful and safe operation of the device depends on its proper handling, installation, use and maintenance. Caution ? It must be prevented that children and the general public can get close to the device! ? The device may not be used for any other purpose than those prescribed by the manufacturer (see section “Appropriate use”). Inadmissible alterations and use of spare parts and accessories that Infineon Technologies does not distribute or recommend can cause fire, electric shock and injuries. Notes: ? This document has to be kept well accessible near the device and placed at the disposal of all users. ? When measurements or tests have to be performed on life equipment, the regulations according to BGV A3 are to be observed. Suitable electronic devices are to be used. ? Before installation and commissioning please read thoroughly these safety instructions and warnings as well as all warning signs attached to the device. Make sure that warning signs remain in a legible condition and missing or damaged signs are replaced.

!

5.1 Transport and storage
? Correct transport (see section 4.7.2 “Transport”) and storage (see section 4.7.3 “Storage”), mounting and installation as well as careful use and maintenance are important for the proper and safe operation of the device.

Caution ? During transport and storage the PrimeSTACK has to be protected against mechanical shocks and vibration with values exceeding given in the datasheet and in this document. Protection against water (rain) and inadmissible temperatures is also mandatory.

5.2 Commissioning
? Work on the device and/or system carried out by unqualified personnel and/or not observing the warnings can be dangerous for life, cause grievous bodily harm or serious material damage. Work on the device and/or system may only be carried out by suitably qualified personnel, with regard to the setting-up, installation, commissioning and operation of the product.
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? ? ? ? ?

During the removal of the protective cover and the work with electric parts of the PrimeSTACK, ESD protective measures have to be taken. Only hardwired AC/DC – terminals are permitted. The device has to be earthed. We recommend to ground the heatsink. Should a residual current device (RCD) be used, it has to be of type B. Machines with three-phase electric power supply equipped with EMC-filters may not be connected to the mains via an earth fault protective switch (see EN 50178). The AC and DC terminals can bear dangerous voltages even when the PrimeSTACK is not running!

Caution ? The connection of the cables for mains supply, motor and control on the inverter has to be carried out as described in section 4 “PrimeSTACK system integration” to prevent inductive and capacitive disturbances interfering with the proper functions of the inverter.

5.3 Operation
? ? ? ? The PrimeSTACK works with high and dangerous voltages. During operation of electric devices it is inevitable that dangerous voltages are born on certain parts of the devices. Equipment for emergency stop has to remain operative in all operating states of the controller. A reset of the emergency stop must not lead to uncontrolled or undefined restart. In such cases when short circuits in the controller can lead to considerable property damage or even to grievous bodily harm and death (i.e. potentially dangerous short circuits), additional external measures or equipment have to be provided in order to guarantee or force safe operation even if a short circuit occurs (e.g. independent limit switches, mechanical interlocks, etc.). Certain parameter adjustments may result in the automatic start of the PrimeSTACK after an interruption of the mains voltage. The device must not be used as “Equipment for emergency stop” (see EN 60204).

? ?

Please note that for installation higher than 1000m above sea level a derating of the load current will be necessary!

5.4 Maintenance
? ? Repairs on the device may only be carried out by Infineon repair centres, service facilities accredited by Infineon or by qualified personnel thoroughly acquainted with all warnings and operating procedures in this manual. Work on the PrimeSTACK (installation and removal of subassemblies, mechanical work etc.) may only be carried out with sufficient ESD-protective measures. As minimal protection, the person doing this job must be connected by an ESD-wristband with earth potential. Any defective parts or components must be replaced by parts from the corresponding spare parts list. Remove the electric power supply before opening of the device.

? ?

