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LED
Silicone Materials

10 June, 2009 LED Lighting in Taiwan

LEDs LEDs last last longer longer with with Shin -Etsu Silicone Shin-Etsu Silicone Materials. Materials

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● ●Transparent silicone encapsulating resins for photo devices
To To keep keep pace pace with with dramatic dramatic improvements improvements in in LED LED luminance, luminance, manufacturers manufacturers are are looking looking for for more more durable durable transparent transparent encapsulating encapsulating materials materials and and die-bonding die-bonding materials. materials. Developed Developed with with new new Shin-Etsu Shin-Etsu technology, technology, our our silicone silicone materials materials for for Photo Photo devices devices have have the the characteristics characteristics that that fit fit the the bill. bill. Dicing Dicing is is possible, possible, enabling enabling a a Greater Greater range range of of workable workable molding molding methods. methods. Superior Superior heat heat resistance resistance and and light light Transmittance Transmittance make make these these materials materials ideal ideal for for encapsulation encapsulation and and die-bonding die-bonding of of LEDs, LEDs, which which must must provide provide long-lasting long-lasting reliability reliability in in harsh harsh environments. environments.

鏡片膠材
LENS LENS Materials Materials

封裝膠材
Encapsulant Encapsulant Materials Materials

灌注膠材
Potting Potting Materials Materials

散熱膠材
Thermal Thermal Interface Interface Materials Materials

固晶膠材
Die-bonding Die-bonding Materials Materials

●無溶劑型, 具有良好環境性能

SCR
Encapsulant
硬度

有機變性矽膠樹脂 Organic Group Modified Silicone

產品名稱 A液粘度 B液粘度 混合粘度 混合比例

Product Name mPa s mPa s mPa s

SCRSCR-1011
10,000 50 350 100 : 100 70℃ 1h + 150℃ 5h 1.52 70 ℃ 40 70 220 1,400 25 88

SCRSCR-1012
10,000 1,000 3,000 100 : 100

SCRSCR-1016
10,000 50 350 100 : 100

Solvent-free, so it is friendly to the environment.

Viscosity A side Viscosity B side Viscosity of mixed at 25℃ Mixing Ratio A : B

●高硬度(Shore D65以上), 可用於Dicing加工 ●具有良好的抗龜裂性

High hardness (Shore D65 or higher), dicing process can be used. Excellent crack resistance. It has both flexibility and toughness.

●高硬度且具有其柔軟性

●與各種基材具有良好的接著性
Excellent adhesion to various materials.

標準硬化條件 折射率

Standard cure condition

100℃ 1h + 150℃ 5h 1.50 75 75 72 190 1,800 55 88 1.52 70 40 70 220 1,400 25 88

●適用在手機/手提電腦等中小型背光用途
SCR-Series is suitable for Back Light of small/medium size like cellular phone/Note PC.

Refractive Index Hardness Tg Shore D

玻璃轉移點 線膨脹係數 線膨脹係數 彈性模量 抗彎強度 透光率

Linear expansion coefficient(α1) ppm Linear expansion coefficient(α2) ppm MPa N/mm2 400nm / 2mm %

Modulus of elasticity Bending strength Light transmittance

*非為規格值 Not specified values

低透氣性(鍍銀層保護、支架反射材料保護)
Low permeability to gas (Protection of silver-plated/Reflector)

鍍銀層硫化實驗 - 80度密閉環境下72小時放置
Sulfuretted test of silver-plated – Expose 80℃ hermetic environment for 72hrs

SCR SCR

苯環 苯環

甲基 甲基

●測試片: SPCC鋼板鍍銅(>1μm) 電解鍍銀(>1μm) 無表面處理劑 ●測試材料作成: 鍍銀測試片上塗上矽膠封裝材、 依所定的加熱條件進行硬化。 (膜厚:約0.1-0.5mm) ●硫磺暴露試驗: 將硫磺粉末0.3g倒入100g容積 的玻璃瓶中並放入測試片、密閉後 以80℃環境進行保存。 ●外觀觀察: 17小時後、72小時後的外觀觀察。

●Test piece specification: SPCC steel board(>1μm) Electroplating of silver(>1μm) There is no finishing agent ●Test piece making: silicone encapsulant was painted on the silver-plated test piece, heated by prescribed curing conditions. (Thickness:0.1-0.5mm) ●Test of exposure to sulfur: Put test piece in 100g glass bottle that put the sulfur powder 0.3g. After sealed up, kept it in the environment of 80℃. ●Appearance checked: After 17hrs、72hrs。

SCR
Encapsulant

耐熱變色性(105℃)
Heat resistance(105℃)
SCR-1012 105℃耐熱試驗
100 90 80 70

SCR-1016 100 90 80 70 60 50 40 30 20 10 0 0 1000

120℃耐熱試驗

透過率(%)

400nm 450nm 600nm 2000 時間(hr) 3000

透 過 率 ( % )

60 50 40 30 20 10 0 0 5,000 10,000 15,000 20,000 25,000 30,000

400nm 450nm 600nm

耐UV性(350nm)
UV resistance(350nm)
SCR-1016 350nm光照射
100

時間(h)

150℃耐熱試驗 100 透過率(%)400nm 80 60 40 20 0 0 500 1000 時間(hr) 1500 2000
SCR-1011 SCR-1012 SCR-1016
90 80 70 60 50 40 30 20 10 0 300

透過率/ %

初期 100時間 300時間
400 500 600 700 800

波長/ nm

ASP
Encapsulant
●具有良好耐熱性能
Excellent heat resistance

樹脂 Resin
產品名稱 外觀 Appearance Viscosity A side Viscosity B side Viscosity of mixed at 25℃ Mixing Ratio A : B mPa s mPa s mPa s Product Name

ASPASP-1010
無色透明 Colorlessness transparent 1,560 340 760 100 : 100 100℃ 2h + 150℃ 4h 1.56 55 73 245 45 6.2 3.4 1.0 89 *非為規格值 Not specified values

A液粘度 B液粘度 混合粘度 混合比例

標準硬化條件 折射率 硬度

Standard cure condition

Refractive Index Hardness Shore D

●高折射率 ●低透氧率

High refractive index. Low oxygen gas permeability.