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6 Appendix
6.1 Technical drawings
6.1.1 PrimeSTACK with air cooler

Figure 26: Technical drawing PrimeSTACK in size C2 with air cooler

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Figure 27: Technical drawing PrimeSTACK in size C3 with air cooler

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Figure 28: Technical drawing PrimeSTACK in size C4 with air cooler

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6.1.2 PrimeSTACK with water cooler

Figure 29: Technical drawing PrimeSTACK in size C2 with water cooler

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Figure 30: Technical drawing PrimeSTACK in size C3 with water cooler

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Figure 31: Technical drawing PrimeSTACK in size C4 with water cooler

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6.1.3 PrimeSTACK capacitor box

Figure 32: Technical drawing PrimeSTACK DC-bus assembly (here: for size C2)

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6.1.4 Examples of PrimeSTACK systems

Figure 33: PrimeSTACK size CC with DC-bus. Very compact IGBT half-bridge with 3200A nominal chip current

Figure 34: PrimeSTACK size CF with DC-bus. Very compact B6I with 1600A nominal chip current per half-bridge.

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6.2 Further associated documentation
The documents listed below are effective in parallel to this PrimeSTACK product family documentation. All information can be found either on the Internet www.infineon.com or please contact us directly. We are pleased to give advice regarding all information recorded in the current documents. You find our contact address in the appendix of this document. ? ? ? ? PrimeSTACK datasheet EiceDRIVER? datasheet The EiceDRIVER? is an essential component of the PrimeSTACK. PrimeSTACK datasheet glossary of terms Explanations to the abbreviations, symbols and parameters used in the PrimeSTACK datasheets (contained also in the appendix of this document) Application Notes All application notes published by Infineon at the time of application of the PrimeSTACK are valid: o PrimeSTACK especially: AN2006-03 AN2006-07 o EiceDRIVER? and o other relevant components of the PrimeSTACK (e.g. heatsink) STACK-Optimizer Detailed customised calculation with regard to one or several operating points of the PrimeSTACK. This also includes calculation of the live time of the DC-bus capacitors (for PrimeSTACK System) CE declaration of conformity regarding PrimeSTACK

?

?

6.3 CE – declaration of conformity
Regarding disturbances caused and immunity against disturbances of all PrimeSTACK family members with or without additional components the relevant requirements are observed. In particular, these are the current Standard in combination with the directives: ? ? EMC - directive Low voltage directive 89/336/EEC 73/23/EEC

Infineon Technologies, therefore, confirms CE conformity of the products: ? ? ? PrimeSTACK PrimeSTACK IPM PrimeSTACK System

The CE- declaration of conformity regarding the PrimeSTACK is available as a separate document (see also section 6.2 “Further associated documentation”).

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6.4 PrimeSTACK portfolio
The following list features the PrimeSTACK portfolio at the time of this revision. The following information can be found. VZKmax see Type section 3.1 Topology section 2 section 6.1
phase current RMS

section 3.2

Size Case section 3.6 section 6.1

Cooling section 3.5

Tabelle 16: Reference section for information regarding the portfolio

Further explanations can be found in the sections referred to. VZKmax Type 4PS0400R06KE3-3G 6PS0200R06KE3-3G 6PS0300R06KE3-3G 6PS0400R06KE3-3G 2PS0800R06KE3-3G 2PS1200R06KE3-3G 2PS1600R06KE3-3G Topology B2I B6I B6I B6I 1/2B2I 1/2B2I 1/2B2I ILast RMS [A] 300 197 243 400 630 870 1032 Size Case C3 C3 C3 C3 C2 C3 C4 Cooling Air cooling Air cooling Air cooling Air cooling Air cooling Air cooling Air cooling

600V KE3 Chips

Table 17: PrimeSTACK portfolio of 600V types on standard heatsinks

VZKmax 1200V KS4 Chips

Type 4PS0300R12KS4-3G 6PS0300R12KS4-3G 2PS0600R12KS4-2G 2PS0900R12KS4-4G 2PS1200R12KS4-4G

Topology B2I B6I ? B2I ? B2I ? B2I

ILast RMS [A] 183 170 366 500 610

Size Case C3 C3 C2 C4 C4

Cooling Air cooling Air cooling Air cooling Air cooling Air cooling

Table 18: PrimeSTACK Portfolio of 1200V types on standard heatsinks, IGBT2 short tail (KS4-Chips)