線膨脹係數 線膨脹係數 延展率 抗拉強度 剪斷接著力 剪斷接著力 透光率

Linear expansion coefficient(α1) ppm Linear expansion coefficient(α2) ppm % MPa MPa

●與各種基材具有良好的接著性
Excellent adhesion to various materials.

elogation Tensile strength Tensile shear strength Al/Al

●適用在液晶TV的背光及一般照明用途
ASP-Series is suitable for TV Back Light/Generic lighting.

Tensile shear strength PPA/PPA MPa 400nm/2mm %

Light transmittance

粘度VS溫度
Viscosity VS Temperature
ASP-1010 800 粘 度(mPa?s) 600 400 200 0 0 50 溫度(℃) 100

耐熱變色性(150℃)
Heat resistance(150℃)
150℃耐熱試驗(400nm)
100 透過率(%) 80 60 40 20 0 0 500 時間(hr) 1000 1500
SCR-1011 SCR-1012 SCR-1016 ASP-1010

ASP-1010 ASP-1010 ASP-1020 ASP-1020

橡膠 Rubber
產品名稱 外觀 Appearance Viscosity A side Viscosity B side Viscosity of mixed at 25℃ Mixing Ratio A : B mPa s mPa s mPa s Product Name

ASPASP-1020
無色透明 Colorlessness transparent 1,560 170 480 100 : 100 100℃ 2h + 150℃ 4h 1.55 65 80 250 65 2.5 1.4 0.9 89 *非為規格值 Not specified values

A液粘度 B液粘度 混合粘度 混合比例

標準硬化條件 折射率 硬度

Standard cure condition

ASP
Encapsulant
Feature(Hardness) Permeability (O2 gas) (cc/m2?day) 31,000 1,700 130 210 320 Thickness (mm) 0.92 1.00 0.92 0.90 0.88 Phenyl silicone resin (Shore D 77)

Refractive Index Hardness Type A

線膨脹係數 線膨脹係數 延展率 抗拉強度 剪斷接著力 剪斷接著力 透光率

Linear expansion coefficient(α1) ppm Linear expansion coefficient(α2) ppm % MPa MPa

elogation Tensile strength Tensile shear strength Al/Al

Tensile shear strength PPA/PPA MPa 400nm/2mm %

Light transmittance

粘度VS溫度
Viscosity VS Temperature
ASP-1020 600 500 400 300 200 100 0 0 50 溫度(℃) 100

透氧率
Oxygen gas permeability (23℃) Product KER-2500 KER-2667 SCR-1011 ASP-1010 ASP-1020

粘度(mPa?s)

Methyl silicone rubber (Type A 70)

Organic group modified silicone (Shore D 70) Phenyl silicone resin ( Shore D 55 ) Phenyl silicone rubber ( Type A 65 )

KER
Encapsulant
●具備樹脂?橡膠?果凍膠的硬度產品
Can be chosen from gel to plastic like hardness.

苯環矽膠橡膠/樹脂/果凍膠 Phenyl Silicone Rubber/Resin/Gel

橡膠(Rubber)
產品名稱 A液粘度 B液粘度 混合粘度 混合比例 Product Name mPa s mPa s mPa s

KERKER-6000
4,400 2,000 2,800 100 : 100

KERKER-6075
20,000 2,000 7,500 100 : 100

Viscosity A side Viscosity B side Viscosity of mixed at 25C Mix Ratio Standard cure condition

標準硬化條件 折射率 硬度 延展率 抗拉強度 透光率

100℃ 1h + 150℃ 2h 1.51 22 % MPa 20 0.1 89 1.44 75 50 2.9 90 *非為規格值 Not specified values

Refraction Index Hardness Durometer A

elongation Tensile strength Light transmittance 400nm/2mm

%

●高折射率
High refractive index.

樹脂(Resin)
產品名稱 A液粘度 B液粘度 混合粘度 混合比例 Product Name mPa s mPa s mPa s

KERKER-2667
1,600 2,000 1,600 100 : 5 100℃ 1h + 150℃ 5h 1.53 77 ℃ ppm ppm % 50 68 190 88

KERKER-6100
3,000 2,000 2,700 100 : 5 100℃ 2h + 150℃ 4h 1.52 55 0 70 190 88

X-3232-27442744-3
8,00 8,000 3,000 40 : 60 100℃ 1h + 150℃ 3h 1.52 37 0 70 190 88

Viscosity A side Viscosity B side Viscosity of mixed at 25C Mix Ratio Standard cure condition

標準硬化條件 折射率 硬度

Refraction Index Hardness Shore D

玻璃轉移點 線膨脹係數 Linear expansion coefficient α1 線膨脹係數 Linear expansion coefficient α2 透光率 Light transmittance 400nm/2mm

*非為規格值 Not specified values

果凍膠(Gel)
產品名稱 A液粘度 B液粘度 混合粘度 混合比例 Product Name mPa s mPa s mPa s

KERKER-6200
1,500 1,300 1,400 100 : 100 50℃ 4h 1.50 30 % 95 (10mm) *非為規格值 Not specified values