VZKmax

Type 6PS0150R12KE3-3G 6PS0300R12KE3-3G 6PS0400R12KE3-3G 6PS1600R12KE3-FG 2PS0400R12KE3-2G 2PS0600R12KE3-2G 2PS0800R12KE3-2G 2PS0900R12KE3-3G 2PS1200R12KE3-3G 2PS1600R12KE3-4G

Topology B6I B6I B6I B6I ? B2I ? B2I ? B2I ? B2I ? B2I ? B2I

ILast RMS [A] 134 181 210 850 311 360 445 500 569 717

Size Case C3 C3 C3 CF C2 C2 C2 C3 C3 C4

Cooling Air cooling Air cooling Air cooling Air cooling Air cooling Air cooling Air cooling Air cooling Air cooling Air cooling

1200V KE3 Chips

Table 19: PrimeSTACK portfolio of 1200V types on standard heatsinks, IGBT3 Trench Fieldstop (KE3-Chips)

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VZKmax 1200V KE3 Chips

Type 6PS0200R12KE3-3GH 6PS0400R12KE3-3GH 6PS1600R12KE3-FGH 2PS0800R12KE3-2GH 2PS1200R12KE3-3GH 2PS1600R12KE3-4GH

Topology B6I B6I B6I 1/2B2I 1/2B2I 1/2B2I

ILast RMS [A] 172 237 950 490 720 850

Size Case C3 C3 CF C2 C3 C4

Cooling Air cooling Air cooling Air cooling Air cooling Air cooling Air cooling

Table 20: PrimeSTACK portfolio of 1200V types on high efficiency heatsinks, IGBT3 Trench Fieldstop (KE3-Chips)

VZKmax

Type 4PS0300R17KE3-3G 6PS0300R17KE3-3G 2PS0400R17KE3-2G 2PS0600R17KE3-2G 2PS0900R17KE3-3G 2PS0800R17KE3-4G 2PS1200R17KE3-4G

Topology B2I B6I ? B2I ? B2I ? B2I ? B2I ? B2I

ILast RMS [A] 165 145 276 325 422 482 571

Size Case C3 C3 C2 C2 C3 C4 C4

Cooling Air cooling Air cooling Air cooling Air cooling Air cooling Air cooling Air cooling

1700V KE3-Chip

Table 21: PrimeSTACK portfolio of 1700V types, IGBT3 Trench Fieldstop (KE3-Chips)