Viscosity A side Viscosity B side Viscosity of mixed at 25℃ Mixing Ratio A : B

標準硬化條件 折射率 硬度 透光率

Standard cure condition

Refractive Index Hardness Cone penetration 400nm

Light transmittance

KER
Encapsulant
KER-6075 150C aging
初期 120h 300h 500h 350 450 550 650 750

耐熱性(150℃)
Heat resistance(150℃)
KER-6000 150C aging
100 80 60 40 20 0 0 2,000 4,000 6,000

100

T r a n s m it t a n c e (% )

光透過率(%)

80 60 40 20 0 250

400nm 450nm 600nm

Time (Hr)

波長(nm)

KER-6100 150C aging
100

KER-6100 120C aging
100

80 T r a n s m it t a n c e (% )

Transmittance (%)

80 60 40 20 0 0 2000 4000 6000 Time (Hr) 8000 10000 12000 400nm 450nm 600nm

60

400nm
40

450nm 600nm

20

0 0 1,000 2,000 Time (Hr) 3,000

KER
Encapsulant
●高透明, 高硬度型產品
High transparency and high hardness.

甲基矽膠橡膠/樹脂 Methyl Silicone Rubber / Resin
產品名稱 A液粘度 B液粘度 混合粘度 混合比例 Product Name mPa s mPa s mPa s

KERKER-2500
8,300 2,700 4,300 100 : 100

KERKER-2600
6,500 5,500 6,000 100 : 100 100℃ 1h + 150℃ 5h

KERKER-2700
4,800 4,000 4,400 100 : 100

Viscosity A side Viscosity B side Viscosity of mixed at 25C Mix Ratio Standard cure condition

標準硬化條件 折射率 硬度

Refraction Index Hardness Durometer A MPa MPa 400nm/2mm %

1.41 70 4.6 10 90

1.41 47 2.3 6 92

1.41 32 NA 4.1 93

彈性模量 抗拉強度 透光率

Modulus of elasticity Tensile strength Light transmittance

●高耐熱性 300nm ~ 可見光範圍內有高透光率
Excellent heat resistance and light transmissivity.

High Viscosity/Elongation Type for Injection Molding
產品名稱 A液粘度 B液粘度 混合粘度 混合比例 Product Name mPa s mPa s mPa s

*非為規格值 Not specified values

●對於金屬/塑膠(尤其是PPA)有高接著性
Excellent adhesion to metals and plastics (PPA in particular).

KERKER-2500HV
50,000 20,000 31,000 100 : 100 150℃ 1min + 150℃ 5h 70 % MPa 400 8 *非為規格值 Not specified values

●各種成型方式可
Various molding process can be used.

Viscosity A side Viscosity B side Viscosity of mixed at 25℃ Mixing Ratio A : B

硬化條件 cure condition (press cure + oven cure) 硬度 延展率 抗拉強度 Hardness Durometer A

elongation Tensile strength

Low Viscosity Type
產品名稱 A液粘度 B液粘度 混合粘度 混合比例 Product Name mPa s mPa s mPa s Viscosity A side Viscosity B side Viscosity of mixed at 25℃ Mixing Ratio A : B

KERKER-2500LV
7,300 570 1,600 100 : 100 120℃ 1h + 150℃ 5h 81 % 91 *非為規格值 Not specified values

標準硬化條件 硬度 透光率

Standard cure condition Durometer A 400nm/2mm

Hardness

Light transmittance

產品名稱 A液粘度 B液粘度 混合粘度 混合比例

Product Name mPa s mPa s mPa s

KERKER-2300 / CATCAT-ME
4,500 60 3,500 100 : 3

KERKER-2400 / CATCAT-ME2
3,800 600 3,000 100 : 3 100℃ 1h + 150℃ 5h

KERKER-2450 / CATCAT-ME3
14,000 600

Viscosity A side Viscosity B side Viscosity of mixed at 25C Mix Ratio Standard cure condition

100 : 3

標準硬化條件 折射率 硬度

Refraction Index Hardness Shore D MPa MPa 400nm/2mm %

1.42 54

1.41 31

1.41 31

彈性模量 抗拉強度 透光率

Modulus of elasticity Tensile strength Light transmittance

KER
Encapsulant

10.0 91

3.6 91

10.0 91

適用各種成型方式
Various molding process can be used.

*非為規格值 Not specified values

耐熱性(200℃)
Heat resistance(200℃)
KER-2500 200℃耐熱
100 90 80

耐UV性(350nm)
UV resistance(350nm)
KER-2500 350nm光耐久
100 90 80 光 透 過 率 ( % T)

光 透 過 率 ( % T)

70 60 50 40 30 20 10 0 250 300 350 400 450 500 550 600

200℃初期 200℃1000時間 200℃2050時間 200℃7500時間 200℃9600時間 200℃15200時間
650 700 750 800

70 60 50 40 30 20 10 0 300 350 400 450 500 550 波長(nm) 600 650 700 750 800

初期

100時間

300時間

波長(nm)

KER
Encapsulant
●接著性佳的低粘度封裝材料, 最適合半導體/ LED/太陽電池金線保護的使用
Low-viscosity encapsulant with high adhesion, making it ideal for protection of wire bonding on semiconductors, LEDs and photovoltaic cells.

半導體/LED/光波導/太陽電池金線保護
for protection of wire bonding on semiconductors, LEDs and photovoltaic cells. 產品名稱 外觀 粘度 密度 折射率 Appearance Viscosity at 25℃ Density at 25℃ Refraction Index Pot Life at 23℃ Standard cure condition Durometer A ppm % MPa 400nm/2mm % mPa s g/cm3 Product Name

KERKER-6020F
乳白色半透明 Creamy white translucent 33,000 1.05 1.43 48h < 100℃ 1h + 150℃ 3h 21 400 (-100~100℃) 180 0.8 76 *非為規格值 Not specified values

可使用時間 標準硬化條件 硬度

Hardness

線膨脹係數 Linear expansion coefficient 延展率 抗拉強度 透光率 elogation Tensile strength Light transmittance

●加熱時不會坍塌, 保持原形狀
Won’t spread during heat-cure process, so it retains its shape.

KER-6020F透過率 100 90 80 70 透過率(%) 60 50 40 30 20 10 0 300 350 400 450 500 550 波長(nm) 600 650 700 750 800

屏障材(Dam Material)
產品名稱 外觀 Appearance Standard cure condition Durometer A g/cm MPa %
3

Product Name

KERKER-20002000-DAM
白色膏狀 White Paste 120℃ 1h 55 1.10 2.0 (Epoxy glass) 100

Others Materials

標準硬化條件 硬度 密度

Hardness Density

拉斷強度 凝集破壞率

Lap shear strength Cohesion destruction rate

KER

*非為規格值 Not specified values

離模劑(Fluoro silicone release agent)
產品名稱 外觀 Appearance Product Name

X-7070-1601
無色~淡黃色透明液體 Light yellow transparent liquid 1.0 % (105℃ 3h) 1.11 m-Xylenehexafluoride 150℃ 30min 噴灑 塗刷 擦拭等的方式均可, 以形成均一薄膜為最佳化. Spray, brushing, wiping can be used. Coat it uniformly.

有效成分 比重 溶媒 Specific gravity at 25℃ Solvent Curing condition Coating method

硬化條件 塗抹方式

*非為規格值 Not specified values

KER
Die -Bonding Die-Bonding
●不變色
Low discoloration possibility.

透明絕緣膠
Insulation (Translucent) 產品名稱 外觀 粘度 Appearance Viscosity Standard cure condition Pa s Product Name

KERKER-30003000-M2
Translucent 40 100℃ 1h 150℃ 2h 1.13 56 μm W/mK mm2K/W TΩm 4 0.2 14.8 100 3.9

X-3232-2551
Translucent 18 100℃ 1h 150℃ 2h 1.15 54 4 0.2 16.0 100 3.8

X-3232-3024
Translucent 13 100℃ 1h 150℃ 5h 1.14 59 4 0.2 15.4 100 3.9

標準硬化條件 比重 硬度 厚度 熱傳導 熱阻

Specific gravity Hardness Shore D

Bond line thickness Thermal conductivity Thermal resistance Volume resistivity

體積抵抗

●在廣範圍溫度內能維持其安定性
Good mechanical & adhesion property in wide temperature range.

剪斷接著力 Tensile shear strength Al/Al 接著面積5x25mm 厚度0.1mm MPa

絕緣散熱膠/絕緣白膠
High thermal conductivity & Low thermal resistance (White) 產品名稱 外觀 粘度 Appearance Viscosity Standard cure condition Pa s Product Name

*非為規格值 Not specified values

KERKER-32003200-T1
White 20 100℃ 1h 150℃ 2h 2.54 71 μm W/mK mm2K/W TΩm 5 0.6 8.0 20 3.6 g 2,000

KERKER-31003100-U2
White 20 100℃ 1h 150℃ 2h 2.04 70 20 0.6 35.7 12 3.8 2,000 *非為規格值 Not specified values

加熱時膠體流動抑制
The flow is suppressed when heating

標準硬化條件 比重 硬度 厚度 熱傳導 熱阻

Specific gravity Hardness Shore D

Bond line thickness Thermal conductivity Thermal resistance Volume resistivity

體積抵抗

60°角度傾斜 150℃加熱
60°angle incline 150℃ heating

剪斷接著力 Tensile shear strength Al/Al 接著面積5x25mm 厚度0.1mm MPa 接著強度 Die shear strength Si/Ag

導電銀膠
Ag Paste (Polyimide silicone) 產品名稱 外觀 粘度 Appearance Viscosity Standard cure condition Pa s Product Name

SMPSMP-2800
Gray 40

SMPSMP-2800L
Gray 5

標準硬化條件 比重 熱傳導 熱阻 抵抗

150℃ 3h or 180℃ 1h 5.64 W/mK mm2 ?℃/W Ω?cm MPa g % 1.0 27 (thickness 27 μm) 5.1 x 10-5 4.0 2,800 Approx. 46 (by volume) Approx. 13 (by weight) *非為規格值 Not specified values

Specific gravity Thermal conductivity Thermal resistance Resistivity

SMP
Die -Bonding Die-Bonding
Die-Bonding silicone base polymer 150C aging
80 60 40 20 0 0 5000 10000 Time (hr) 15000 20000

剪斷接著力 Tensile shear strength 接著強度 Die shear strength 揮發份 Volatile content Si/Ag

180℃/60min

KER-3000-M2熱時接著強度變化
Die shear strength when heating
4000 3500 3000 Die share (g) 2500 2000 1500 1000 500 0 Max Min Ave 24℃ 3390 1900 2490 100℃ 3160 1810 2640 150℃ 2700 1600 2050 200℃ 3020 1020 2050
Transmittance (%) 100

耐熱性(150℃)
Heat resistance(150℃)

600nm 500nm 400nm

Lens Materials
●高透明 / 高硬度 (Shore D51~77)
High transparency / High hardness.