VZKmax 1700V KE3Chip

Type 6PS0300R17KE3-3GH 2PS0600R17KE3-2GH 2PS0900R17KE3-3GH 2PS1200R17KE3-3GH 2PS1200R17KE3-4GH 2PS1200R17KE3-4W

Topology B6I ? B2I ? B2I ? B2I ? B2I ? B2I

ILast RMS [A] 176 375 550 650 650 788

Size Case C3 C2 C3 C3 C4 C4

Cooling Forced Air Forced Air Forced Air Water Forced Air Water

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6.5 Indices
6.5.1 Index of terms
?B2I half-bridge 6 62mm module 25 73/23/EEC 57 89/336/EEC 57 air cooling 7, 9, 13, 35 Air cooling 16 Air pressure 44 ambient conditions 30, 40 ambient temperature 27, 29, 30 Ambient temperature 44 analogue output 22 application notes 57 Appropriate use 11 associated documentation 57 Auxiliary voltage 19 B2I single phase full bridge 6 B6I three-phase full bridge 6 blocking voltage 26 brake chopper 13 Brake chopper 6, 8, 19, 34 break-chopper 5 Bridge interlock time 25 burden resistor 28 busbar 10 capacitor box 30, 55 Capacitor box 7 Case 58 CE - conformity 57 Checklist 40 chip temperature 13, 27, 29, 30 circuit topology 5, 8, 13, 15, 19, 25 Circuit topology 5, 12 CMOS 10, 15, 20 commissioning 40, 41, 47 Commissioning 47 Conditions of use 63 Contact 64 contact resistance 32 control signal 33 Control signals 10 controller 11, 16, 20, 26 Controller 13 controller interface 9, 28, 30 cooling 11 Cooling 7, 58 C-option 30 current sensor 27 datasheet 4, 11, 14, 27, 29, 57 DC-bus 8, 22, 31, 42 DC-terminal 31, 35 Design temperature 45 Digital inputs 20 digital output 21 D-option 34 DR220 34 driver 9, 10 ? Infineon Technologie AG 2006 dV/dt-filter 41 earthing 39, 43 EiceDRIVER? 8, 25 EMC 10, 11, 16, 19, 20, 21, 39, 41, 48 EMC - directive 57 EN 50178 48 EN 60204 48 EN50178 26 environment 17 Equipment for emergency stop 48 ESD 48 fan 11, 13 fastening torque 31, 41 fault matrix 22 fault output 30 Fault output 22 F-Option 32 frame size 28 glossary of terms 57 G-option 35 heatsink 9, 10, 16, 31 Heatsink 8, 9, 35 IDC 10, 19, 39 IEC 60721 44, 45, 46 IEC 61800 44 installation 4, 11, 39, 47, 48 Installation 41 insulation concept 44 insulation structure 16 IO-Option 33 IP class of protection 44 IP protection class 17 IPM 9 layout of cables 41 load current monitoring 8 Load current monitoring 7 Low voltage directive 57 maintenance 47 Maintenance 43, 48 mechanical dimension 17 Minimum pulse suppression 25 Minimum turn-on time 25 module nominal current 12 module nominal currents 5 Monitoring 15 Monitoring of current 16 Monitoring of DC-bus voltage 7 Monitoring of temperature 16 Monitoring of under-voltage 7 Monitoring the ambient temperature 30 Monitoring the DC-bus voltage 26 Monitoring the load current 26, 27 Monitoring the temperature 26 M-Option 33 nominal current 8, 12, 26 NTC 27, 29, 30, 33, 36 page 60

OEA240 33 open collector 21, 23 Optical Interface 33 overload 29, 30 overload current 15 overvoltage 22, 29 Overvoltage 19 parallel interface 7, 10, 33 Parallel interface 8, 13 PE-ground 39 permanent operation 14 pin-out 19 portfolio 58 power terminal 10 PrimeSTACK add-on 8 PrimeSTACK Basic 8, 9 PrimeSTACK Basic add-on 8 PrimeSTACK System add-on 8 protection 4, 8, 20 Protection 7, 26 protection concept 8 protection logic 5, 8, 9 Protection logic 19 protection rating 11 pull-up resistor 21 PWM signal 20, 33 PWM signals 23 Reincorced isolation 26 Relative humidity 45, 46 repair 43 reset 20, 22 Response time 25 safety instructions 41 safety notices 14 Safety notices 47 safety notifications 11 shield 41 Shock 45 short circuit 28 short circuit protection 8 simulation 13 Simulation of the junction temperatures 7 Size 42, 58

Snubber capacitor 35 Snubber capacitors 8 Soft shut down 26 Soft Shut Down 28 STACK-Optimizer 57 Standards 4, 13, 15 storage 17, 43, 47 Storage 46 SUB-D 10, 19, 20, 39 supply 20 Supply 19 supply ground 39 supply voltage 20 supply voltage low 22 surge 26 switching frequency 21, 26 Switching frequency 30 system integration 40 T option 30 TE-ground 39 Temperature monitoring 7 temperature simulation 29, 30 Temperature simulation 8, 30 thread 20 traction 38 Transition time 25 transport 47 Transport 45 turn-off overvoltage 35 type designation 14, 37 type test 42 user interface 20 User interface 19 V option 28 VCE voltage monitoring 28 vibration 45 V-option 33 water cooler 13, 35, 52 Water cooler 13, 29 water cooling 9 Water cooling 7, 17 W-option 35 X1 19