產品名稱 類型 Categories Mix ratio

Product Name

SCRSCR-5001L
Modified Silicone 100 : 100 mPa s mPa s mPa s 10,000 5,000 7,000 1.532 1.523 1.520 43

X-3232-2712
Phenyl Resin 100 : 5 18,000 2,000 12,000 1.538 1.527 1.522 34 77 NA 40~50 90 190 1,200 88.1 90.3 91.7

X-3232-2897
Methyl Resin 100 : 3 26,000 60 14,000 1.421 1.416 1.413 51 51 NA < -100 Na 220 250 93.9 94.3 94.5

X-3232-2557
Methyl Rubber 100 : 100 210,000 26,000 60,000 1.414 1.409 1.407 54 NA 83 -40 Na 280 50 > 92.0 92.3 93.1

混合比例 A液粘度 B液粘度 混合粘度

Viscosity A side Viscosity B side Viscosity of mixed at 25℃

486nm 折射率 Refractive Index 589nm 656nm ABBE Number 硬度 硬度 Hardness Hardness Tg Shore D Durometer A ℃

●高Reflow耐熱性
Excellent reflow heat resistance.

●射出成型方式可
Injection molding process can be used.

77 NA 88 75 200 2,000 89.2 90.0 90.7

玻璃轉移點 線膨脹係數 線膨脹係數 彎曲彈性

Linear expansion coefficient(α1) ppm Linear expansion coefficient(α2) ppm Flextural modulus at 25℃ 400nm MPa

透光率

Transmittance

%

450nm 600nm

*非為規格值 Not specified values

回焊爐測試( 260℃ 9min)
Reflow test (260℃ 9min)

SCR-5001L-A/B Reflow Test
100 Transmittance(%) 80 60 init. 40 20 0 300 400 500 600 700 800 Wave length (nm) 260℃×3min.×1回 260℃×3min.×2回 260℃×3min.×3回

Lens Materials

高溫高濕測試( 85℃/85%RH)
High Temp. / Humidity test (85℃/85%RH)

耐熱性(150℃)
Heat resistance(150℃)

X-32-2712 High Temp./Humidity Test
100

X-32-2897 Transmittance after 150℃ aging
100 Transm ittance % 80 60 40 20 0 0h 9600h

Transm ittanc e( % )

80 60 40 20 初期 2024h

0 250 300 350 400 450 500 550 600 650 700 750 800

250 300 350 400 450 500 550 600 650 700 750 800 Wave length nm

非填滿

LED模組
Assembly
填滿

射出成型燈條

散熱膠

防潮批覆膠 (半)透明灌注膠 灌注非透明膠

非填滿灌注非透明膠
Heat cure coating type only for electrodes & substrate

加熱成型燈條
Heat cure molding type

填滿灌注透明膠
Heat cure entire potting type

非填滿防潮批覆膠
Coating type only for electrodes & substrate

Coating Coating only only for for electrodes electrodes & & substrate substrate
A膠外觀 B膠外觀 C膠外觀 A膠粘度 B膠粘度 混合粘度

KE

Potting

非填滿灌注加熱硬化型
產品名稱 Appearance Appearance Appearance Product Name A side B side C side Pa s Pa s Pa s hr

Heat cure coating type only for electrodes & substrate

KEKE-1283A/B
Black Milky-white NA 2.8 1.6 1.7 8 100 : 100

KEKE-1283 A/B/C
Black Milky-white White powder 2.8 1.6 1.7 8 100 : 100 : 3 80℃ 2h

KEKE-1284A/B
Black Milky-white NA 1.2 0.7 0.8 12 100 : 100

Viscosity A side at 25℃ Viscosity B side at 25℃ Viscosity of mixed at 25℃ Pot life at 23℃

●用於電氣電子產品 用於電氣電子產品的灌注
MoistureMoisture-proof for electronics and electric parts.

可使用時間 混合比例

Mixing ratio Standard cure condition Asker C % UL-94

●以加熱的方式進行短時間硬化, 以加熱的方式進行短時間硬化, 對各種附著體有良好 接著性的霧化液態橡膠
It can be cured in a short period, and shows good adhesion property with various substrates.

標準硬化條件 硬度 延展率 耐燃性

Hardness

10 440 V-1

11 300 V-1

20 320 V-0

Elongation Flame class

●另有室溫快速硬化品KE -231(F) 另有室溫快速硬化品KEBesides, we have room temperature cure type product KEKE-231(F).

非填滿灌注室溫硬化型
產品名稱 外觀 Appearance Viscosity A side at 25℃ Viscosity B side at 25℃ Viscosity of mixed at 25℃ Flow stop Pot life at 23℃ Standard cure condition Asker C % MPa PC/PC MPa Pa s Pa s Pa s hr/10mm hr Product Name

*非為規格值 Not specified values

Room temperature coating type only for electrodes & substrate

KEKE-231F231F-A/FA/F-B
Black 2.8 2.7 2.8 2 0.5

KEKE-231231-A/A/-B
Black 2.9 2.7 2.8 5 1.5

A膠粘度 B膠粘度 混合粘度

停止流動時間 可使用時間 標準硬化條件 硬度 延展率 拉斷強度

23℃ 50%RH X 3hr 32 190 0.3 0.2 0.2 27 200 0.3 0.2 0.2 *非為規格值 Not specified values

Hardness

Elongation Lap shear strength

剪斷接著力 Tensile shear strength

剪斷接著力 Tensile shear strength Epoxy/Epoxy

非填滿防潮批覆膠
產品名稱 型態 外觀 粘度 Type Appearance Viscosity Tack free time Shore A Product Name

Coating type only for electrodes & substrate

Moisture Proof Coating
KEKE-49204920-T
無色透明~淡黃微濁 Pa s min 1.5 7 25 % MPa g/cm TΩm kV 50Hz 50Hz %
3

KEKE-49204920-W?B
白?黑 4.0 7 27 150 0.5 1.00 12 23 3.0 0.001 0.1% > ○ *非為規格值 Not specified values

Coating Coating only only for for electrodes electrodes & & substrate substrate

Condensation (alcohol)

表乾時間 硬度 延展率 拉斷強度 密度

Hardness

Elongation Lap shear strength

150 0.5 0.98 12 23 3.0 0.001 0.1% > ○ -

KE
Pa s min %

Density Volume resistivity Dielectric breakdown strength

體積抵抗

絕緣破壞強度 誘電率 誘電正接 吸水率

Dielectric constant Dielectric factor Water absorption ※

低分子矽氧烷對策 溶劑 Solvent

Low-molecular-weight siloxane ※※

產品名稱 型態 外觀 粘度 Type Appearance Viscosity Tack free time

Product Name

KEKE-48954895-T?W
半透明?白 Pa s min 5.0 11 40 % MPa g/cm TΩm kV 50Hz 50Hz %
3

KEKE-48964896-T?W
半透明?白 50.0 11 38 170 1.6 1.03 50 20 2.8 0.001 0.1% > ○ 型態 外觀 粘度 Type Appearance Viscosity Tack free time Solvent (Nonvolatile content) 產品名稱 Product Name 硬化條件 : 23℃ 2mm) 23℃/50%RHX7days(厚度 /50%RHX7days(厚度2mm) ※ 測定樣品厚度 : 1mm ※※ 低分子矽氧烷 : ΣD3 ~ D10 ; 300ppm以下 300ppm以下

Condensation (alcohol)

表乾時間 硬度 延展率 拉斷強度 密度

Hardness

Shore A

Elongation Lap shear strength

140 1.5 1.02 90 20 2.8 0.001 0.1% > ○ -

Density Volume resistivity Dielectric breakdown strength

KRKR-114A
Wax Resin 無色透明~淡黃微濁 1.0 20 Ligroin (50%)

體積抵抗

絕緣破壞強度 誘電率 誘電正接 吸水率

Dielectric constant Dielectric factor Water absorption ※

表乾時間

低分子矽氧烷對策 溶劑 Solvent

Low-molecular-weight siloxane ※※

溶劑(不揮發分)

*非為規格值 Not specified values

KE
Entire Entire Potting Potting

Potting

填滿加熱硬化型
Heat cure entire potting type 產品名稱 外觀 折射率 混合粘度 Appearance Refractive Index Viscosity of mixed at 25℃ Pot life at 23℃ Pa s hr Product Name

KEKE-109E
Transparent 1.41 1 8 0.97 1 : 1 80℃ 3hr or 60℃ 5hr A25 % TΩm kV 50Hz 50Hz 150 5 24 2.9 7X10-4 92
Primer X-33-197

KEKE-1031
Transparent 1.41 0.8 4 0.97 1 : 1 80℃ 2hr A20 150 2 20 3.1 1X10-3 92
Primer X-33-197

KEKE-1051J
Transparent 1.41 0.8 2 0.97 1 : 1 23℃ 24hr 65(penetration) NA 10 NA 2.9 6X10-4 92 密著 Adhesion 密著 Adhesion 密著 Adhesion 密著 Adhesion

可使用時間 比重

Specific gravity Mixing ratio Standard cure condition

混合比例

標準硬化條件 硬度 延展率 體積抵抗

Hardness Elongation Volume resistivity

絕緣破壞強度 誘電率 誘電正接 透光率

Dielectric breakdown strength

Dielectric constant Dielectric factor Light transmittance 400nm/2mm

%

與PC接著 Adhesion with PC 與PCB接著 Adhesion with PCB 與FPC接著 Adhesion with FPC 與Aluminum接著 Adhesion with Aluminum

Primer No.4 Primer No.4

○ ○

*非為規格值 Not specified values

助接著劑
Primer

●Primer X-33-197 對於PC及壓克力材料無接著力, 事先塗上Primer X-33-197後再進行灌注
It doesn‘t adhere to Polycarbonate & Acryl case, please potting after coating primer.

●Primer No.4 對於PCB及金屬材料, 建議使用Primer No.4
For PCB & Metallic materials, Primer No.4 is recommended.

加熱模具成型
Heat cure molding type 產品名稱 外觀 Appearance Viscosity A side at 25℃ Viscosity B side at 25℃ Viscosity of mixed at 25℃ Pot life at 23℃ Pa s Pa s Pa s hr Product Name

KEKE-1286T
Milk-white (Translucent) 22 39 35 8 1 1 : 1 80℃ 3hr A27 % TΩm kV 50Hz 50Hz 300 5 24 2.9 7X10
-4

KEKE-1286W
White 22 39 35 8 1 1 : 1

Molding Type

A膠粘度 B膠粘度 混合粘度

可使用時間 比重

Specific gravity Mixing ratio Standard cure condition Type A

混合比例

KE

標準硬化條件 硬度 延展率 體積抵抗

Hardness

A27 300 5 24 2.9 7X10-4 NA ○ ○ *非為規格值 Not specified values

Elongation Volume resistivity

絕緣破壞強度 誘電率 誘電正接 透光率

Dielectric breakdown strength

Dielectric constant Dielectric factor Light transmittance 400nm/2mm

%

Straight 70% All light 50% ○ ○

與PCB接著 Adhesion with PCB 與FPC接著 Adhesion with FPC

散熱RTV膠
產品名稱 型態 外觀 Type Appearance

Thermal interface RTV material Product Name

KEKE-1867
Heat cure Gray Pa s 60 120℃ 1hr min 75 W/m?K UL-94 2.5 V-0 (Feature) -

KEKE-3466
Room temperature cure White 50 7 88 1.9 V-1 Aceton

KEKE-3467
Room temperature cure White 100 4 91 2.4 V-0 Aceton *非為規格值 Not specified values