6.5.2 List of figures
Figure 1: Construction of a standard PrimeSTACK with the three base elements: driver - power modules heatsink ................................................................................................................................................................... 5 Figure 2: The PrimeSTACK kit-set concept ........................................................................................................... 7 Figure 3: PrimeSTACK IPM heatsink mounting .................................................................................................... 9 Figure 4: Example of a PrimeSTACK System...................................................................................................... 10 Figure 5: PrimeSTACK electronics ...................................................................................................................... 18 Figure 6: PrimeSTACK block diagram................................................................................................................. 18 Figure 7: Internal input circuit of the digital inputs of the PrimeSTACK electronics........................................... 20 Figure 8: Maximum permissible PrimeSTACK switching frequency referred to module rated currents. Parameter: size (C2,3,4) .......................................................................................................................................................... 21 Figure 9: Internal circuit of the digital outputs of the PrimeSTACK electronics.................................................. 21 Figure 10: Internal circuit of the analogue outputs of the PrimeSTACK electronics............................................ 22 Figure 11: Time management of the PrimeSTACK electronics: .......................................................................... 24 Figure 12: EiceDRIVER? ................................................................................................................................... 26 Figure 13: Transfer characteristics of the PrimeSTACK current sensor versus the frequency of the load current28 ? Infineon Technologie AG 2006 page 61

Figure 14: Characteristics of the temperature monitor signal at the analogue output measured temperature beneath the module ............................................................................................................................................... 29 Figure 15: PrimeSTACK DC-bus construction (here 1200V PrimeSTACK in size C3)...................................... 31 Figure 16: Two layer aluminium sheet to connect three individual PrimeSTACK DC-buses to a single DC-bus system ................................................................................................................................................................... 32 Figure 17: The parallel interface PD100 for the parallel operation of two PrimeSTACKs .................................. 33 Figure 18: Optical interface OEA240 ................................................................................................................... 34 The chopper driver DR220 serves to control 62mm modules with circuit variants shown in Figure 19. It is optionally available as an additional component of a PrimeSTACK in B6I configuration (6PS…). The mechanical size of the PrimeSTACK increases here from C3 (three integrated 62mm modules) to C4 (four 62mm modules). ................................................................................................................................................... 34 Figure 20: PrimeSTACK standard heatsink (forced air cooling) of a C3 PrimeSTACK...................................... 36 Figure 21: Optional position of the water in and outlets ....................................................................................... 37 Figure 22: Standard PrimeSTACK sizes C2, C3 and C4 ...................................................................................... 38 Figure 23: Example of an EMC concept............................................................................................................... 40 Figure 24: Spatial definition of the maximum permissible forces and recommended fastening torques .............. 42 Figure 25: Example of the correct earthing for a PrimeSTACK........................................................................... 43 Figure 26: Technical drawing PrimeSTACK in size C2 with air cooler............................................................... 49 Figure 27: Technical drawing PrimeSTACK in size C3 with air cooler............................................................... 50 Figure 28: Technical drawing PrimeSTACK in size C4 with air cooler............................................................... 51 Figure 29: Technical drawing PrimeSTACK in size C2 with water cooler .......................................................... 52 Figure 30: Technical drawing PrimeSTACK in size C3 with water cooler .......................................................... 53 Figure 31: Technical drawing PrimeSTACK in size C4 with water cooler .......................................................... 54 Figure 32: Technical drawing PrimeSTACK DC-bus assembly (here: for size C2)............................................. 55 Figure 33: PrimeSTACK size CC with DC-bus. Very compact IGBT half-bridge with 3200A nominal chip current ................................................................................................................................................................... 56 Figure 34: PrimeSTACK size CF with DC-bus. Very compact B6I with 1600A nominal chip current per halfbridge. ................................................................................................................................................................... 56