混合粘度

Viscosity of mixed at 25℃ Standard cure condition

標準硬化條件 表乾時間 硬度

Tack free Type A

Hardness

熱傳導率 Thermal conductivity 耐燃性 硬化型態 Flame class Cure system

包裝 Package
Product Name SCR-1011 ( A / B ) SCR-1012 ( A / B ) SCR-1016 ( A / B ) ASP-1010 ( A / B ) ASP-1012 ( A / B ) KER-6000 ( A / B ) KER-6050 ( A / B ) KER-2667A KER-2667B KER-6100 CAT-PH X-32-2744-3A X-32-2744-3B X-32-2578 ( A / B ) KER-2500 ( A / B ) KER-2500LV ( A / B ) KER-2600 ( A / B ) KER-2700 ( A / B ) KER-2300 CAT-ME KER-2400 CAT-ME2 KER-2450 CAT-ME3 X-32-2712 CAT-PH X-32-2897 CAT-ME SCR-5001L ( A / B ) Product Name KE-1283 ( A / B ) KE-1283C KE-1284 ( A / B ) KE-231 ( A / B ) KE-231F ( A / B ) KE-109E ( A / B ) KE-1031 ( A / B ) KE-1051J ( A / B ) KE-1286T ( A / B ) KE-1286W ( A / B ) KER-2500HV ( A / B ) X-70-1601 1kg Plastic bottle ● ● ● ● ● ● ● ● ● ● 40g glass bottle 60g glass bottle ● ● ● ● ● ● ● ● ● ● ● ● ● ● ● 1KG Circle can ● ● ● ● ● ● ● ● ● ●square can 9KG Pail can ● ● ● ● ● ● ● ● ● ● ● 16KG Pail can 18KG Pail can ● ● ● ● ● ● 100g Glass bottle 270g Circle can 540g Circle can 30g Glass bottle 50g Glass bottle Product Name KER-3000-M2 KER-3100-U2 KER-3200-T1 KER-2000-DAM ● SMP-2800 SMP-2800L KER-6020F ● 10cc Syringe ● ● ● ● ● ● 30g Syringe 20g Plastic bottle

Product Name KE-4920 ( T / B / W ) KE-4895 ( T / W ) KE-4896 ( T / W ) KE-1867 KE-3466 KE-3467

100g Tube ● ● ● ● ● ●

330ml Cartridge ● ● ●

1KG Can

● ● ●

*另有樣品包裝方式
There is a sample style of packing separately.