6.5.3 List of tables
Table 1: Overview of the PrimeSTACK circuit topologies .................................................................................... 6 Table 2: The PrimeSTACK type designation........................................................................................................ 13 Table 3: Pin-out of the PrimeSTACK controller interface for IDC and SUB-D connectors ................................ 19 Table 4: Adaptation of the analogue output by variable resistor values................................................................ 22 Table 5: PrimeSTACK fault matrix for ?B2I half-bridge .................................................................................... 22 Table 6: PrimeSTACK fault matrix for B6I full bridge ........................................................................................ 23 Table 7: Time management of the PrimeSTACK electronics:.............................................................................. 24 Table 8: Response times of the PrimeSTACK electronics in the case of fault ..................................................... 25 Table 9: Recommended fans for PrimeSTACK air cooling where a PrimeSTACK standard heatsink is used .... 32 Table 10: Switching thresholds for PrimeSTACK chopper (DR220)................................................................... 35 Table 11: Recommended snubber capacitors........................................................................................................ 35 Table 12: Relationship between the sizes and the configurations and currents (IGBT nominal current). Notice: B6I and B2I circuits can be realised by 3 or 2 individual 1/2B2I respectively ..................................................... 37 Table 13: Recommended cable lengths for controller connection ........................................................................ 41 Table 14: Recommended nominal and fastening torques for the power terminals ............................................... 42 Table 15: Maximum permissible forces per power terminal................................................................................. 42 Tabelle 16: Reference section for information regarding the portfolio................................................................. 58 Table 17: PrimeSTACK portfolio of 600V types on standard heatsinks .............................................................. 58 Table 18: PrimeSTACK Portfolio of 1200V types on standard heatsinks, IGBT2 short tail (KS4-Chips)........... 58 Table 19: PrimeSTACK portfolio of 1200V types on standard heatsinks, IGBT3 Trench Fieldstop (KE3-Chips) .............................................................................................................................................................................. 58 Table 20: PrimeSTACK portfolio of 1200V types on high efficiency heatsinks, IGBT3 Trench Fieldstop (KE3Chips).................................................................................................................................................................... 59 Table 21: PrimeSTACK portfolio of 1700V types, IGBT3 Trench Fieldstop (KE3-Chips)................................. 59

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6.6 Conditions of use
The data contained in this product information is exclusively intended for technically trained staff. You or your technical departments will have to evaluate the suitability of the described products for the intended application and the completeness of the product data provided with respect to such application. This product documentation describes those features which are warranted by us under the delivery contract. Such a warranty references back exclusively to the regulations contained in the individual delivery contract. No guarantee of any kind will be given for the product or its properties. Should you require product information in addition to the contents of this product information which concerns the specific application and use of this product, please contact the sales office which is responsible for your area. For those interested we may provide application notes. Due to technical requirements our products may contain substances which can endanger your health. For information regarding the substances contained in the specific product please also contact the sales office responsible for your area. Should you intend to use the products in aviation applications or in uses where health or life is endangered or in life support, please contact Infineon. Please note that for any such application we strongly recommend - to jointly perform a risk and quality assessment; - to draw up a quality assurance agreement, - to establish joint measures for ongoing product monitoring and that delivery of product may depend on such measures. If, and to the extent necessary, please forward equivalent notices to your customers. Changes to this product documentation are reserved.

? Infineon Technologie AG 2006

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6.7 Contact
Address Infineon Technologies AG 59581 Warstein / Germany Max-Planck-Strasse 5 (1) (2) Personal contact Tel: Fax: www.infineon.com “Power Semiconductors” “High Power Semiconductors” www.eupec.com

Internet

02902 – 764 0 02902 – 764 1102

Electronic contact

info@eupec.com

? Infineon Technologie AG 2006

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