硬化阻礙 Cure inhibition
(1)在使用Silicone系的固晶材及封裝材時、必須要充分了解硬 化阻害。 (2)硬化不良的原因 a. 白金觸媒會與某些化合物形成錯體, 阻礙觸媒作用。 b. 混入可能與架橋材產生反應的成分、架橋材被消耗掉。 (3)觸媒毒物質 a. 有含N,P,S等有機化合物 b. Sn,Pb、Hg、Sb、Bi、As等重金屬的離子(ion)性化合物 c. 含有乙炔基(acetylene)等不飽和基的有機化合物 (4)與硬化劑產生反應可能的成分 a. Alcohol、水 b. 有機酸 (5)具体例 ?有機rubber:硫磺rubber 抗老化劑etc(例如 手套) ?epoxy、尿烷樹脂:胺系、異氰酸酯系硬化劑 ?縮合型silicone RTV Rubber:特別是Sn系觸媒使用 ?軟質氯乙烯:可塑劑、安定劑 ?助焊劑 ?工程塑膠:難燃劑、耐熱提昇劑、紫外線吸收劑 etc ?鍍銀、鍍金表面(製造時電鍍液為主要原因) ★有触媒毒反應時 ?經標準硬化時間烘烤後也不會達到所定的硬度 ?有硬化但界面不硬化(能輕易的剝離、產生絲狀) ?有硬化但無接著性(在TCT試驗中發生剝離現象、但依據不 同的LED Package形狀、即使是充分的接著也有可能發生) ?硬化厚度層較薄時不易硬化(特別是固晶材、有可能因微量 的触媒毒產生影響。接著層的厚度因為薄的關係, Dicing Sheet 的粘著劑必須加以檢查) ?在開放狀態下能硬化,但使用製造冶具等在密閉狀態下不會硬化 ★與硬化劑(架橋材)反應成分存在的場合 ?發生極小氣泡(並非被捲入的氣泡) ?界面有氣泡 ●保持塗抹表面在清潔的狀態。使用乙醇(ethanol)、IPA、 己烷、甲苯等的溶媒清洗。 ●進行以氬氣(Argon)的Plasma處理(Die-Bonding前及WireBonding前) ●使用促進接著的Primer的話也有清潔效果。 ●混合材料時使用金屬或是塑膠製的刮刀。 ●確認Rubber或是木材的刮刀不會產生硬化阻礙後再使用。 ●使用手套的場合、不要使用Rubber製、使用聚乙烯製的手套。 ●基板等Silicone有接觸的部材不要用Rubber手套去碰觸。 ●請確實清潔當有使用硬化阻礙的成份的產線後再使用。 ●使用烤箱前先以高溫空烤、以除去產生付加毒之成分。 ●請預先確認使用之材料是否可能含有產生硬化阻礙害的成份。 ●較理想的是設置Silicone專用的產線。 ●經常使用新的晶片、經過長期保存及高溫曝曬下, 晶片的Blue Tape的粘著劑容易移到晶片表面、盡量避免使用。 ■LED用的Silicone本身具有優越的接著力。但因硬化阻害而造 成接著力降低 為首推的現象。這是在環氧樹脂(Epoxy)使用上並沒有的現象。 ■因此、第一次評估後若有剝離等的接著性問題發生的場合、 請懷疑它是否產生了硬化阻害並依據下列的2點方法加以驗證。 〔1〕比通常的推薦硬化溫度再加熱到200℃前後的熱處理。 〔2〕以氬氣(Argon Gas)的Plasma洗淨或是以酒精等的溶劑 用超音波洗淨方式加以充分洗淨之後、再進行固晶及封 裝、再與初期的評估進行比較。 ■若有明顯的差的話、應該是有受到微弱的硬化阻害反應。 ■電鍍的變更及Package的洗淨等、針對產線應用進行必要的對 策檢討。
What’s the cure inhibition and How to prevent this issue when you use Pt catalyst type of silicone product. How the cure inhibition happens. ?Pt catalyst makes a complex with other compounds. Then the compound doesn’t have catalyst ability. ?Cross linker (Hydrogen Polysiloxane) in this silicone products is consumed by contamination that can react with cross linker. What kind of compounds happen cure inhibition. ?“Catalyst poison” compound ?Organic compounds that have N, P or S atoms. (Inhibitor strength is depend upon products. Some of the compounds don’t show any inhibition even it have N, P and/or S atoms.) ?Ionic compounds that consist from heavy metals, like Sn, Pb, Hg, Sb, Bi or As atom. ?Organic compounds that have acetylene group. ?The compounds consume cross linker (They can react with cross linker) ?Alcohol and Water ?Organic acid What show cure inhibition. ?Organic rubber: Sulfur cross linking rubber, Aging agents (Rubber gloves) ?Epoxy resin, Urethane resin: Amine cure type, Isocyanate cross linker ?Condensation cure silicone RTV: Tin (Sn) compound catalyst type. ?Soft Poly Vinyl Chloride (PVC): Plasticizers, Aging agents. ?Solder flux ?Engineering Plastic: Flame retardants, Heat stabilizers, UV absorbers etc. ?Adhesive tape, Wafer sheets: tackifiers on films ?Gold platting circuit board: Gold makes eutectic with Pt catalyst. Especially in thin layer application sometimes it is shown. What phenomenon is caused when cure inhibition occur. ?With “Catalyst Poison” ?The hardness doesn’t reach to data sheet value even exposed standard cure profile. ?Only the surface of silicone products doesn’t cure. (Easy peeling off, hard tackiness) ?Only in a thin film application the products don’t cure. ?Only in a close system application doesn’t cure. (It can cure in open condition.) ?With contaminations that can react with cross linker. ?The micro bubbles appear in all of products. ?The micro bubbles appear between the surfaces. How to prevent cure inhibition issue. ?Clean up the surface with solvent, like Ethanol, IPA, Hexane and Toluene before applied silicone products. The primer, that has ability to promote adhesion, can use as a solvent. ?Use a metal or plastic spatula for mixing. If you need to use a rubber or wooden spatula, you need checking it doesn’t show cure inhibition. ?Use plastic gloves, like Poly Ethylene one, instead of rubber. If you need to use rubber type, please check it doesn’t have cure inhibition. If the gloves have inhibitor, do not touch silicone products and surface of the area where is silicones on. ?Before changing line from other products (ex Epoxy resin) to silicones, please clean up carefully. ?Before using cure oven make temperature rises up to maximum (Over 250C) and burn organic compounds on the wall perfectly. ?Please check the parts that are used for applications whether they don’t have inhibitors before mass production. ?Ideally new one line is used for silicone exclusively. Other caution ?When using refrigerated products, please wait the temperature backs to room temperature. It avoids water contamination by dews. ?When using a dispense equipment, do not push silicone material by air pressure directly. Silicone can solve air inside, especially CO2. It is a possibility to make voids during cure.

18

信越化學工業株式會社
有機硅事業本部 營業第四部 地址 東京都千代田區大手町2-6-1朝日生命大手盯東海大樓 電話 : +81-(0)-3-3246-5153 傳真 : +81-(0)-3-3246-5365

Shin-Etsu Chemical Co., Ltd.
Silicone Division, Sales and Marketing Department 4 6-1, Otemachi 2-chome, Chiyoda-ku, Tokyo, Japan Phone: +81-(0)-3-3246-5153 Fax: +81-(0)-3-3246-5365

http://www.silicone.jp/

台灣信越矽利光股份有限公司
地址 台北市松山區敦化北路167號11樓D室(宏國大樓) 電話 : +886-(0)-2-2715-0055 傳真 : +886-(0)-2-2715-0066

Shin-Etsu Silicone Taiwan Co., Ltd.
Hung Kuo Bldg. 11F-D, NO.167, Tun Hua N. Rd., Taipei, 10549 Taiwan R.O.C. Phone: +886-(0)-2-2715-0055 Fax: +886-(0)-2-2715-0066

http://www.shinetsu.com.tw

信越有機硅國際貿易(上海)有限公司
地址 上海市徐匯區肇家濱路789號均瑤國際廣場29樓 電話 : +86-(0)-21-6443-5550 傳真 : +86-(0)-21-6443-5868

Shin-Etsu Silicone International Trading (Shanghai) Co., Ltd.
29F Junyao International Plaza,No.789,Zhao Jia Bang Road Shanghai 200320 Phone: +86-(0)-21-6443-5550 Fax: +86-(0)-21-6443-5868

http://www.shinetsu.com.cn


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